Thermalmechanicalnoisebased Cmut Characterization And Sensing

• doi: 10.1109/TUFFC.2012.2317
• title: Thermal-mechanical-noise-based CMUT characterization and sensing
• publisher: IEEE
• isbn:
• issn: 1525-8955
• rank: 3829
• access_type: LOCKED
• content_type: Journals
• abstract: When capacitive micromachined ultrasonic transducers (CMUTs) are monolithically integrated with custom-designed low-noise electronics, the output noise of the system can be dominated by the CMUT thermal-mechanical noise both in air and in immersion even for devices with low capacitance. Because the thermal-mechanical noise can be related to the electrical admittance of the CMUTs, this provides an effective means of device characterization. This approach yields a novel method to test the functionality and uniformity of CMUT arrays and the integrated electronics when a direct connection to CMUT array element terminals is not available. Because these measurements can be performed in air at the wafer level, the approach is suitable for batch manufacturing and testing. We demonstrate this method on the elements of an 800-μm-diameter CMUT-on-CMOS array designed for intravascular imaging in the 10 to 20 MHz range. Noise measurements in air show the expected resonance behavior and spring softening effects. Noise measurements in immersion for the same array provide useful information on both the acoustic cross talk and radiation properties of the CMUT array elements. The good agreement between a CMUT model based on finite difference and boundary element methods and the noise measurements validates the model and indicates that the output noise is indeed dominated by thermal-mechanical noise. The measurement method can be exploited to implement CMUT-based passive sensors to measure immersion medium properties, or other parameters affecting the electro-mechanics of the CMUT structure.
• article_number: 6217575
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6217575
• html_url: https://ieeexplore.ieee.org/document/6217575/
• abstract_url: https://ieeexplore.ieee.org/document/6217575/
• publication_title: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
• conference_location:
• conference_dates:
• publication_number: 58
• is_number: 6217549
• publication_year: 2012
• publication_date: June 2012
• start_page: 1267
• end_page: 1275
• citing_paper_count: 18
• citing_patent_count: 0
• download_count: 933
• insert_date: 20120615
• index_terms:
  • ieee_terms:
    • Noise
    • Noise measurement
    • Impedance
    • Thermal noise
    • Finite element methods
    • Transducers
    • Sensors
  • dynamic_index_terms:
    • Capacitive Micromachined Ultrasonic Transducer
    • Finite Difference
    • Central Difference
    • Measurement Noise
    • Finite Difference Method
    • Finite Difference Scheme
    • Finite Difference Approximation
    • Array Elements
    • Boundary Element
    • Boundary Element Method
    • Air Measurements
    • MHz Range
    • Intravascular Imaging
    • Resonance Frequency
    • Effects Of Radiation
    • Effects Of Radiotherapy
    • Effect Of Irradiation
    • Ultrasound Imaging
    • Equivalent Circuit
    • Thermal Noise
    • Current Noise
    • Speed Of Sound
    • Sound Velocity
    • Fluid Properties
    • Properties Of Fluids
    • Surface Waves
    • Array Transducer
    • DC Bias
    • Noise Spectrum
    • Colored Noise
    • Crosstalk Effects
    • Total Impedance
    • Equivalent Impedance
    • Real Part Of Impedance
    • Transimpedance Amplifier
    • Turns Ratio
    • Transformation Ratio
    • Transformer Turns Ratio
    • Mechanical Impedance
    • Noise Density
    • Resonant Wave
• authors:
  • Author Name: Gokce Gurun
    Affiliation: School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA
    Author URL: https://ieeexplore.ieee.org/author/38505184000
    ID: 38505184000
    Order: 1
    Author Affiliations:
    • School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA
  • Author Name: Michael Hochman
    Affiliation: School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA
    Author URL: https://ieeexplore.ieee.org/author/38558879100
    ID: 38558879100
    Order: 2
    Author Affiliations:
    • School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA
  • Author Name: Paul Hasler
    Affiliation: School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA
    Author URL: https://ieeexplore.ieee.org/author/37270054200
    ID: 37270054200
    Order: 3
    Author Affiliations:
    • School of Electrical and Computing Engineering, Georgia Institute of Technology, Atlanta, GA, USA
  • Author Name: F. Levent Degertekin
    Affiliation: School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA
    Author URL: https://ieeexplore.ieee.org/author/38556756100
    ID: 38556756100
    Order: 4
    Author Affiliations:
    • School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not applicable
• benefits: not specified

Supporting Organizations

• supported_by: not specified

Manuscript Details

• publication_date: June 2012

Relevancy Score

• score: 3
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by

Processed JSON Filename

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