Semiconductor Industry Outlook And New Technology Frontiers

• doi: 10.1109/IEDM50854.2024.10873484
• title: Semiconductor Industry Outlook and New Technology Frontiers
• publisher: IEEE
• isbn: 979-8-3503-6543-6
• issn: 0163-1918
• rank: 3511
• access_type: LOCKED
• content_type: Conferences
• abstract: The semiconductor industry is a dynamic landscape of innovation, where new materials, advanced processing techniques, and cutting -edge design converge to shape the future of technology. Powered by the principle of technology scaling, this field continues to push boundaries, enabling transformative applications in artificial intelligence (AI), high-performance computing (HPC), 5G/6G, autonomous driving, internet of things (IoT), and more. As we progress through time, scaling evolves, unlocking new levels of chip efficiency and performance. The horizon shines bright with the promise of breakthroughs in extreme ultraviolet (EUV) lithography, new device architectures like stacked complementary field-effect transistors (CFETs), novel low-dimensional channel materials, and the strategic synergy of design-technology co-optimization (DTCO), paving the way for exciting new technology eras. Additionally, advanced packaging techniques enhance system-level performance, blending computational power to surpass current limitations. The growth in specialty technology segments such as RF, non-volatile memory, power management, CMOS image sensors (CIS), and silicon photonics expands the range of innovative devices. This keynote paper will explore the latest advancements and emerging trends in the semiconductor industry, offering insights into how these cutting -edge frontiers will drive smart technology integration and create a brighter future for society.
• article_number: 10873484
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10873484
• html_url: https://ieeexplore.ieee.org/document/10873484/
• abstract_url: https://ieeexplore.ieee.org/document/10873484/
• publication_title: 2024 IEEE International Electron Devices Meeting (IEDM)
• conference_location: San Francisco, CA, USA
• conference_dates: 7-11 Dec. 2024
• publication_number: 10872985
• is_number: 10872987
• publication_year: 2024
• publication_date: 7-11 Dec. 2024
• start_page: 1
• end_page: 6
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 465
• insert_date: 20250218
• index_terms:
  • ieee_terms:
    • Performance evaluation
    • Technological innovation
    • Ultraviolet sources
    • Electronics industry
    • Ecosystems
    • System integration
    • Silicon photonics
    • Internet of Things
    • Transistors
    • Artificial intelligence
  • dynamic_index_terms:
    • Semiconductor Industry
    • Semiconductor Manufacturing
    • Semiconductor Fabrication
    • Power Calculation
    • Computational Power
    • Internet Of Things
    • High-performance Computing
    • Supercomputer
    • Image Sensor
    • Camera Sensor
    • Field-effect Transistors
    • Artificial Intelligence Applications
    • Advanced Software
    • Advanced Packaging
    • Power Management
    • Non-volatile Memory
    • Device Architecture
    • Scalable Technology
    • Channel Material
    • Extreme Ultraviolet
    • Silicon Photonics
    • Low-dimensional Materials
    • Throughput
    • Carbon Nanotubes
    • Power Consumption
    • Inverter
    • Transition Metal Dichalcogenides
    • Metal Dichalcogenides
    • Advanced Driver Assistance Systems
    • Driver Assistance Systems
    • Heterogeneous Integration
    • Multichip Module
    • Reticle
    • Optical Technology
    • Optical Engineering
    • Artificial Intelligence Systems
    • Electronic Design Automation
    • ECAD
    • EDA Tools
    • Ultra-low Power
    • Packaging Technology
    • Multi-input Multi-output
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-6543-6, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-6542-9, isbnType: New-2005
• authors:
  • Author Name: Yuh-Jier Mii
    Affiliation: Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37089467021
    ID: 37089467021
    Order: 1
    Author Affiliations:
    • Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Image Sensor

• sensor_type: CMOS
• resolution: N/A
• dynamic_range: N/A
• pixel_size: N/A
• dark_current: N/A

Optical Data

• focal_length: N/A
• aperture: N/A
• field_of_view: N/A
• distortion: N/A

Performance Metrics

• frame_rate: N/A
• signal_to_noise_ratio: N/A
• sensitivity: N/A
• shutter_speed: N/A
• power_consumption: N/A
• noise: N/A

Applications & Benefits

• cell_imaging: Applications include advanced driver assistance systems (ADAS) and smartphone camera performance enhancements.
• benefits: High-dynamic-range (HDR) capabilities, improved compactness for augmented reality (AR) and virtual reality (VR).

Supporting Organizations

• supported_by: N/A

Manuscript Details

• publication_date: 7-11 Dec. 2024

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • power_consumption
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • noise
  • dark_current

Processed JSON Filename

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