Ultrathin Image Sensor Chip Embeded Foil

• doi: 10.1109/FLEPS51544.2021.9469747
• title: Ultra-thin Image Sensor Chip Embeded Foil
• publisher: IEEE
• isbn: 978-1-7281-9174-4
• issn:
• rank: 3926
• access_type: LOCKED
• content_type: Conferences
• abstract: Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. This paper focuses on the embedding and characterization of a bendable ultra-thin image sensor in flexible polymer foil.
• article_number: 9469747
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9469747
• html_url: https://ieeexplore.ieee.org/document/9469747/
• abstract_url: https://ieeexplore.ieee.org/document/9469747/
• publication_title: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
• conference_location: Manchester, United Kingdom
• conference_dates: 20-23 June 2021
• publication_number: 9469689
• is_number: 9469698
• publication_year: 2021
• publication_date: 20-23 June 2021
• start_page: 1
• end_page: 4
• citing_paper_count: 4
• citing_patent_count: 0
• download_count: 206
• insert_date: 20210705
• index_terms:
  • ieee_terms:
    • Image sensors
    • Planarization
    • Microcontrollers
    • Conferences
    • Electronic components
    • Sensor phenomena and characterization
    • Polymer films
  • author_terms:
    • Flexible electronics
    • bendable image sensor
    • HySiF
    • chip placement
    • topography planarization
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Hybrid System
    • Flexible Electronics
    • Flexible Printed Circuit Board
    • Flexible Circuit
    • Spin-coated
    • Spin Coating
    • Silicon Wafer
    • Centrifugal Force
    • Centrifugal Acceleration
    • Cavity Size
    • Gap Width
    • Gap Widths
    • Wafer Surface
    • Side Of Cavity
    • Cavity Depth
    • Cavity Depths
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-7281-9174-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-7281-9173-7, isbnType: New-2005
• authors:
  • Author Name: S. Wang
    Affiliation: Institut für Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany
    Author URL: https://ieeexplore.ieee.org/author/37088906588
    ID: 37088906588
    Order: 1
    Author Affiliations:
    • Institut für Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany
  • Author Name: B. Albrecht
    Affiliation: Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
    Author URL: https://ieeexplore.ieee.org/author/37086037465
    ID: 37086037465
    Order: 2
    Author Affiliations:
    • Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
  • Author Name: C. Harendt
    Affiliation: Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
    Author URL: https://ieeexplore.ieee.org/author/37354377800
    ID: 37354377800
    Order: 3
    Author Affiliations:
    • Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
  • Author Name: J. D. Schulze Spüntrup
    Affiliation: Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
    Author URL: https://ieeexplore.ieee.org/author/37085717214
    ID: 37085717214
    Order: 4
    Author Affiliations:
    • Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
  • Author Name: J. N. Burghartz
    Affiliation: Institut für Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany
    Author URL: https://ieeexplore.ieee.org/author/37275693000
    ID: 37275693000
    Order: 5
    Author Affiliations:
    • Institut für Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany
    • Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in the text
• dynamic_range: Not specified in the text
• pixel_size: Not specified in the text
• dark_current: Not specified in the text

Optical Data

• focal_length: Not specified in the text
• aperture: Not specified in the text
• field_of_view: Not specified in the text
• distortion: Not specified in the text

Performance Metrics

• frame_rate: Not specified in the text
• signal_to_noise_ratio: 355 dB for standard chip, 349.3 dB for 30 µm chip, 350 dB for chip in foil
• sensitivity: 350 dg/decade for all groups
• shutter_speed: Not specified in the text
• power_consumption: Not specified in the text
• noise: Not specified in the text

Applications & Benefits

• cell_imaging: Not specified in the text
• benefits: Ultra-thin image sensors maintain performance comparable to thicker counterparts, making them viable for flexible applications.

Supporting Organizations

• supported_by: DFG for the FFlexcom2 (SPP1796) project, University Stuttgart (Institutes INES, INT, and IHF)

Manuscript Details

• publication_date: 20-23 June 2021

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_c0f55b76-da46-4677-ad87-2dee2eb0fb61-ultrathin_image_sensor_chip_embeded_foil.json