Threedimensional Integration Technology Of Separate Soi Layers For Photodetectors And Signal Processors Of Cmos Image Sensors

• doi: 10.1109/ICEP.2016.7486785
• title: Three-dimensional integration technology of separate SOI layers for photodetectors and signal processors of CMOS image sensors
• publisher: IEEE
• isbn: 978-4-9040-9016-9
• issn:
• rank: 3845
• access_type: LOCKED
• content_type: Conferences
• abstract: We report on three-dimensional (3-D) integration technology of separate silicon-on-insulator (SOI) layers for photodetectors and signal processors of CMOS image sensors. Photodiode, A/D convertor, and counter were integrated in two SOI layers that were vertically connected by embedded Au electrodes, thereby enabling pixel-parallel operation of image sensor. Photodiode has a P+/N/P-structure to suppress the dark current. We developed the image sensor and confirmed its performance of a wide dynamic range of 96 dB and high resolution of 16 bit. The sensor is promising to next-generation ultimate imaging devices.
• article_number: 7486785
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7486785
• html_url: https://ieeexplore.ieee.org/document/7486785/
• abstract_url: https://ieeexplore.ieee.org/document/7486785/
• publication_title: 2016 International Conference on Electronics Packaging (ICEP)
• conference_location: Hokkaido, Japan
• conference_dates: 20-22 April 2016
• publication_number: 7481053
• is_number: 7486763
• publication_year: 2016
• publication_date: 20-22 April 2016
• start_page: 70
• end_page: 73
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 361
• insert_date: 20160609
• index_terms:
  • ieee_terms:
    • CMOS image sensors
    • Gold
    • Bonding
    • Radiation detectors
    • Program processors
    • Analog-digital conversion
  • author_terms:
    • CMOS image sensors
    • three-dimensional (3-D) integration technology
    • silicon-on-insulator (SOI)
  • dynamic_index_terms:
    • Signal Processing
    • Image Sensor
    • Camera Sensor
    • Three-dimensional Technology
    • Three-dimensional Integration
    • Dynamic Range
    • Au Electrode
    • Upper Layer
    • Fabrication Process
    • Lower Layer
    • Logical Process
• isbn_formats:
  • format: CD, value: 978-4-9040-9016-9, isbnType: New-2005
  • format: Electronic ISBN, value: 978-4-9040-9017-6, isbnType: New-2005
• authors:
  • Author Name: Masahide Goto
    Affiliation: Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37330360100
    ID: 37330360100
    Order: 1
    Author Affiliations:
    • Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
  • Author Name: Kei Hagiwara
    Affiliation: Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37399139900
    ID: 37399139900
    Order: 2
    Author Affiliations:
    • Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
  • Author Name: Yuki Honda
    Affiliation: Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37588911000
    ID: 37588911000
    Order: 3
    Author Affiliations:
    • Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
  • Author Name: Masakazu Nanba
    Affiliation: Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37283665600
    ID: 37283665600
    Order: 4
    Author Affiliations:
    • Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
  • Author Name: Yoshinori Iguchi
    Affiliation: Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37429827800
    ID: 37429827800
    Order: 5
    Author Affiliations:
    • Nihon Hoso Kyokai, Shibuya-ku, Tokyo, JP
  • Author Name: Takuya Saraya
    Affiliation: Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37293949700
    ID: 37293949700
    Order: 6
    Author Affiliations:
    • Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
  • Author Name: Masaharu Kobayashi
    Affiliation: Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37085444063
    ID: 37085444063
    Order: 7
    Author Affiliations:
    • Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
  • Author Name: Eiji Higurashi
    Affiliation: Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37265713900
    ID: 37265713900
    Order: 8
    Author Affiliations:
    • Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
  • Author Name: Hiroshi Toshiyoshi
    Affiliation: Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37274513000
    ID: 37274513000
    Order: 9
    Author Affiliations:
    • Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
  • Author Name: Toshiro Hiramoto
    Affiliation: Tokyo Daigaku, Bunkyo-ku, Tokyo, JP
    Author URL: https://ieeexplore.ieee.org/author/37268252200
    ID: 37268252200
    Order: 10
    Author Affiliations:
    • Tokyo Daigaku, Bunkyo-ku, Tokyo, JP

Image Sensor

• sensor_type: CMOS
• resolution: 16 bit
• dynamic_range: 96 dB
• pixel_size: 80 µm square
• dark_current: suppressed due to P+/N/P-structure

Optical Data

• focal_length:
• aperture:
• field_of_view:
• distortion:

Performance Metrics

• frame_rate:
• signal_to_noise_ratio:
• sensitivity:
• shutter_speed:
• power_consumption:
• noise:

Applications & Benefits

• cell_imaging: Applicable in various imaging devices such as smartphones and medical devices.
• benefits: High performance with wide dynamic range and reduced dark current.

Supporting Organizations

• supported_by: NHK Science and Technology Research Laboratories, The University of Tokyo

Manuscript Details

• publication_date: 20-22 April 2016

Relevancy Score

• score: 10
• missing_fields:
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_3726a6ac-9041-46eb-9bfb-a9435cc18ff0-threedimensional_integration_technology_of_separate_soi_layers_for_photodetectors_and_signal_processors_of_cmos_image_sensors.json