Tsv Fabrication For Image Sensor Packaging

• doi: 10.1109/CSTIC.2015.7153436
• title: TSV fabrication for image sensor packaging
• publisher: IEEE
• isbn: 978-1-4799-7241-8
• issn: 2158-2297
• rank: 3703
• access_type: LOCKED
• content_type: Conferences
• abstract: In this paper, we report a novel TSV fabrication method to develop CMOS image sensor package. The major processes comprise cavity wall formation, glass carrier to IC wafer bonding, grinding, TSV fabrication, passivation, laser drilling to expose the Al bondpads, PVD deposition, electroplating, re-distribution layer (RDL), under bump metallization and solder bump formation. The as-formed TSV CIS structure is solid and reliable in mass production.
• article_number: 7153436
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7153436
• html_url: https://ieeexplore.ieee.org/document/7153436/
• abstract_url: https://ieeexplore.ieee.org/document/7153436/
• publication_title: 2015 China Semiconductor Technology International Conference
• conference_location: Shanghai
• conference_dates: 15-16 March 2015
• publication_number: 7137399
• is_number: 7153317
• publication_year: 2015
• publication_date: 15-16 March 2015
• start_page: 1
• end_page: 4
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 446
• insert_date: 20150713
• index_terms:
  • ieee_terms:
    • Glass
    • Silicon
    • Image sensors
    • Packaging
    • Semiconductor device reliability
    • Stress
  • author_terms:
    • Through silicon via
    • CMOS Imager Sensor
    • PVD
    • Plating
    • Redistribution Layer
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Through Silicon Via
    • Sensor Package
    • Electroplating
    • Electrochemical Deposition
    • Reliability Test
    • Silicon Wafer
    • Passivation Layer
    • Surface Passivation
    • Etching Method
    • Positive Photoresist
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-7241-8, isbnType: New-2005
• authors:
  • Author Name: Wang Ping
    Affiliation: Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
    Author URL: https://ieeexplore.ieee.org/author/37087392032
    ID: 37087392032
    Order: 1
    Author Affiliations:
    • Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
  • Author Name: Wang Bangxu
    Affiliation: Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
    Author URL: https://ieeexplore.ieee.org/author/37087819077
    ID: 37087819077
    Order: 2
    Author Affiliations:
    • Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
  • Author Name: Lv Jun
    Affiliation: Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
    Author URL: https://ieeexplore.ieee.org/author/37087815368
    ID: 37087815368
    Order: 3
    Author Affiliations:
    • Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
  • Author Name: Mark Huang
    Affiliation: Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
    Author URL: https://ieeexplore.ieee.org/author/37085366035
    ID: 37085366035
    Order: 4
    Author Affiliations:
    • Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
  • Author Name: Carl Lai
    Affiliation: Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China
    Author URL: https://ieeexplore.ieee.org/author/37085367180
    ID: 37085367180
    Order: 5
    Author Affiliations:
    • Suzhou Speed Semiconductor Technology Co. Ltd., Suzhou, China

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are used in various applications such as smartphones, medical devices, and automotive systems.
• benefits: Enable digital imaging and improve functionality in consumer and industrial applications.

Supporting Organizations

• supported_by: Suzhou Speed Semiconductor Technology Co. Ltd.

Manuscript Details

• publication_date: 15-16 March 2015

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_aaa8bfa4-12e7-465f-b0e9-1abdb83c8822-tsv_fabrication_for_image_sensor_packaging.json