Reliable 300 Mm Wafer Level Hybrid Bonding For 3D Stacked Cmos Image Sensors

• doi: 10.1109/ECTC.2016.202
• title: Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
• publisher: IEEE
• isbn: 978-1-5090-1205-3
• issn:
• rank: 3442
• access_type: LOCKED
• content_type: Conferences
• abstract: 3D Stacked Image sensor is the stacking of a Back-Side Illuminated (BSI) CMOS Image Sensor on a logic die. It enables compact size, higher performances and additional functionalities compared to standard BSI sensors. The highest footprint reduction is obtained with 3D hybrid bonding with metal interconnects between top and bottom tiers. Hybrid bonding process with oxide / copper direct bonding allows the highest scalability of interconnect pitch. In this study we present the morphological and electrical characterizations of a test vehicle. The hybrid bonding of wafers from two different technology nodes is performed using a dual damascene integration for the hybrid bonding level. The main parameters to assess the bonding interface quality are analyzed such as the influence of the pad design, the impact of reworkability and wafer -- to-wafer overlays. The process robustness is studied through reliability tests and electromigration measurements.
• article_number: 7545530
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7545530
• html_url: https://ieeexplore.ieee.org/document/7545530/
• abstract_url: https://ieeexplore.ieee.org/document/7545530/
• publication_title: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
• conference_location: Las Vegas, NV, USA
• conference_dates: 31 May-3 June 2016
• publication_number: 7542794
• is_number: 7545393
• publication_year: 2016
• publication_date: 31 May-3 June 2016
• start_page: 869
• end_page: 876
• citing_paper_count: 72
• citing_patent_count: 0
• download_count: 4217
• insert_date: 20160818
• index_terms:
  • ieee_terms:
    • Bonding
    • Three-dimensional displays
    • Metals
    • Standards
    • Vehicles
    • Semiconductor device reliability
  • author_terms:
    • 3D stacked image sensor
    • 3D Hybrid BSI
    • hybrid bonding
    • reworkability
    • wafer-to-wafer overlay
    • reliability
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • 3D Stacks
    • Wafer Level
    • Hybrid Bonding
    • Morphological Features
    • Morphological Characteristics
    • Reliability Test
    • Top-tier
    • Test Vehicle
    • Technology Node
    • Electromigration
    • Footprint Reduction
    • Impedance
    • Resistivity
    • Atomic Force Microscopy
    • Grain Size
    • Contact Resistance
    • Interfacial Resistance
    • Contact Impedance
    • Electrical Performance
    • Alignment Accuracy
    • Feed Line
    • Thermal Storage
    • Thermal Energy Storage
    • Octagonal
    • Small Voids
    • Back-end-of-line
    • Padding Size
    • Metal Lines
    • High-temperature Storage
    • Large Voids
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5090-1205-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5090-1204-6, isbnType: New-2005
• authors:
  • Author Name: S. Lhostis
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37396261500
    ID: 37396261500
    Order: 1
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: A. Farcy
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37266012400
    ID: 37266012400
    Order: 2
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: E. Deloffre
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37688097800
    ID: 37688097800
    Order: 3
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: F. Lorut
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37427665800
    ID: 37427665800
    Order: 4
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: S. Mermoz
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37064182700
    ID: 37064182700
    Order: 5
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: Y. Henrion
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37085670613
    ID: 37085670613
    Order: 6
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: L. Berthier
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37594878700
    ID: 37594878700
    Order: 7
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: F. Bailly
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37542397500
    ID: 37542397500
    Order: 8
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: D. Scevola
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37974720100
    ID: 37974720100
    Order: 9
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: F. Guyader
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37293906100
    ID: 37293906100
    Order: 10
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: F. Gigon
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37088711386
    ID: 37088711386
    Order: 11
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: C. Besset
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37296708200
    ID: 37296708200
    Order: 12
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: S. Pellissier
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37088706246
    ID: 37088706246
    Order: 13
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: L. Gay
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37088711235
    ID: 37088711235
    Order: 14
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: N. Hotellier
    Affiliation: STMicroelectronics, Crolles Cedex, France
    Author URL: https://ieeexplore.ieee.org/author/37294219900
    ID: 37294219900
    Order: 15
    Author Affiliations:
    • STMicroelectronics, Crolles Cedex, France
  • Author Name: A. -L. Le Berrigo
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37088709021
    ID: 37088709021
    Order: 16
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: S. Moreau
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37604277500
    ID: 37604277500
    Order: 17
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: V. Balan
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37583784300
    ID: 37583784300
    Order: 18
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: F. Fournel
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37325348900
    ID: 37325348900
    Order: 19
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: A. Jouve
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37401785900
    ID: 37401785900
    Order: 20
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: S. Chéramy
    Affiliation: CEA, LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37401683300
    ID: 37401683300
    Order: 21
    Author Affiliations:
    • CEA, LETI, Grenoble, France
  • Author Name: M. Arnoux
    Affiliation: STMicroelectronics, Crolles, FR
    Author URL: https://ieeexplore.ieee.org/author/37086375248
    ID: 37086375248
    Order: 22
    Author Affiliations:
    • STMicroelectronics, Crolles, FR
  • Author Name: B. Rebhan
    Affiliation: EV Group, St. Florian/Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/38269002400
    ID: 38269002400
    Order: 23
    Author Affiliations:
    • EV Group, St. Florian/Inn, Austria
  • Author Name: G. A. Maier
    Affiliation: Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria
    Author URL: https://ieeexplore.ieee.org/author/37085408169
    ID: 37085408169
    Order: 24
    Author Affiliations:
    • Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria
  • Author Name: L. Chitu
    Affiliation: Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria
    Author URL: https://ieeexplore.ieee.org/author/37085751349
    ID: 37085751349
    Order: 25
    Author Affiliations:
    • Materials Center Leoben Forschung GmbH (MCL), Leoben, Austria

Image Sensor

• sensor_type: CMOS
• resolution: Not specified (focused on hybrid bonding structure and performance rather than specific sensor resolution)
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Enables compact size, higher performance, additional functionalities across various applications including smartphones and automotive systems.
• benefits: Footprint reduction, improved power efficiency, and enhanced performance through the use of 3D stacking and hybrid bonding.

Supporting Organizations

• supported_by: STMicroelectronics, CEA, LETI, MINATEC Campus, EV Group, Materials Center Leoben Forschung GmbH (MCL)

Manuscript Details

• publication_date: 31 May-3 June 2016

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_1bc49404-ec0f-4f01-b6c3-81b72203955a-reliable_300_mm_wafer_level_hybrid_bonding_for_3d_stacked_cmos_image_sensors.json