The Miniaturization Of A Microball Endoscope By Sip Approach

• doi: 10.1109/ECTC.2014.6897472
• title: The miniaturization of a micro-ball endoscope by SiP approach
• publisher: IEEE
• isbn: 978-1-4799-2407-3
• issn: 2377-5726
• rank: 3812
• access_type: LOCKED
• content_type: Conferences
• abstract: The use of capsule endoscope greatly contributes to the painless and hygiene diagnoses of the small intestine, which cannot be reached easily by traditional upper endoscopy or colonoscopy. However, most of current commercial capsule endoscopes only carry one or two cameras, which may lead to missing some interesting spots due to the limited field of view. A micro-ball endoscope with six CMOS image sensors mounted on a cubic carrier could reduce the miss rate. Some initial prototypes were built with PCBs and connectors. The minimum size of initial prototypes was 22mm×22mm×22mm, which limited the practical use in human medicine. Thus, it is essential to minimize the prototype cube size. In the present work, a SiP (System in Package) approach was proposed to promote the miniaturization of the micro-ball endoscope. Utilization of rigid-flex substrate of special configuration, which is bendable other than PCBs and connectors, achieved seamless connection between adjacent boards and higher package density by employing three-dimension (3-D) space. The technology of multi die stack was also applied to lower the footprint. With this new SiP design, the size of complicated micro-ball endoscope, which involves ASIC (Application Specific Integrated Circuits) chips, image sensors, Flash chips, and wireless transceiver module, was successfully reduced to 16mm×16mm ×16mm.
• article_number: 6897472
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6897472
• html_url: https://ieeexplore.ieee.org/document/6897472/
• abstract_url: https://ieeexplore.ieee.org/document/6897472/
• publication_title: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
• conference_location: Orlando, FL, USA
• conference_dates: 27-30 May 2014
• publication_number: 6884273
• is_number: 6897249
• publication_year: 2014
• publication_date: 27-30 May 2014
• start_page: 1378
• end_page: 1383
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 188
• insert_date: 20140915
• index_terms:
  • ieee_terms:
    • Substrates
    • Endoscopes
    • Packaging
    • Bonding
    • Wires
    • Prototypes
    • Wireless communication
  • author_terms:
    • System in Package
    • Miniaturization
    • Rigid-Flex substrate
    • Micro-ball endoscope
  • dynamic_index_terms:
    • Endoscopic
    • System Software
    • Packaging System
    • Prototype
    • Wireless
    • Wireless Communication
    • Use Of Medicines
    • Human Medicine
    • Colonoscopy
    • Image Sensor
    • Camera Sensor
    • Painless
    • Specific Configuration
    • Flash Memory
    • Flash Storage
    • Cubic Structure
    • Cubic Phase
    • Polyethylene Terephthalate
    • Dacron
    • Flexible Substrates
    • Printed Circuit Board
    • Circuit Board
    • Image Capture
    • S-parameters
    • Software Solutions
    • Packaging Solutions
    • Rigid Substrates
    • Substrate Side
    • Packaging Process
    • Surface-mounted
    • Surface Mount Technology
    • Electric Simulation
    • Packaging Technology
    • Stacking Method
    • Test Vehicle
    • Tsinghua University
    • Qinghua
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-2407-3, isbnType: New-2005
• authors:
  • Author Name: Xunxun Zhu
    Affiliation: Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37085397903
    ID: 37085397903
    Order: 1
    Author Affiliations:
    • Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
  • Author Name: Jian Cai
    Affiliation: Tsinghua National Laboratory for Information Science and Technology, Tsinghua University, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37291518200
    ID: 37291518200
    Order: 2
    Author Affiliations:
    • Tsinghua National Laboratory for Information Science and Technology, Tsinghua University, Beijing, P.R. China
  • Author Name: Yu Chen
    Affiliation: Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37311242800
    ID: 37311242800
    Order: 3
    Author Affiliations:
    • Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
  • Author Name: Yingke Gu
    Affiliation: Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37592420800
    ID: 37592420800
    Order: 4
    Author Affiliations:
    • Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
  • Author Name: Xiang Xie
    Affiliation: Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37274130600
    ID: 37274130600
    Order: 5
    Author Affiliations:
    • Insitute Microelectronics, Tsinghua University, Beijing, P.R. China
  • Author Name: Qian Wang
    Affiliation: Tsinghua University, Beijing, Beijing, CN
    Author URL: https://ieeexplore.ieee.org/author/37291370900
    ID: 37291370900
    Order: 6
    Author Affiliations:
    • Tsinghua University, Beijing, Beijing, CN
  • Author Name: Zhihua Wang
    Affiliation: Tsinghua University, Beijing, Beijing, CN
    Author URL: https://ieeexplore.ieee.org/author/37279252700
    ID: 37279252700
    Order: 7
    Author Affiliations:
    • Tsinghua University, Beijing, Beijing, CN
  • Author Name: Xiaofeng Sun
    Affiliation: Institute of Microelectronics of Chinese Aademy Sciences, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/38022965900
    ID: 38022965900
    Order: 8
    Author Affiliations:
    • Institute of Microelectronics of Chinese Aademy Sciences, Beijing, P.R. China
  • Author Name: Lixi Wan
    Affiliation: Institute of Microelectronics of Chinese Aademy Sciences, Beijing, P.R. China
    Author URL: https://ieeexplore.ieee.org/author/37272610900
    ID: 37272610900
    Order: 9
    Author Affiliations:
    • Institute of Microelectronics of Chinese Aademy Sciences, Beijing, P.R. China

Image Sensor

• sensor_type: CMOS
• resolution: varies
• dynamic_range: varies
• pixel_size: 4.2×4.0
• dark_current: varies

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: The CMOS image sensors are used in the micro-ball endoscope for capturing images of the gastrointestinal mucosa.
• benefits: The use of six CMOS image sensors enables a full-view image capture system, thereby reducing the miss rate in imaging.

Supporting Organizations

• supported_by: Institute of Microelectronics, Tsinghua University; Institute of Microelectronics of Chinese Academy Sciences

Manuscript Details

• publication_date: 27-30 May 2014

Relevancy Score

• score: 9
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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