Wafer Level Package For Image Sensor Module

• doi: 10.1109/DTIP.2008.4752984
• title: Wafer level package for image sensor module
• publisher: IEEE
• isbn: 978-2-35500-006-5
• issn:
• partnum: 08EX2209
• rank: 3990
• access_type: LOCKED
• content_type: Conferences
• abstract: A new ISM (image sensor module) WLP (wafer level package) for reflow process is designed, fabricated and tested. The ISM WLP is composed of polymer bonding layer, glass cap wafer for particle free process and CIS (CMOS Image Sensor) chip wafer which has micro via hole interconnection. During the last decades, WLP is highlighted as the next generation ISM Package method for many advantages like high yield (particle free process), small form factor (3D interconnection), low assembly cost and so on. Nevertheless these benefits, there are some problems like micro via hole fabrication, low temperature insulation process (inside hole), bottom side oxide etching, warpage control according to wafer level bonding using different material, and whole process temperature limitation for micro lens damage. Among various fabrication methods for ISM package, COB (Chip on board), COF (Chip on film), and L, T contact WLP from ShellCase are generally used. In case of COB and COF package, it has difficulty in particle control during assembly process. In case of ShellCase type WLP has very complicated fabrication process. Additionally, most of above package has disadvantage in size point of view. Through suggested ISM WLP using through interconnection via, wafer level fabrication & packaging technology is realized. It can not only solve problems of conventional packaging structures but also tremendously reduce the manufacturing & assembly cost (include time) of ISM package and realize real chip scale package. Based on sensor size, 3.67 × 3.42 × 0.39 (H) mm3 WLP is designed. During the parametric study using commercial 3-D simulation programs, silicon thickness, polymer bonding layer thickness, and glass thickness were chose the effective factor. And considering the optical and electrical analysis, we decide the parameter: silicon thickness is 0.1mm, polymer bonding layer thickness is 0.04mm, and glass thickness is 0.25mm. The fabrication process is composed bonding layer patterning, wafer bonding, thinning, via etching, passivation layer deposition, bottom oxide opening, metal plating, bottom electrode patterning, solder ball formation, and dicing. A new concept of ISM WLP has been founded to be suitable structure for low cost, small form factor application.
• article_number: 4752984
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4752984
• html_url: https://ieeexplore.ieee.org/document/4752984/
• abstract_url: https://ieeexplore.ieee.org/document/4752984/
• publication_title: 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
• conference_location: Nice, France
• conference_dates: 9-11 April 2008
• publication_number: 4731228
• is_number: 4752931
• publication_year: 2008
• publication_date: 9-11 April 2008
• start_page: 201
• end_page: 206
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 764
• insert_date: 20090119
• index_terms:
  • ieee_terms:
    • Wafer scale integration
    • Image sensors
    • Wafer bonding
    • Fabrication
    • Glass
    • Assembly
    • Costs
    • Chip scale packaging
    • Polymers
    • Etching
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Wafer Level
    • Wafer-level Packaging
    • Low Cost
    • Etching
    • Fabrication Process
    • Assembly Process
    • Aggregation Process
    • Passivation Layer
    • Surface Passivation
    • Metal Plate
    • 3D Simulation
    • Sensor Size
    • Thick Glass
    • Packaging Technology
    • Small Form Factor
    • Microlenses
    • Micro Lens
    • Optimization Process
    • Shear Stress
    • Shear Strength
    • Central Portion
    • Etching Process
    • Low-temperature Process
    • Glass Wafer
    • Scallop
    • Pyrex Glass
    • Copper Plate
    • Etching Rate
    • Center Edge
• isbn_formats:
  • format: Print ISBN, value: 978-2-35500-006-5, isbnType: New-2005
• authors:
  • Author Name: Won Kyu Jeung
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087828168
    ID: 37087828168
    Order: 1
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Chang Hyun Lim
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087528481
    ID: 37087528481
    Order: 2
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Jingli Yuan
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087826981
    ID: 37087826981
    Order: 3
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Seung Wook Park
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37657117600
    ID: 37657117600
    Order: 4
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea

Image Sensor

• sensor_type: CMOS
• resolution: 3.67x3.42 mm
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: The paper discusses applications for low-cost, compact CMOS image sensor modules suitable for mobile phones and other devices.
• benefits: Advantages include low production costs, small package size, and capability for reflowable assembly.

Supporting Organizations

• supported_by: Samsung Electro-Mechanics Co., LTD.

Manuscript Details

• publication_date: 9-11 April 2008

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • ADC techniques
  • microlenses
  • on-chip colour filters
  • global shutter
  • rolling shutter

Processed JSON Filename

request_d8ef09aa-9642-4b53-8c9c-fa12a04db2bf-wafer_level_package_for_image_sensor_module.json