Sensitivity Of Cmos Based Imagers And Scaling Perspectives
- doi: 10.1109/16.877173
-
title: Sensitivity of CMOS based imagers and scaling
perspectives
- publisher: IEEE
- isbn:
- issn: 1557-9646
- rank: 3519
- access_type: LOCKED
- content_type: Journals
-
abstract: CMOS based imagers are beginning to compete
against CCDs in many areas of the consumer market because of their
system-on-a-chip capability. Sensitivity, however, is a main weakness of
CMOS imagers and enhancements and deviations from standard CMOS
processes are necessary to keep up sensitivity with downscaled process
generations. In the introductory section several definitions for the
sensitivity of image sensors are reviewed with regard to their potential
to allow meaningful comparison of different detector structures. In the
main section, the standard CMOS sensor architecture is compared to
detector structures designed to improve the sensitivity, namely the
photogate (PG), the pinned photodiode (PPD) and the thin film on ASIC
(TFA) approach. The latter uses a vertical integration of the photodiode
on top of the pixel transistors. A careful analysis of the relevant
electrical, optical and technological parameters and many previously
published experimental data for different imagers reveals that only the
PPD and the TFA enhancements provide satisfactory sensitivity and
withstand scaling down to 0.18 /spl mu/ processes. Due to the higher
fill factor and the higher quantum efficiency TFA provides significantly
better values than PPD. The radiometric sensitivity of a 5 /spl mu/m/spl
times/5 /spl mu/m TFA pixel is found to amount to 11.9 V/(/spl
mu//cm/sup 2/) for a 0.25 /spl mu/m process and 27.5 V/(/spl mu/J/cm/sup
2/) for a 0.18 /spl mu/m process.
- article_number: 877173
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=877173
-
html_url:
https://ieeexplore.ieee.org/document/877173/
-
abstract_url:
https://ieeexplore.ieee.org/document/877173/
-
publication_title: IEEE Transactions on Electron
Devices
- conference_location:
- conference_dates:
- publication_number: 16
- is_number: 18988
- publication_year: 2000
- publication_date: Nov. 2000
- start_page: 2110
- end_page: 2122
- citing_paper_count: 128
- citing_patent_count: 5
- download_count: 1476
- insert_date: 20020806
-
index_terms:
-
ieee_terms:
- Application specific integrated circuits
-
dynamic_index_terms:
- Quantum Efficiency
- Downscaling
- Image Sensor
- Camera Sensor
- Fill Factor
- Technological Parameters
- Engineering Parameters
- CMOS Process
- Standard CMOS
- PIN Photodiode
- Pixel Size
- Reflection Coefficient
- Reflection Loss
- Pixel Area
- Loss Of Sensitivity
- Depletion Region
- Space Charge Region
- Depletion Layer
- Depletion Zone
- Current Sensor
- Parasitic Capacitance
- Blue Channel
- Doping Level
- High Dynamic Range
- Dark Current
- Amorphous Silicon
- Silicon Thin Film
- Conversion Gain
- Silicide
- Si Photodiode
- Lateral Diffusion
- Small Pixel
- CMOS Technology
- Complete Transfer
- Potential Well
- Thin-film Solar Cells
- Thin-film Solar
- Thin-film Cells
-
authors:
-
Author Name: T. Lule
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37352114200
ID: 37352114200
Order: 1
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: S. Benthien
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37426914300
ID: 37426914300
Order: 2
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: H. Keller
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37434267200
ID: 37434267200
Order: 3
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: F. Mutze
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37087548402
ID: 37087548402
Order: 4
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: P. Rieve
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37370209500
ID: 37370209500
Order: 5
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: K. Seibel
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37426701600
ID: 37426701600
Order: 6
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: M. Sommer
Affiliation: Silicon Vision GmbH, Siegen,
Germany
Author URL:
https://ieeexplore.ieee.org/author/37563941800
ID: 37563941800
Order: 7
Author Affiliations:
- Silicon Vision GmbH, Siegen, Germany
-
Author Name: M. Bohm
Affiliation:
Author URL:
https://ieeexplore.ieee.org/author/37319627000
ID: 37319627000
Order: 8
Image Sensor
- sensor_type: CMOS
- resolution: 5.5µm pixel size
- dynamic_range: Not specified
- pixel_size: 5.5µm
-
dark_current: Comparable to a-Si at room temperature,
typically amounts to 10^-12 A/cm²
Optical Data
- focal_length: Not specified
- aperture: Not specified
- field_of_view: Not specified
- distortion: Not specified
Performance Metrics
- frame_rate: 14 Mpix/s readout speed
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signal_to_noise_ratio: 10 for first acceptable image,
40 for excellent image
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sensitivity: ISO 80 and 200 with and without color
filters respectively
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power_consumption: Low power consumption and possibly
lower cost compared to CCDs
-
noise: Includes fixed pattern noise and temporal noise
components
Applications & Benefits
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cell_imaging: Applications in consumer markets,
automotive vision, and medical devices
-
benefits: System-on-chip capability, compact design,
low power consumption
Supporting Organizations
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supported_by: Silicon Vision GmbH, University of
Siegen, various semiconductor companies involved in CMOS technology
Manuscript Details
- publication_date: Nov. 2000
Relevancy Score
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