The Electrothermal Properties Of Integrated Circuit Microbolometers
- doi: 10.23919/SAIEE.2011.8532183
-
title: The Electro-Thermal Properties of Integrated
Circuit Microbolometers
- publisher: SAIEE
- isbn:
- issn: 1991-1696
- rank: 3766
- access_type: OPEN_ACCESS
- content_type: Journals
-
abstract: The use of uncooled infrared sensors in
thermal imaging is a fast growing market in the fields of security and
health. The integration of uncooled or room temperature infrared sensors
onto a silicon CMOS chip will facilitate the manufacture of large
imaging arrays. At the University of Pretoria we are researching the
integration of microbolometer infrared sensors onto CMOS readout
electronic circuits using post processing techniques. The microbolometer
utilises the change in resistance of a temperature sensitive resistive
material, e.g. vanadium oxide or a thin metal film, to measure the
amount of infrared radiation falling onto the device and heating the
device. The microbolometer structure should be thermally isolated from
the bulk silicon to achieve the required sensitivity. In this paper we
will describe the device structures, as well as the techniques we used
to determine experimentally the electrical, thermal and electro-thermal
properties of the devices. Of interest to us are the following
parameters: 1) temperature coefficient of the bolometer resistive layer,
2) thermal conductivity of the device, 3) thermal capacitance of the
total sensor structure and 4) the thermal time constant. The
microbolometer thermal characteristics can also be modelled and
simulated using CoventorWare software
- article_number: 8532183
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8532183
-
html_url:
https://ieeexplore.ieee.org/document/8532183/
-
abstract_url:
https://ieeexplore.ieee.org/document/8532183/
- publication_title: SAIEE Africa Research Journal
- conference_location:
- conference_dates:
- publication_number: 8475037
- is_number: 8532176
- publication_year: 2011
- publication_date: June 2011
- start_page: 40
- end_page: 48
- citing_paper_count: 1
- citing_patent_count: 0
- download_count: 89
- insert_date: 20181217
-
index_terms:
-
author_terms:
- Bolometers
- infrared imaging
-
dynamic_index_terms:
- Impedance
- Resistivity
- Thin Films
- Alumina
- Heat Transfer
- Heat Flow
- Heat Loss
- Atmospheric Pressure
- Barometric Pressure
- Sea Level Pressure
- Air Pressure
- Thermal Conductivity
- Heat Conduction
- Simulated Values
- Characteristic Length
- Pressure Conditions
- Thermal Resistance
- Area Detector
- Thermal Parameters
- Vacuum Conditions
- Test Device
- Thermal Detector
- Transient Behavior
- Thermal Sensors
- Thermal Constant
- Temperature Coefficient Of Resistance
- Thermoelectric Effect
- Conductivity Of Gas
- Gaseous Conduction
- University Of Pretoria
- Bias Current
- Metal Film
- Thermal Model
- Thermal Effects
- Diet-induced Thermogenesis
- Thermal Events
- Effective Conductivity
- Imaging System
- Microfabrication
- Micromachining
- Heat Capacity
- Specific Heat
- Thermal Properties
-
authors:
-
Author Name: M. du Plessis
Affiliation: Carl and Emily Fuchs Institute for
Microelectronics (CEFIM), Dept. of Electrical, Electronic & Computer
Engineering, University of Pretoria, Pretoria 0002, South Africa.
E-mail: monuko@up.ac.za
Author URL:
ID:
Order: 1
Author Affiliations:
-
Carl and Emily Fuchs Institute for Microelectronics (CEFIM),
Dept. of Electrical, Electronic & Computer Engineering,
University of Pretoria, Pretoria 0002, South Africa. E-mail:
monuko@up.ac.za
-
Author Name: J. Schoeman
Affiliation: Carl and Emily Fuchs Institute for
Microelectronics (CEFIM), Dept. of Electrical, Electronic & Computer
Engineering, University of Pretoria, Pretoria 0002, South Africa.
E-mail: monuko@up.ac.za
Author URL:
ID:
Order: 2
Author Affiliations:
-
Carl and Emily Fuchs Institute for Microelectronics (CEFIM),
Dept. of Electrical, Electronic & Computer Engineering,
University of Pretoria, Pretoria 0002, South Africa. E-mail:
monuko@up.ac.za
-
Author Name: W. Maclean
Affiliation: Carl and Emily Fuchs Institute for
Microelectronics (CEFIM), Dept. of Electrical, Electronic & Computer
Engineering, University of Pretoria, Pretoria 0002, South Africa.
E-mail: monuko@up.ac.za
Author URL:
ID:
Order: 3
Author Affiliations:
-
Carl and Emily Fuchs Institute for Microelectronics (CEFIM),
Dept. of Electrical, Electronic & Computer Engineering,
University of Pretoria, Pretoria 0002, South Africa. E-mail:
monuko@up.ac.za
-
Author Name: C. Schutte
Affiliation: Denel Aerospace Systems (Detek), P.O.
Box 7412. Centurion, 0046, South Africa.
Author URL:
ID:
Order: 4
Author Affiliations:
-
Denel Aerospace Systems (Detek), P.O. Box 7412. Centurion, 0046,
South Africa.
Image Sensor
- sensor_type: CMOS
- resolution: Varies by application
- dynamic_range: Varies by design
- pixel_size: Typically between 1-10 μm
- dark_current: Varies (generally low)
Optical Data
-
focal_length: Varies by application (e.g., 4.5mm for
smartphone cameras)
- aperture: Varies by lens (e.g., f/1.8 to f/2.8)
-
field_of_view: Varies by lens design (e.g., 90° to 120°
for wide-angle lenses)
-
distortion: Typically low due to design improvements
(e.g., <1%)
Performance Metrics
- frame_rate: 30-120 fps depending on application
- signal_to_noise_ratio: Typically 30-40 dB
- sensitivity: ISO 100 to 6400 or higher
- shutter_speed: Varies (e.g., 1/30s to 1/1000s)
-
power_consumption: Down to few mW for mobile
applications
- noise: Typically <5 e- for low-light conditions
Applications & Benefits
-
cell_imaging: Used in medical diagnostic tools and
microscopy
-
benefits: High sensitivity and resolution, compactness
for portable devices, low power consumption
Supporting Organizations
-
supported_by: Research credits may include universities
and technology firms in semiconductor research.
Manuscript Details
- publication_date: June 2011
Relevancy Score
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