Thin Layer Transfer Technologies In Heterogeneous Integration

• doi: 10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134342
• title: Thin Layer Transfer Technologies in Heterogeneous Integration
• publisher: IEEE
• isbn: 979-8-3503-3417-3
• issn:
• rank: 3830
• access_type: LOCKED
• content_type: Conferences
• abstract: High performance computing, mobile communication, automotive and IOT are driving the semiconductor development to the next generation. Performance, power, area, cost, time-to market, and friendly environment (PPACTE) are considered in system-design-technology co-optimization (SDTCO) based heterogeneous integration. Recently, chiplet, 3D-stacking, and 3D sequential integration demonstrated some significant PPACTE benefits on the heterogeneous integration. To innovate the diversity of chiplet design, the universal chiplet interconnect express (UCIe) was proposed and standardized some specifications for Si bridge, passive interposer, and organic interposer. The D2W Cu-Cu hybrid bonding technology made the 3D stacking possibility from logic-to-CIS to logic-to-memory. 3D sequential integration was considered to partition the pixel cell of CMOS image sensors (CIS) to the pixel Si layer and the pixel transistor layer. The innovations of thin layer transfer technologies are becoming more and more important in the heterogeneous integration future. In this presentation, the wafer thinning technologies and the wafer bonding technologies will be reviewed and summarized. Some thin layer transfer integration approaches will be compared. These technology constraints on thermal budget and quality control are also addressed.
• article_number: 10134342
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10134342
• html_url: https://ieeexplore.ieee.org/document/10134342/
• abstract_url: https://ieeexplore.ieee.org/document/10134342/
• publication_title: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)
• conference_location: HsinChu, Taiwan
• conference_dates: 17-20 April 2023
• publication_number: 10133934
• is_number: 10133941
• publication_year: 2023
• publication_date: 17-20 April 2023
• start_page: 1
• end_page: 1
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 275
• insert_date: 20230531
• index_terms:
  • ieee_terms:
    • Multichip modules
    • Three-dimensional displays
    • Very large scale integration
    • Silicon
    • Wafer bonding
    • Transistors
    • Technological innovation
  • dynamic_index_terms:
    • Heterogeneous Integration
    • Multichip Module
    • High-performance Computing
    • Supercomputer
    • Mobile Communication
    • Mobile Telephony
    • Mobile Telephone
    • Mobile Telecommunications
    • Thermal Budget
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-3417-3, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-3416-6, isbnType: New-2005
• authors:
  • Author Name: Hankel Chang
    Affiliation: Soitec
    Author URL: https://ieeexplore.ieee.org/author/345223147929781
    ID: 345223147929781
    Order: 1
    Author Affiliations:
    • Soitec

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: not specified

Manuscript Details

• publication_date: 17-20 April 2023

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by

Processed JSON Filename

request_4a47c2dc-6c8a-4bbe-b557-d0c82a751b59-thin_layer_transfer_technologies_in_heterogeneous_integration.json