Spray Coating Process With Polymer Material For Insulation In Cistsv Waferlevelpackaging

• doi: 10.1109/ICEPT.2014.6922691
• title: Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging
• publisher: IEEE
• isbn: 978-1-4799-4707-2
• issn:
• rank: 3621
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper presents a novel spray coating process for the forming of sidewall insulation of through silicon via (TSV) which was a challenging process in CMOS image sensor (CIS) packaging. In conventional way, silicon oxide by plasma enhanced chemical vapor deposition (PECVD) is chosen as insulation material. In this paper, one kind of phenolic aldehyde polymer is deposited on the sidewall of though silicon via with the diameter of 75μm and depth of 100μm by novel spray coating process. To avoid the failure of TSV sidewall insulation and electrical interconnection characteristic, the thickness of polymer on the sidewall should be not less than 2μm. To achieve the insulation layer thickness target value, the temperature of spray coating process temperature was adjusted to control the viscosity of polymer. After the process optimization, the minimum thickness of sidewall polymer insulation layer is over 2.5μm meanwhile the conformal coverage characters of sidewall insulation layers are promoted.
• article_number: 6922691
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6922691
• html_url: https://ieeexplore.ieee.org/document/6922691/
• abstract_url: https://ieeexplore.ieee.org/document/6922691/
• publication_title: 2014 15th International Conference on Electronic Packaging Technology
• conference_location: Chengdu, China
• conference_dates: 12-15 Aug. 2014
• publication_number: 6905925
• is_number: 6922536
• publication_year: 2014
• publication_date: 12-15 Aug. 2014
• start_page: 437
• end_page: 440
• citing_paper_count: 7
• citing_patent_count: 0
• download_count: 426
• insert_date: 20141016
• index_terms:
  • ieee_terms:
    • Polymers
    • Insulation
    • Coatings
    • Packaging
    • Silicon
    • Through-silicon vias
    • Temperature measurement
  • author_terms:
    • CMOS Image Sensor (CIS)
    • Through Silicon Via (TSV)
    • Spray Coating
    • Polymer
  • dynamic_index_terms:
    • Polymeric Materials
    • Spray Coating
    • Wafer-level Packaging
    • Spray-coating Process
    • Layer Thickness
    • Sidewall
    • Side Walls
    • Image Sensor
    • Camera Sensor
    • Dielectric Layer
    • Insulation Layer
    • Polymer Viscosity
    • Kind Of Polymer
    • Polymer Thickness
    • Polymer Insulation
    • Polymer Dielectrics
    • Thickness Of The Dielectric Layer
    • Phenolic Polymer
    • Phenolic Aldehydes
    • Electrical Interconnection
    • Aspect Ratio
    • Polymer Solution
    • Gas Pressure
    • Polymer Layer
    • Wafer Surface
    • Plate Temperature
    • Thin Polymer Layer
    • Solution Point
    • Bosch Process
    • Low-temperature Process
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-4707-2, isbnType: New-2005
• authors:
  • Author Name: Yuechen Zhuang
    Affiliation: National Center for Advanced Packaging (NCAP China), Wuxi, P. R. China
    Author URL: https://ieeexplore.ieee.org/author/37085442440
    ID: 37085442440
    Order: 1
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China), Wuxi, P. R. China
  • Author Name: Daquan Yu
    Affiliation: Institute of Microelectronics, Chinese Academy of Sciences, Beijing, P. R. China
    Author URL: https://ieeexplore.ieee.org/author/37402186400
    ID: 37402186400
    Order: 2
    Author Affiliations:
    • Institute of Microelectronics, Chinese Academy of Sciences, Beijing, P. R. China
  • Author Name: Fengwei Dai
    Affiliation: National Center for Advanced Packaging (NCAP China), Wuxi, P. R. China
    Author URL: https://ieeexplore.ieee.org/author/37959712900
    ID: 37959712900
    Order: 3
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China), Wuxi, P. R. China
  • Author Name: Guoping Zhang
    Affiliation: Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, P. R. China
    Author URL: https://ieeexplore.ieee.org/author/38562636800
    ID: 38562636800
    Order: 4
    Author Affiliations:
    • Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, P. R. China
  • Author Name: Jun Fan
    Affiliation: HuaTian Technology (Kunshan) Co., Ltd, Kunshan, P. R. China
    Author URL: https://ieeexplore.ieee.org/author/37085494312
    ID: 37085494312
    Order: 5
    Author Affiliations:
    • HuaTian Technology (Kunshan) Co., Ltd, Kunshan, P. R. China

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in the text
• dynamic_range: Not specified in the text
• pixel_size: Not specified in the text
• dark_current: Not specified in the text

Optical Data

• focal_length: Not specified in the text
• aperture: Not specified in the text
• field_of_view: Not specified in the text
• distortion: Not specified in the text

Performance Metrics

• frame_rate: Not specified in the text
• signal_to_noise_ratio: Not specified in the text
• sensitivity: Not specified in the text
• shutter_speed: Not specified in the text
• power_consumption: Not specified in the text
• noise: Not specified in the text

Applications & Benefits

• cell_imaging: Applicable in a variety of applications such as smartphones, medical devices, and automotive systems.
• benefits: Enable digital imaging.

Supporting Organizations

• supported_by: National Center for Advanced Packaging, Institute of Microelectronics, Chinese Academy of Sciences, Shenzhen Institute of Advanced Technology, HuaTian Technology.

Manuscript Details

• publication_date: 12-15 Aug. 2014

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • focal_length
  • aperture
  • field_of_view
  • distortion

Processed JSON Filename

request_16787923-f907-4a49-9d1b-8af65fdcd0b7-spray_coating_process_with_polymer_material_for_insulation_in_cistsv_waferlevelpackaging.json