The Scaling Of Cucu Hybrid Bonding For High Density 3D Chip Stacking

• doi: 10.1109/EDTM.2019.8731186
• title: The Scaling of Cu-Cu Hybrid Bonding For High Density 3D Chip Stacking
• publisher: IEEE
• isbn: 978-1-5386-6509-1
• issn:
• rank: 3781
• access_type: LOCKED
• content_type: Conferences
• abstract: We have successfully improved the scaling of Cu-Cu hybrid bonding. In this study, 3 $\mu {\mathrm{ m}}$-pitch and 3M Cu-Cu connections with sufficient electrical properties and reliabilities were achieved. The ultra-fine pitch Cu-Cu connections correspond to the 0.75x scaling of conventional Cu-Cu hybrid bonding that we previously reported. Our high density 3D chip stacking technology is expected to enhance not only the function of back-illuminated CMOS image sensors (BI-CIS) but also that of coming 3D stacked semiconductor devices.
• article_number: 8731186
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8731186
• html_url: https://ieeexplore.ieee.org/document/8731186/
• abstract_url: https://ieeexplore.ieee.org/document/8731186/
• publication_title: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)
• conference_location: Singapore
• conference_dates: 12-15 March 2019
• publication_number: 8718786
• is_number: 8731017
• publication_year: 2019
• publication_date: 12-15 March 2019
• start_page: 297
• end_page: 299
• citing_paper_count: 25
• citing_patent_count: 0
• download_count: 2507
• insert_date: 20190606
• index_terms:
  • ieee_terms:
    • Bonding
    • Three-dimensional displays
    • Semiconductor device reliability
    • Stacking
    • CMOS image sensors
    • Wafer bonding
  • author_terms:
    • Cu-Cu Hybrid Bonding
    • Cu-Cu Connection
    • Stacked CMOS Image Sensor
    • 3D Chip Stacking
  • dynamic_index_terms:
    • High Stacking
    • High-density 3D
    • Chip Stack
    • Image Sensor
    • Camera Sensor
    • High Technology
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5386-6509-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5386-6508-4, isbnType: New-2005
• authors:
  • Author Name: Y. Kagawa
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37295736500
    ID: 37295736500
    Order: 1
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: S. Hida
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088736756
    ID: 37088736756
    Order: 2
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: Y. Kobayashi
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088739221
    ID: 37088739221
    Order: 3
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: K. Takahashi
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088730771
    ID: 37088730771
    Order: 4
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: S. Miyanomae
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088738169
    ID: 37088738169
    Order: 5
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: M. Kawamura
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088731630
    ID: 37088731630
    Order: 6
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: H. Kawashima
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37329175700
    ID: 37329175700
    Order: 7
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: H. Yamagishi
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088738506
    ID: 37088738506
    Order: 8
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: T. Hirano
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37285319700
    ID: 37285319700
    Order: 9
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: K. Tatani
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37086017179
    ID: 37086017179
    Order: 10
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: H. Nakayama
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37732430000
    ID: 37732430000
    Order: 11
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan
  • Author Name: K. Ohno
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37264993900
    ID: 37264993900
    Order: 12
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: H. Iwamoto
    Affiliation: Sony Semiconductor Solutions Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37297571400
    ID: 37297571400
    Order: 13
    Author Affiliations:
    • Sony Semiconductor Solutions Corporation, Japan
  • Author Name: S. Kadomura
    Affiliation: Sony Semiconductor Manufacturing Corporation, Japan
    Author URL: https://ieeexplore.ieee.org/author/37297572200
    ID: 37297572200
    Order: 14
    Author Affiliations:
    • Sony Semiconductor Manufacturing Corporation, Japan

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: 1.5 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in stacked back-illuminated CMOS image sensors (BI-CIS) for high-end camera phones, digital still cameras, and digital single-lens reflex cameras.
• benefits: Improved layout flexibility with Cu-Cu connections compared to conventional stacking technologies.

Supporting Organizations

• supported_by: Sony Semiconductor Manufacturing Corporation, Sony Semiconductor Solutions Corporation

Manuscript Details

• publication_date: 12-15 March 2019

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_2aa1e2f6-6a86-4526-a5d0-c4f12cc3b92a-the_scaling_of_cucu_hybrid_bonding_for_high_density_3d_chip_stacking.json