Simultaneous Electrothermal Test Method For Pyroelectric Microsensors

• doi: 10.1109/ITHERM.2006.1645497
• title: Simultaneous electro-thermal test method for pyroelectric microsensors
• publisher: IEEE
• isbn: 0-7803-9524-7
• issn: 1087-9870
• partnum: 06CH37733C
• rank: 3562
• access_type: LOCKED
• content_type: Conferences
• abstract: Pyroelectric film materials, including polyvinylidene fluoride (PVDF) and its copolymers (e.g., P(VDF/TrFe)), are attractive candidates for low-cost infrared detection and imaging applications due to their compatibility with CMOS processing and inexpensive packaging requirements compared to semiconductor-based detectors. The pyroelectric coefficient (p) describes the material's electric response to a change in sensor temperature and is the main contributor to the sensitivity and detectivity of the system. However, this value can vary greatly with film fabrication and poling processes, and its measurement is often highly coupled to the material's thermal diffusivity. This paper describes a new approach to film characterization that combines the popular "3-omega" technique for thermal characterization with a modified version of the laser intensity modulation method (LIMM) for determining the film's pyroelectric coefficient. The new method is capable of simultaneously measuring film conductivity, diffusivity, and pyroelectric coefficient. It could increase the accuracy of the pyroelectric measurements by providing in-situ thermal data to the electrical model instead of relying on published values or thermal measurements of a different sample. We also present a fabrication process that can be used to pole and measure a variety of pyroelectric materials and a mathematical framework to study the thermal phenomena of the setup. The thermal model is used to highlight the methodology's sensitivity to uncertainties in the geometric and material property values of the layers surrounding the pyroelectric film
• article_number: 1645497
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1645497
• html_url: https://ieeexplore.ieee.org/document/1645497/
• abstract_url: https://ieeexplore.ieee.org/document/1645497/
• publication_title: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.
• conference_location: San Diego, CA, USA
• conference_dates: 30 May-2 June 2006
• publication_number: 10950
• is_number: 34484
• publication_year: 2006
• publication_date: 30 May-2 June 2006
• start_page: 1314
• end_page: 1323
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 181
• insert_date: 20060705
• index_terms:
  • ieee_terms:
    • Testing
    • Pyroelectricity
    • Microsensors
    • Infrared detectors
    • Semiconductor films
    • Temperature sensors
    • Electric variables measurement
    • Semiconductor materials
    • Infrared imaging
    • Optical imaging
  • dynamic_index_terms:
    • Material Properties
    • Temperature Changes
    • Fabrication Process
    • Geometric Properties
    • Geometric Dimensions
    • Thermal Characteristics
    • Thermal Quality
    • Thermal Features
    • Thermal Diffusivity
    • Thermal Model
    • Electrical Response
    • Thermal Measurements
    • Heat Transfer
    • Heat Flow
    • Heat Loss
    • Thermal Properties
    • Surface Temperature
    • Penetration Depth
    • Thermal Stress
    • Heat Load
    • Heat Source
    • Oxide Layer
    • Figure Of Merit
    • 2D Model
    • Surface Temperature Measurements
    • Thermal Properties Of Materials
    • Heat Diffusion
    • Temperature Coefficient Of Resistance
    • Thermal Wave
    • Sensor Fabrication
    • Sensor Material
    • Textile Sensors
    • Testing Techniques
    • Triglycine Sulfate
    • Thermal Properties Of Films
    • Back Side
• isbn_formats:
  • format: Print ISBN, value: 0-7803-9524-7, isbnType: Historical
• authors:
  • Author Name: B. Smith
    Affiliation: Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA
    Author URL: https://ieeexplore.ieee.org/author/37088051791
    ID: 37088051791
    Order: 1
    Author Affiliations:
    • Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA
  • Author Name: A. Vanderbeek
    Affiliation: Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA
    Author URL: https://ieeexplore.ieee.org/author/37088051926
    ID: 37088051926
    Order: 2
    Author Affiliations:
    • Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA
  • Author Name: C. Amon
    Affiliation: Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA
    Author URL: https://ieeexplore.ieee.org/author/37265818700
    ID: 37265818700
    Order: 3
    Author Affiliations:
    • Mechanical Engineering Department & Institute for Complex Engineered Systems, Carnegie Mellon University, Pittsburgh, PA, USA

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: not specified

Manuscript Details

• publication_date: 30 May-2 June 2006

Relevancy Score

• score: 3
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by

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