Uncooled Microbolometer Infrared Focal Plane Array Without Substrate Temperature Stabilization

• doi: 10.1109/JSEN.2014.2298512
• title: Uncooled Microbolometer Infrared Focal Plane Array Without Substrate Temperature Stabilization
• publisher: IEEE
• isbn:
• issn: 2379-9153
• rank: 3935
• access_type: LOCKED
• content_type: Journals
• abstract: This paper presents a novel and compact compensation architecture for uncooled microbolometers without substrate temperature stabilization. The substrate temperature-induced nonuniformity and nonlinear resistance characteristics of the microbolometer array elements are investigated in detail. We propose an analytical model to identify the main nonideal effects and dispersion sources caused by the substrate temperature and their respective impacts on the uncooled microbolometers array. This proposed compensation approach is based on a differential current mirror readout architecture, which allows pixel response and offset correction to be performed as a function of the uncooled infrared focal plane array (IRFPA) sensor's operating temperature. An experimental FPA chip based on this approach has been designed and implemented on silicon using a 0.5- μm CMOS technology and surface micromachining process. The proposed architecture allows the microbolometer array nonuniformity control over a wider range of readout integrated circuits substrate temperatures while maintaining better than 63-mK noise equivalent temperature difference with f/1 optics. As a result of the elimination of the temperature stabilization requirement, the IRFPA turn-on time for high performance imaging can be greatly reduced. Power, volume, and weight of the IRFPA are also significantly reduced. This approach is ideally suited for high-volume, low-cost, low-power, and low-weight production applications.
• article_number: 6704820
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6704820
• html_url: https://ieeexplore.ieee.org/document/6704820/
• abstract_url: https://ieeexplore.ieee.org/document/6704820/
• publication_title: IEEE Sensors Journal
• conference_location:
• conference_dates:
• publication_number: 7361
• is_number: 6766215
• publication_year: 2014
• publication_date: May 2014
• start_page: 1533
• end_page: 1544
• citing_paper_count: 38
• citing_patent_count: 0
• download_count: 1988
• insert_date: 20140109
• index_terms:
  • ieee_terms:
    • Substrates
    • Temperature
    • Temperature sensors
    • Bolometers
    • Resistance
    • Temperature measurement
    • Heating
  • author_terms:
    • Microbolometer
    • substrate temperature compensation
    • readout integrated circuit
    • uniformity
    • noise equivalent temperature difference (NETD)
  • dynamic_index_terms:
    • Substrate Temperature
    • Uncooled Microbolometer
    • Characteristics Of Elements
    • Feature Elements
    • CMOS Technology
    • Equivalent Temperature
    • Compact Architecture
    • Impedance
    • Resistivity
    • Temperature Changes
    • Thermal Conductivity
    • Heat Conduction
    • Heat Capacity
    • Specific Heat
    • Function Of Temperature
    • Bias Voltage
    • Bottom Of Page
    • Drawback Of This Method
    • Drawbacks Of Methods
    • Drawback Of These Methods
    • Emissivity
    • Arrhenius Plot
    • Arrhenius Relationship
    • Bias Current
    • Effective Thermal Conductivity
    • External Bias
    • Temperature Coefficient Of Resistance
    • Bolometer
    • Readout Circuit
    • Conductivity Of Gas
    • Gaseous Conduction
    • Conventional Circuit
    • DC Level
    • Clock Signal
    • Saturation Region
    • DC Bias
    • Biased Signaling
    • Signaling Bias
    • AC Bias
• authors:
  • Author Name: Jian Lv
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/38084025600
    ID: 38084025600
    Order: 1
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
  • Author Name: Longcheng Que
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/37086625147
    ID: 37086625147
    Order: 2
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
  • Author Name: Linhai Wei
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/37086623881
    ID: 37086623881
    Order: 3
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
  • Author Name: Yun Zhou
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/38021214700
    ID: 38021214700
    Order: 4
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
  • Author Name: Baobin Liao
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/38235547800
    ID: 38235547800
    Order: 5
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
  • Author Name: Yadong Jiang
    Affiliation: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China
    Author URL: https://ieeexplore.ieee.org/author/37292011700
    ID: 37292011700
    Order: 6
    Author Affiliations:
    • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Film and Integrated Devices, Chengdu, China

Image Sensor

• sensor_type: CMOS
• resolution: 640x512
• dynamic_range: 20%
• pixel_size: 25 µm
• dark_current: N/A

Optical Data

• focal_length: f/1.0
• aperture: f/1.0
• field_of_view: N/A
• distortion: N/A

Performance Metrics

• frame_rate: 30 fps
• signal_to_noise_ratio: N/A
• sensitivity: N/A
• shutter_speed: N/A
• power_consumption: N/A
• noise: N/A

Applications & Benefits

• cell_imaging: The sensor is suitable for thermal imaging applications including medical imaging, thermography, night vision, firefighting, surveillance, predictive maintenance, and industrial process control.
• benefits: Compact, low-cost, low-power, and low-weight production applications with improved dynamic range.

Supporting Organizations

• supported_by: University of Electronic Science and Technology of China

Manuscript Details

• publication_date: May 2014

Relevancy Score

• score: 7
• missing_fields:
  • signal to noise ratio
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global shutter
  • rolling shutter
  • backside illumination

Processed JSON Filename

request_3d67f0ea-ca74-43b6-a7b3-c9cedcf7f750-uncooled_microbolometer_infrared_focal_plane_array_without_substrate_temperature_stabilization.json