Simulationbased Optimization Design Of An Iris Recognition Module Packaging

• doi: 10.1109/ICEPT56209.2022.9872748
• title: Simulation-based Optimization Design of an Iris Recognition Module Packaging
• publisher: IEEE
• isbn: 978-1-6654-9906-4
• issn:
• rank: 3559
• access_type: LOCKED
• content_type: Conferences
• abstract: At present, the iris recognition module is mainly realized based on board-level assembly and surface mount technology, which has some problems such as large size and high power consumption. To reduce the packaging volume and power consumption, an iris recognition module based on film-assisted plastic packaging technology is proposed, and the heat dissipation is analyzed and optimized to obtain better thermal performance. Under the conditions of the initial packaging structure and parameters, the junction temperature of the iris recognition module is 69.90 °C, compared with the CIS (CMOS image sensor) packaged by COB (Chip on Board), the volume is reduced by 20.63%, and the junction temperature is reduced by 1.88 °C. After further optimization, the junction temperature decreased by 13.90% and the thermal resistance decreased by 21.64%.
• article_number: 9872748
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9872748
• html_url: https://ieeexplore.ieee.org/document/9872748/
• abstract_url: https://ieeexplore.ieee.org/document/9872748/
• publication_title: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
• conference_location: Dalian, China
• conference_dates: 10-13 Aug. 2022
• publication_number: 9872527
• is_number: 9872536
• publication_year: 2022
• publication_date: 10-13 Aug. 2022
• start_page: 1
• end_page: 5
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 94
• insert_date: 20220909
• index_terms:
  • ieee_terms:
    • Temperature sensors
    • Heating systems
    • Thermal resistance
    • Packaging
    • Electronic packaging thermal management
    • Thermal conductivity
    • Thermal analysis
  • author_terms:
    • iris recognition module
    • CMOS image sensor
    • thermal analysis
    • junction temperature
  • dynamic_index_terms:
    • Software Module
    • Iris Recognition
    • Power Consumption
    • Thermal Resistance
    • Image Sensor
    • Camera Sensor
    • Heat Dissipation
    • Thermal Performance
    • Packing Structure
    • STRUCTURE Software
    • High Power Consumption
    • Surface-mounted
    • Surface Mount Technology
    • Surface Mount
    • Junction Temperature
    • Assembly Technology
    • Thermal Conductivity
    • Heat Conduction
    • Finite Element
    • Finite-element
    • Packaging Materials
    • Temperature Resistance
    • Packaging Process
    • Chip Area
    • Opening Size
    • Thermal Thickness
    • Packaging Costs
    • Glass Sheet
    • Orthogonal Test
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-9906-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-9905-7, isbnType: New-2005
• authors:
  • Author Name: Kun Chen
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089521341
    ID: 37089521341
    Order: 1
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Fengzhe Cao
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089517471
    ID: 37089517471
    Order: 2
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Dan Zheng
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089031112
    ID: 37089031112
    Order: 3
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Yongqi Tao
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089519539
    ID: 37089519539
    Order: 4
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Wei Liu
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37089520013
    ID: 37089520013
    Order: 5
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
  • Author Name: Daoguo Yang
    Affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China
    Author URL: https://ieeexplore.ieee.org/author/37281508700
    ID: 37281508700
    Order: 6
    Author Affiliations:
    • School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, China

Image Sensor

• sensor_type: CMOS
• resolution: 4.05mm x 3.4mm
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: used in iris recognition and other imaging applications
• benefits: miniaturization, low power consumption, increased efficiency

Supporting Organizations

• supported_by: Guilin University of Electronic Technology

Manuscript Details

• publication_date: 10-13 Aug. 2022

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • analog-to-digital conversion
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_657b541d-849f-498b-ab9a-d5525be8836d-simulationbased_optimization_design_of_an_iris_recognition_module_packaging.json