Tunable Curvature Of Large Visible Cmos Image Sensors Towards New Optical Functions And System Miniaturization

• doi: 10.1109/ECTC.2016.142
• title: Tunable Curvature of Large Visible CMOS Image Sensors: Towards New Optical Functions and System Miniaturization
• publisher: IEEE
• isbn: 978-1-5090-1205-3
• issn:
• rank: 3901
• access_type: LOCKED
• content_type: Conferences
• abstract: Since few years, there has been an increasing interest and demand for foldable, stretchable and flexible electronics for different application areas, such as defense/military, astronomy, meteorology, medicine, biotechnologies and consumer applications. In this work, we propose a new packaging development on tunable curvature of CMOS image sensors. First, based on an existing fisheye design, the optical benefits of a Tunable Curved Focal Plane Array (T-CFPA) are detailed and quantified. T-CFPA technology allows to compensate for the Petzval Field Curvature Aberration (FCA) and drastically simplifies the optical design (by saving up to 35% of the number of required optical surfaces). Our CMOS sensor curving process is introduced to highlight new packaging constraints in comparison to conventional CMOS image sensors. Mechanical and thermomechanical Finite Element Analyses (FEA) have been performed to define, understand and optimize the T-CFPA packaging while curving. Using 3D-printing fast prototyping, T-CFPA prototypes have been realized. Thanks to topology characterizations, we proved that our packaging approach for T-CFPA is compatible with spherical shape curving. Moreover, the +∞ to 280 mm radius range capability was shown on a 100 μm thick, 20*23 mm CMOS image sensor prototype.
• article_number: 7545430
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7545430
• html_url: https://ieeexplore.ieee.org/document/7545430/
• abstract_url: https://ieeexplore.ieee.org/document/7545430/
• publication_title: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
• conference_location: Las Vegas, NV, USA
• conference_dates: 31 May-3 June 2016
• publication_number: 7542794
• is_number: 7545393
• publication_year: 2016
• publication_date: 31 May-3 June 2016
• start_page: 178
• end_page: 187
• citing_paper_count: 12
• citing_patent_count: 4
• download_count: 571
• insert_date: 20160818
• index_terms:
  • ieee_terms:
    • Optical imaging
    • Optical sensors
    • Adaptive optics
    • Optical design
    • Optical distortion
    • Lenses
    • Packaging
  • author_terms:
    • Flexible electronic
    • CMOS image sensor
    • tunable curvature
    • innovative optical design
    • packaging issues
  • dynamic_index_terms:
    • Optical System
    • Optical Devices
    • Image Sensor
    • Camera Sensor
    • Vision Sensors
    • Prototype
    • 3D Printing
    • Spherical Shape
    • Focal Plane
    • Back Focal Plane
    • Finite Element Analysis
    • Flexible Electronics
    • Flexible Printed Circuit Board
    • Flexible Circuit
    • Optical Design
    • Young’s Modulus
    • Elastic Modulus
    • Tensile Modulus
    • Top Surface
    • Radius Of Curvature
    • Radii Of Curvature
    • Silicon Substrate
    • Vertical Displacement
    • Safety Factor
    • Substrate Thickness
    • Electrical Connection
    • Function Of Thickness
    • Integration Points
    • Bond Wires
    • Finite Element Analysis Results
    • Middle Plane
    • Bending Stress
    • Middle Surface
    • Optical Aberrations
    • Lens Aberrations
    • Monochromatic Aberrations
    • Set Of Lenses
    • Lens Set
    • Minimum Radius
    • Plate Size
    • Pure Bending
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5090-1205-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5090-1204-6, isbnType: New-2005
• authors:
  • Author Name: B. Chambion
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085873486
    ID: 37085873486
    Order: 1
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: L. Nikitushkina
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085866209
    ID: 37085866209
    Order: 2
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: Y. Gaeremynck
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37892334500
    ID: 37892334500
    Order: 3
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: W. Jahn
    Affiliation: UMR7326 - CNRS-INSU, Université d'Aix-Marseille, France
    Author URL: https://ieeexplore.ieee.org/author/37085869575
    ID: 37085869575
    Order: 4
    Author Affiliations:
    • UMR7326 - CNRS-INSU, Université d'Aix-Marseille, France
  • Author Name: E. Hugot
    Affiliation: UMR7326 - CNRS-INSU, Université d'Aix-Marseille, France
    Author URL: https://ieeexplore.ieee.org/author/37085873627
    ID: 37085873627
    Order: 5
    Author Affiliations:
    • UMR7326 - CNRS-INSU, Université d'Aix-Marseille, France
  • Author Name: G. Moulin
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085873895
    ID: 37085873895
    Order: 6
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: S. Getin
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085874389
    ID: 37085874389
    Order: 7
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: A. Vandeneynde
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37085871751
    ID: 37085871751
    Order: 8
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France
  • Author Name: D. Henry
    Affiliation: CEA, Univ. Grenoble Alpes, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37398773100
    ID: 37398773100
    Order: 9
    Author Affiliations:
    • CEA, Univ. Grenoble Alpes, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: 20*23 mm
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: 170 degrees
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Applications include defense/military, astronomy, meteorology, medicine, biotechnologies, and consumer applications.
• benefits: Elimination of field curvature aberration, simplification and miniaturization of optical system design.

Supporting Organizations

• supported_by: Univ. Grenoble Alpes, CEA, LETI, MINA TEC campus, Laboratoire d’Astrophysique de Marseille.

Manuscript Details

• publication_date: 31 May-3 June 2016

Relevancy Score

• score: 8
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_2e4cdfd0-aa85-429e-be3e-2e699da967cd-tunable_curvature_of_large_visible_cmos_image_sensors_towards_new_optical_functions_and_system_miniaturization.json