Thermal Modeling And Analysis For A Novel Packaging Structure Of Cmos Image Sensor

• doi: 10.1109/ICEPT.2016.7583333
• title: Thermal modeling and analysis for a novel packaging structure of CMOS image sensor
• publisher: IEEE
• isbn: 978-1-5090-1397-5
• issn:
• rank: 3827
• access_type: LOCKED
• content_type: Conferences
• abstract: In this paper, a novel new package solution for CMOS image sensor (CIS) based on molding compound interconnect substrate (MIS) is proposed. First, a 13 million pixel CIS packaged by quad flat no lead (QFN) is chosen as a reference. Considering the design parameters, a new package structure based on MIS is designed. Second, Two kinds of three-dimensional finite element models of CIS package are respectively established by ANSYS Workbench. One is packaged by QFN, and the other one is packaged by MIS. Then the thermal-mechanical property of the two package structures during the cooling process just after molding is analyzed. In the initial simulation, warpage of new package structure based on MIS is 22.915μm, which is less than it in QFN model. However, the peak equivalent stress in CIS chip of QFN is 74.307Mpa much less than 335.53Mpa in MIS model. Third, as the geometry parameters and epoxy molding compound (EMC) characteristics influencing the reliability of the package, a series of comprehensive parametric studies are conducted in this paper. From the simulation, the opening size and the CTE of EMC are found to be the most critical factors, which affect the warpage of package and equivalent stress in CIS chip.
• article_number: 7583333
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7583333
• html_url: https://ieeexplore.ieee.org/document/7583333/
• abstract_url: https://ieeexplore.ieee.org/document/7583333/
• publication_title: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)
• conference_location: Wuhan, China
• conference_dates: 16-19 Aug. 2016
• publication_number: 7574980
• is_number: 7583073
• publication_year: 2016
• publication_date: 16-19 Aug. 2016
• start_page: 1174
• end_page: 1179
• citing_paper_count: 3
• citing_patent_count: 0
• download_count: 486
• insert_date: 20161006
• index_terms:
  • ieee_terms:
    • Electromagnetic compatibility
    • CMOS technology
    • Semiconductor device modeling
    • Reliability
    • Compounds
    • Thermal sensors
    • Substrates
  • author_terms:
    • CMOS image sensor
    • molding compound interconnect substrate (MIS)
    • warpage
    • equivalent stress
  • dynamic_index_terms:
    • Packing Structure
    • STRUCTURE Software
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Geometry Parameters
    • Opening Size
    • Equivalent Stress
    • ANSYS Workbench
    • Thermal Stress
    • Heat Load
    • Design Software
    • Packaging Design
    • Changes In Thickness
    • Optical Glass
    • Traditional Packaging
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5090-1397-5, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5090-1396-8, isbnType: New-2005
• authors:
  • Author Name: S. F. Han
    Affiliation: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37085735204
    ID: 37085735204
    Order: 1
    Author Affiliations:
    • Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
  • Author Name: D.G. Yang
    Affiliation: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37281508700
    ID: 37281508700
    Order: 2
    Author Affiliations:
    • Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
  • Author Name: M. Cai
    Affiliation: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/38017126600
    ID: 38017126600
    Order: 3
    Author Affiliations:
    • Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
  • Author Name: D.J. Liu
    Affiliation: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/38023358100
    ID: 38023358100
    Order: 4
    Author Affiliations:
    • Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Y.Y. Nie
    Affiliation: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37085823512
    ID: 37085823512
    Order: 5
    Author Affiliations:
    • Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China

Image Sensor

• sensor_type: CMOS
• resolution: 13 million pixels
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Not specified
• benefits: Enables digital imaging in a variety of applications such as smartphones, medical devices, and automotive systems.

Supporting Organizations

• supported_by: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, Guilin University of Electronic Technology

Manuscript Details

• publication_date: 16-19 Aug. 2016

Relevancy Score

• score: 10
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • use of microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_305d000a-f782-4469-b314-c855ef747e8c-thermal_modeling_and_analysis_for_a_novel_packaging_structure_of_cmos_image_sensor.json