Stencil Printing And Flipchip Bonding For Assembly Of Pixelated Xray Detectors Using Pcbtype Interposer And Flexible Printed Circuit Boards

• doi: 10.23919/EMPC44848.2019.8951835
• title: Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards
• publisher: IEEE
• isbn: 978-1-7281-6291-1
• issn:
• rank: 3633
• access_type: LOCKED
• content_type: Conferences
• abstract: In recent years multi-layered Flexible Printed Circuit (FPC) boards have advanced considerably in complexity, allowing versatile designs for electronic packaging applications which require interconnect through-via [1]. This makes these boards also attractive for interposers (pitch-convertors) in X-ray detector applications where pixelated sensors are connected to readout Application-Specific Integrated Circuits (ASIC) in order to match different pixel-pitches between sensor and ASIC. Thin boards with total thickness of approx. 140μm are also available and desirable for low radiation absorption of detector packaging in high-energy particle experiments (e.g. CMOS imaging sensor for particle tracker [2,3]). These X-ray detector sensors and ASIC are based on a wide range of materials (Si, Cd(Zn)Te, GaAs). The mismatch in thermal expansion of these different materials is a major challenge. Bonding of sensors and ASIC to flexible boards increases the risk of distortion of the assembly, with potential delamination of components from the board. The paper describes the bonding processes. Stencil printing is used to form an array of dots from electrically conductive adhesive on the sensor, interposer or FPC. ASIC and interposer board are studded with a similar array of gold studs using a ball bonding technique. Subsequently flip-chip bonding is used to bond a studded component to an array of adhesive dots on the printed counterpart. Optimal bonding parameters are evaluated using shear testing and analysis of contact area. The flatness of boards is analysed. Bonded devices are tested for their electronic functionality as X-ray detectors.
• article_number: 8951835
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8951835
• html_url: https://ieeexplore.ieee.org/document/8951835/
• abstract_url: https://ieeexplore.ieee.org/document/8951835/
• publication_title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
• conference_location: Pisa, Italy
• conference_dates: 16-19 Sept. 2019
• publication_number: 8949329
• is_number: 8951752
• publication_year: 2019
• publication_date: 16-19 Sept. 2019
• start_page: 1
• end_page: 8
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 257
• insert_date: 20200109
• index_terms:
  • ieee_terms:
    • Detectors
    • Bonding
    • Flip-chip devices
    • Silicon
    • Sensor arrays
    • Wires
  • author_terms:
    • X-Ray Detector
    • Interposer
    • Multi-Material Bonding
    • Gold Ball Studding
    • Stencil Printing
    • Flip-Chip
  • dynamic_index_terms:
    • Printed Circuit Board
    • Circuit Board
    • Flexible Electronics
    • Flexible Printed Circuit Board
    • Flexible Circuit
    • X-ray Detector
    • Pixel Detector
    • Flexible Printed Circuit
    • Flip-chip Bonding
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Shear Test
    • Expansion Of Material
    • Electronic Packaging
    • Dot Arrays
    • Thermal Expansion Mismatch
    • Bond Strength
    • Bond Energy
    • Shear Force
    • Surface-mounted
    • Surface Mount Technology
    • Surface Mount
    • Pixel Array
    • Bond Force
    • Bond Wires
    • Optical Profile
    • Contact Pads
    • Gold Wire
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-7281-6291-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-0-9568086-6-0, isbnType: New-2005
• authors:
  • Author Name: Andreas Schneider
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37089131573
    ID: 37089131573
    Order: 1
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Simon P. Cross
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37087233953
    ID: 37087233953
    Order: 2
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Matthew D. Wilson
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37272086000
    ID: 37272086000
    Order: 3
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Matthew C. Veale
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37570833100
    ID: 37570833100
    Order: 4
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Matthew Hart
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/38246638600
    ID: 38246638600
    Order: 5
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Paul Seller
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37268558500
    ID: 37268558500
    Order: 6
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: Marcello Borri
    Affiliation: Daresbury Laboratory, SciTech Daresbury, Keckwick Lane, UK Research and Innovation, Science and Technology Facilities Council, Daresbury, Warrington, UK
    Author URL: https://ieeexplore.ieee.org/author/37085879594
    ID: 37085879594
    Order: 7
    Author Affiliations:
    • Daresbury Laboratory, SciTech Daresbury, Keckwick Lane, UK Research and Innovation, Science and Technology Facilities Council, Daresbury, Warrington, UK
  • Author Name: Dan Beckett
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37087230210
    ID: 37087230210
    Order: 8
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
  • Author Name: John D. Lipp
    Affiliation: Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK
    Author URL: https://ieeexplore.ieee.org/author/37296142600
    ID: 37296142600
    Order: 9
    Author Affiliations:
    • Rutherford Appleton Laboratory, Technology, Harwell Campus, UK Research and Innovation, Science and Technology Facilities Council, Didcot, UK

Image Sensor

• sensor_type: CMOS
• resolution: 80x80 pixels
• dynamic_range: Not specified
• pixel_size: 250µm x 500µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in medical imaging applications such as SPECT
• benefits: High energy X-ray spectroscopic imaging for various applications.

Supporting Organizations

• supported_by: UK Research and Innovation, Science and Technology Facilities Council, Rutherford Appleton Laboratory, Daresbury Laboratory

Manuscript Details

• publication_date: 16-19 Sept. 2019

Relevancy Score

• score: 8
• missing_fields:
  • dynamic_range
  • dark_current
  • readout_speed
  • noise_sources
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • pixel_size
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption

Processed JSON Filename

request_38604d4f-f38b-4134-8732-70e8d0c53abe-stencil_printing_and_flipchip_bonding_for_assembly_of_pixelated_xray_detectors_using_pcbtype_interposer_and_flexible_printed_circuit_boards.json