Ultra Low Temperature Hybrid Bonding Morphological And Electrical Characterizations

• doi: 10.1109/ESTC60143.2024.10712151
• title: Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
• publisher: IEEE
• isbn: 979-8-3503-9037-7
• issn: 2687-9700
• rank: 3916
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D integration is increasingly gaining interest for a wide range of applications such as CMOS Image Sensor, DRAM and High Performance Computing. Low temperature hybrid bonding (<250°C) is more and more demanded by the industry to reduce the thermal budget of sensitive chips integration, or heterogeneous integrations with glass substrate for instance. This study investigates the effect of reducing the annealing temperature in direct hydrophilic wafer-to-wafer hybrid bonding on the morphology of the bonding interface in relation to the electrical results. This paper demonstrates the possibility of realizing a Cu-SiO2 hydrophilic direct wafer-to-wafer (W2W) hybrid bonding with a 5 μm pitch interconnections, with a low temperature annealing (between 100°C and 300°C).
• article_number: 10712151
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10712151
• html_url: https://ieeexplore.ieee.org/document/10712151/
• abstract_url: https://ieeexplore.ieee.org/document/10712151/
• publication_title: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
• conference_location: Berlin, Germany
• conference_dates: 11-13 Sept. 2024
• publication_number: 10711924
• is_number: 10711994
• publication_year: 2024
• publication_date: 11-13 Sept. 2024
• start_page: 1
• end_page: 6
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 290
• insert_date: 20241015
• index_terms:
  • ieee_terms:
    • Temperature sensors
    • Silicon compounds
    • Annealing
    • Three-dimensional displays
    • Thermal resistance
    • Silicon
    • Copper
    • Bonding
    • Standards
    • Three-dimensional integrated circuits
  • author_terms:
    • 3D integration
    • low temperature
    • copper
    • silicon oxide
    • hydrophilic bonding
  • dynamic_index_terms:
    • Morphological Features
    • Morphological Characteristics
    • Electrical Characteristics
    • Ultra-low Temperature
    • Ultra-low Temperature Freezer
    • Hybrid Bonding
    • Hydrophilic
    • Annealing Temperature
    • High-performance Computing
    • Supercomputer
    • Image Sensor
    • Camera Sensor
    • Low-temperature Annealing
    • Heterogeneous Integration
    • Multichip Module
    • 3D Integration
    • Energy-dispersive X-ray Spectroscopy
    • Energy Dispersive Spectroscopy
    • Atomic Force Microscopy
    • Bond Strength
    • Bond Energy
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Focused Ion Beam
    • Electroplating
    • Electrochemical Deposition
    • Thin Line
    • Copper Oxide
    • Test Vehicle
    • Direct Hybridization
    • Low SiO2
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-9037-7, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-9036-0, isbnType: New-2005
• authors:
  • Author Name: Margot Faure
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/567318372197182
    ID: 567318372197182
    Order: 1
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Christophe Dubarry
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37088361446
    ID: 37088361446
    Order: 2
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Pablo Renaud
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/697692671381585
    ID: 697692671381585
    Order: 3
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Floriane Baudin
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/772608752873488
    ID: 772608752873488
    Order: 4
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Sebastien Dominguez
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/561048556893964
    ID: 561048556893964
    Order: 5
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Karine Abadie
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/646678861306440
    ID: 646678861306440
    Order: 6
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Christophe Morales
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/231960950431675
    ID: 231960950431675
    Order: 7
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Constantin Matei
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/666549441444273
    ID: 666549441444273
    Order: 8
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
  • Author Name: Frank Fournel
    Affiliation: Univ. Grenoble Alpes, CEA, Leti, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37325348900
    ID: 37325348900
    Order: 9
    Author Affiliations:
    • Univ. Grenoble Alpes, CEA, Leti, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are used in various applications including smartphones, medical devices, and automotive systems.
• benefits: Enable digital imaging, enhance sensitivity and resolution.

Supporting Organizations

• supported_by: Not specified

Manuscript Details

• publication_date: 11-13 Sept. 2024

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • supported_by

Processed JSON Filename

request_1b29ea54-fbee-4d83-a296-2bf46e5e2abb-ultra_low_temperature_hybrid_bonding_morphological_and_electrical_characterizations.json