The Hybrid Curing Adhesive For Image Sensor Module

• doi: 10.1109/ECTC.2008.4550267
• title: The hybrid curing adhesive for image sensor module
• publisher: IEEE
• isbn: 978-1-4244-2231-9
• issn: 2377-5726
• partnum: 08CH38006
• rank: 3809
• access_type: LOCKED
• content_type: Conferences
• abstract: The production of the CMOS and CCD sensor packages for the cellular phone has been increasing rapidly. The CMOS and CCD sensor packages are composed with the holder, glass, lens, substrate, sensor and so on. The adhesive to seal up a holder and substrate is necessary. Heat curing adhesive is usually used, and it must have curability at low temperature and enough adhesion. The projection that was arranged by a retainer of a holder and the hole which was emptied into a substrate are used to fix the place, since the position or an axis gap occurs by vibration during transportation and curing. The position or axis gap is the serious problem for an image sensor module.
• article_number: 4550267
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4550267
• html_url: https://ieeexplore.ieee.org/document/4550267/
• abstract_url: https://ieeexplore.ieee.org/document/4550267/
• publication_title: 2008 58th Electronic Components and Technology Conference
• conference_location: Lake Buena Vista, FL, USA
• conference_dates: 27-30 May 2008
• publication_number: 4542565
• is_number: 4549927
• publication_year: 2008
• publication_date: 27-30 May 2008
• start_page: 2056
• end_page: 2059
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 83
• insert_date: 20080624
• index_terms:
  • ieee_terms:
    • Curing
    • Image sensors
    • Packaging
    • Adhesives
    • CMOS image sensors
    • Charge coupled devices
    • Production
    • Cellular phones
    • Glass
    • Lenses
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • High Reliability
    • High Dependence
    • Van Der Waals Interactions
    • Ionic Interactions
    • Electrostatic Bonds
    • Ionic Bonds
    • Delamination
    • Coordination Bonds
    • Adhesion Strength
    • Anchoring Effect
    • Focusing Effect
    • Anchoring Bias
    • Effect Of Focus
    • Focal Events
    • Focusing Events
    • Recent Issue
    • Recent Return
    • Adhesive System
    • Soft Segments
    • Curing System
    • High Adhesion Strength
    • Dynamic Mechanical Analysis
    • Low Modulus
    • Extreme Changes
    • Modulus Of Samples
    • Moduli Of Samples
    • Print Patterns
• isbn_formats:
  • format: CD, value: 978-1-4244-2231-9, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4244-2230-2, isbnType: New-2005
• authors:
  • Author Name: Yukinari Abe
    Affiliation: CHIPCOAT Group, insulating material Development Unit, Technical R D Div, NAMICS Corporation, Niigata, Japan
    Author URL: https://ieeexplore.ieee.org/author/37087259362
    ID: 37087259362
    Order: 1
    Author Affiliations:
    • CHIPCOAT Group, insulating material Development Unit, Technical R D Div, NAMICS Corporation, Niigata, Japan
  • Author Name: Kazuki Iwaya
    Affiliation: CHIPCOAT Group, insulating material Development Unit, Technical R D Div, NAMICS Corporation, Niigata, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088210033
    ID: 37088210033
    Order: 2
    Author Affiliations:
    • CHIPCOAT Group, insulating material Development Unit, Technical R D Div, NAMICS Corporation, Niigata, Japan

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are used in smartphones, medical devices, and automotive systems.
• benefits: Enable digital imaging by converting light into electrical signals.

Supporting Organizations

• supported_by: NAMICS Corporation

Manuscript Details

• publication_date: 27-30 May 2008

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_447e0326-c29d-4ab2-9c19-5c181668e489-the_hybrid_curing_adhesive_for_image_sensor_module.json