Tsvless Bsicis Waferlevel Package And Stacked Cis Module

• doi: 10.1109/IMPACT.2013.6706674
• title: TSV-less BSI-CIS wafer-level package and stacked CIS module
• publisher: IEEE
• isbn: 978-1-4799-0667-3
• issn: 2150-5942
• rank: 3705
• access_type: LOCKED
• content_type: Conferences
• abstract: In this study, a back-side illuminated CMOS image sensor (BSI-CIS) without through-silicon via (TSV) is developed with thin wafer handling combination with ultra-wafer thinning technologies. The CIS wafer is implemented front-side processes then temporarily bonded on a Si carrier by Brewer Science adhesive with ZoneBOND™ technology applied. The ZoneBOND™ technology provides a promising solution for thin wafer handling with temporary bonding, wafer thinning, thin wafer processes, and de-bonding. After thinning, the CIS backside is bonded with glass wafer, and the Si carrier is removed using solvent dipping for de-bonding. The thickness of BSI-CIS without TSV is less than 5μm, which is visible light transparent to meet the back-side illumination requirement. Cu/Sn bumps with 50μm size are formed with the bump height uniformity less than 5% in wafer level. The completed BSI-CIS is then assembled on Si substrate. There are totally 400 bumps in this test vehicle design. The Cu/Ni/Au UBMs on Si substrate bonded with Cu/Sn bumps on CIS is conducted by thermal compression bonding. The wafer-level package of TSV-less BSI-CIS has been successfully developed and demonstrated, stacked module is accomplished and passed 1000 cycles of -55°C~125°C TCT in the paper.
• article_number: 6706674
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6706674
• html_url: https://ieeexplore.ieee.org/document/6706674/
• abstract_url: https://ieeexplore.ieee.org/document/6706674/
• publication_title: 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
• conference_location: Taipei, Taiwan
• conference_dates: 22-25 Oct. 2013
• publication_number: 6698269
• is_number: 6706610
• publication_year: 2013
• publication_date: 22-25 Oct. 2013
• start_page: 323
• end_page: 326
• citing_paper_count: 4
• citing_patent_count: 0
• download_count: 1288
• insert_date: 20140109
• index_terms:
  • ieee_terms:
    • Bonding
    • Tin
    • CMOS image sensors
    • Substrates
    • Silicon
    • Passivation
  • dynamic_index_terms:
    • Wafer-level Packaging
    • Image Sensor
    • Camera Sensor
    • Si Substrate
    • Thin Processes
    • Glass Wafer
    • Etching
    • Contact Resistance
    • Interfacial Resistance
    • Contact Impedance
    • Trace Metals
    • Height Variation
    • Passivation Layer
    • Surface Passivation
    • Photoresist
    • Electroplating
    • Electrochemical Deposition
    • Dry Etching
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-0667-3, isbnType: New-2005
• authors:
  • Author Name: Z. C. Hsiao
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/37601868500
    ID: 37601868500
    Order: 1
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
  • Author Name: C. T. Ko
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/37292392400
    ID: 37292392400
    Order: 2
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
  • Author Name: H. H. Chang
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/37280774800
    ID: 37280774800
    Order: 3
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
  • Author Name: H. C. Fu
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/37286401500
    ID: 37286401500
    Order: 4
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
  • Author Name: C. W. Chiang
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/37290982400
    ID: 37290982400
    Order: 5
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
  • Author Name: W. L. Tsai
    Affiliation: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.
    Author URL: https://ieeexplore.ieee.org/author/38182138200
    ID: 38182138200
    Order: 6
    Author Affiliations:
    • Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute, Hsinchu, Taiwan, R.O.C.

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: <1.4µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are used extensively in applications such as smartphones and medical devices due to their low power consumption and adaptability to standard CMOS technology.
• benefits: Advantages of CMOS include faster readout speeds, lower voltage operation, cost-effectiveness, and suitability for integration into systems requiring digital imaging.

Supporting Organizations

• supported_by: Electronics and Optoelectronics Research Labs, Industrial Technology Research Institute

Manuscript Details

• publication_date: 22-25 Oct. 2013

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_4c53be0a-5551-47a2-9dd0-7965ecfe72de-tsvless_bsicis_waferlevel_package_and_stacked_cis_module.json