Streamlined Models Of Cmos Image Sensors Carbon Impacts

• doi: 10.1109/DSD64264.2024.00041
• title: Streamlined Models of CMOS Image Sensors Carbon Impacts
• publisher: IEEE
• isbn: 979-8-3503-8039-2
• issn: 2639-3859
• rank: 3636
• access_type: LOCKED
• content_type: Conferences
• abstract: With the escalating concern about global warming, the environmental impact of electronic devices must be scru-tinized. Life Cycle Assessments (LCA) reveal that Integrated Circuits (ICs) are the primary contributors to greenhouse gas emissions in these devices. However, performing an inventory to determine the ICs impact is a complex task due to missing data and the existing studies on ICs have been neglecting CMOS Image Sensors (CIS). Despite the surge in CIS usage, particularly in smartphones, there is a lack of comprehensive models to assess their en-vironmental impact. This paper proposes a multi-level set of models that leverage available information while considering the specificities of CIS. The most comprehensive model incorporates factors such as the total silicon area, geographical location (influencing the energy mix), and the technology node. To accommodate scenarios with incomplete data, subsequent models are designed to effectively utilize averaged parameters. The proposed models are applied to sensors manufactured by STMicroelectronics and Sony, and the results are compared with existing LCA results from Fairphone. Our approach provides a more comprehensive understanding of the environmental impact of CIS, contributing to the broader goal of reducing the carbon footprint of electronic devices. Our results suggest that the carbon impact of a Fairphone 4 image sensor is likely higher than previously estimated, with a significant gap between our findings and the expected value.
• article_number: 10741688
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10741688
• html_url: https://ieeexplore.ieee.org/document/10741688/
• abstract_url: https://ieeexplore.ieee.org/document/10741688/
• publication_title: 2024 27th Euromicro Conference on Digital System Design (DSD)
• conference_location: Paris, France
• conference_dates: 28-30 Aug. 2024
• publication_number: 10741604
• is_number: 10741607
• publication_year: 2024
• publication_date: 28-30 Aug. 2024
• start_page: 250
• end_page: 257
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 79
• insert_date: 20241106
• index_terms:
  • ieee_terms:
    • Carbon footprint
    • CMOS image sensors
    • Environmental monitoring
    • Greenhouse gases
    • Carbon emissions
    • Integrated circuits
    • Life cycle assessment
    • Climate change
    • Global warming
    • Electronic equipment
    • Microelectronics
  • author_terms:
    • Carbon Footprint
    • CMOS Image Sensors (CIS)
    • Environmental Impact
    • Greenhouse Gas Emissions
    • Integrated Circuits (ICs)
    • Life Cycle Assessment (LCA)
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Environmental Impact
    • Environmental Issues
    • Environmental Concerns
    • Greenhouse Gas
    • CO2 Emissions
    • Greenhouse Gas Emissions
    • Carbon Emissions
    • Life Cycle Assessment
    • Energy Analysis
    • Integrated Circuit
    • Energy Mix
    • Technology Node
    • Impact Of Devices
    • Impact Of These Devices
    • Silicon Area
    • Toughness
    • Impact Energy
    • Impact Strength
    • Impact Resistance
    • Fabrication Process
    • Electrical Energy
    • Silicon Wafer
    • Electric Field Strength
    • Electric Intensity
    • Electric Field Intensity
    • Electricity Consumption
    • Sensitive Areas
    • Light Sensitivity
    • Photophobic
    • Carbon Intensity
    • Life Cycle Assessment Studies
    • Electrical Energy Consumption
    • Processing Nodes
    • Life Cycle Inventory
    • Silicon Devices
    • Power Usage
    • 3D Stacks
    • Mobile Camera
    • Mobile Phone Camera
    • Cell Phone Camera
    • Silicon Layer
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-8039-2, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-8038-5, isbnType: New-2005
• authors:
  • Author Name: Olivier Weppe
    Affiliation: Univ. Rennes, INSA Rennes, Rennes, France
    Author URL: https://ieeexplore.ieee.org/author/37086340734
    ID: 37086340734
    Order: 1
    Author Affiliations:
    • Univ. Rennes, INSA Rennes, Rennes, France
  • Author Name: Jérôme Chossat
    Affiliation: STMicroelectronics AMS/Imaging Division, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/156266995746502
    ID: 156266995746502
    Order: 2
    Author Affiliations:
    • STMicroelectronics AMS/Imaging Division, Grenoble, France
  • Author Name: Thibaut Marty
    Affiliation: Univ. Rennes, INSA Rennes, Rennes, France
    Author URL: https://ieeexplore.ieee.org/author/37086861382
    ID: 37086861382
    Order: 3
    Author Affiliations:
    • Univ. Rennes, INSA Rennes, Rennes, France
  • Author Name: Jean-Christophe Prévotet
    Affiliation: Univ. Rennes, INSA Rennes, Rennes, France
    Author URL: https://ieeexplore.ieee.org/author/37332553000
    ID: 37332553000
    Order: 4
    Author Affiliations:
    • Univ. Rennes, INSA Rennes, Rennes, France
  • Author Name: Maxime Pelcat
    Affiliation: Univ. Rennes, INSA Rennes, Rennes, France
    Author URL: https://ieeexplore.ieee.org/author/37546123600
    ID: 37546123600
    Order: 5
    Author Affiliations:
    • Univ. Rennes, INSA Rennes, Rennes, France

Image Sensor

• sensor_type: CMOS
• resolution: up to 200 MPixels
• dynamic_range: not specified
• pixel_size: 0.8 µm (for IMX582)
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: used as substitutes for full-frame regular cameras
• benefits: enhanced depth of field and bokeh effects

Supporting Organizations

• supported_by: STMicroelectronics, Sony

Manuscript Details

• publication_date: 28-30 Aug. 2024

Relevancy Score

• score: 10
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_efdafd34-12ca-4544-a0a2-93123881c383-streamlined_models_of_cmos_image_sensors_carbon_impacts.json