Super Wide Area Cross Sectioning Using Broad Ar Ion Beam On Solder Bumping

• doi: 10.1109/IPFA53173.2021.9617355
• title: Super wide area cross sectioning using broad Ar ion beam on solder bumping
• publisher: IEEE
• isbn: 978-1-6654-3989-3
• issn: 1946-1542
• rank: 3671
• access_type: LOCKED
• content_type: Conferences
• abstract: Soldering is a popular jointing method for integrated circuits (IC) and CMOS image sensor packaging methods, such as flip-chip technology [1]. Generally, X-ray tomography is used for defect analysis of devices containing solders. However, with the miniaturization of devices, it has become difficult to observe more complex packaging failure mechanisms using X-ray tomography. Moreover, imaging the defects and internal features of the devices is difficult because of their small size. In addition, component analysis is not possible when using X-ray tomography. In this regard, SEM enables defect analysis by affording high-resolution observation of the cross-section of devices; thus, even the size of defects is smaller than 1 μm can be located. Usually, to understand the details of the interface between the solder and electrode, an electron microscope is used; however, the use of ion beam preparation methods—such as focused ion beam (FIB), which has a high position accuracy, and a broad Ar ion beam—for the preparation of large-area cross-sections is preferred. This is because it is difficult to prepare a fine cross-section owing to the different hardness of the materials. However, the IC is much larger than the process area of both the FIB and broad Ar ion beams. Therefore, a much wider area process is required to analyze several solder bumps simultaneously. Recently, we have been successful in developing a very wide-area Ar ion milling with the shield plate method, which facilitates the preparation of a precise cross-section with a width of approximately 8 mm. Herein, we discuss the principle of this method and demonstrate a wide-area preparation method for a system in package (SiP) with and without liquid nitrogen (LN2) cooling.
• article_number: 9617355
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9617355
• html_url: https://ieeexplore.ieee.org/document/9617355/
• abstract_url: https://ieeexplore.ieee.org/document/9617355/
• publication_title: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
• conference_location: Singapore, Singapore
• conference_dates: 15 Sept.-15 Oct. 2021
• publication_number: 9617229
• is_number: 9617230
• publication_year: 2021
• publication_date: 15 Sept.-15 Oct. 2021
• start_page: 1
• end_page: 5
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 160
• insert_date: 20211129
• index_terms:
  • ieee_terms:
    • Integrated circuits
    • Scanning electron microscopy
    • Failure analysis
    • Milling
    • Liquid nitrogen
    • X-ray tomography
    • Packaging
  • author_terms:
    • Ar ion beam
    • Cross-section
    • wide area
    • Scanning electron microscope
    • Solder bump
  • dynamic_index_terms:
    • Wide Area
    • Ion Beam
    • Broad Beam
    • Broad-beam
    • Ar Ion Beam
    • Ar-ion Beam
    • Broad Ion Beam
    • Broad-ion Beam
    • Broad-ion-beam
    • Electron Microscopy
    • Electrode
    • Scanning Electron Microscopy
    • System Software
    • Packaging System
    • Focused Ion Beam
    • Defect Size
    • Miniaturization Of Devices
    • Ion Milling
    • Acceleration Voltage
    • Sample Holder
    • Milling Process
    • Failure Analysis
    • Backscattered Electron Images
    • Solder Joints
    • EDS Mapping
    • Mechanical Polishing
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-3989-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-3988-6, isbnType: New-2005
• authors:
  • Author Name: Natsuko Asano
    Affiliation: JEOL Ltd., Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089172444
    ID: 37089172444
    Order: 1
    Author Affiliations:
    • JEOL Ltd., Tokyo, Japan
  • Author Name: Tamae Omoto
    Affiliation: JEOL Ltd., Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089167994
    ID: 37089167994
    Order: 2
    Author Affiliations:
    • JEOL Ltd., Tokyo, Japan
  • Author Name: Lu Jinfeng
    Affiliation: JEOL Ltd., Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089164663
    ID: 37089164663
    Order: 3
    Author Affiliations:
    • JEOL Ltd., Tokyo, Japan
  • Author Name: Shogo Kataoka
    Affiliation: JEOL Ltd., Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089175408
    ID: 37089175408
    Order: 4
    Author Affiliations:
    • JEOL Ltd., Tokyo, Japan
  • Author Name: Shunsuke Asahina
    Affiliation: JEOL Ltd., Tokyo, Japan
    Author URL: https://ieeexplore.ieee.org/author/37089167508
    ID: 37089167508
    Order: 5
    Author Affiliations:
    • JEOL Ltd., Tokyo, Japan

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Not specified
• benefits: Not specified

Supporting Organizations

• supported_by: JEOL Ltd.

Manuscript Details

• publication_date: 15 Sept.-15 Oct. 2021

Relevancy Score

• score: 5
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • cell_imaging
  • benefits

Processed JSON Filename

request_ecb606bd-8877-4a23-b889-25fb5962b9a3-super_wide_area_cross_sectioning_using_broad_ar_ion_beam_on_solder_bumping.json