Reliability Of Instant Bonding Of Cucu Joints Thermal Cycling And Electromigration Tests

• doi: 10.1109/IMPACT50485.2020.9268567
• title: Reliability of Instant Bonding of Cu-Cu joints: Thermal Cycling and Electromigration Tests
• publisher: IEEE
• isbn: 978-1-7281-9852-1
• issn: 2150-5934
• rank: 3440
• access_type: LOCKED
• content_type: Conferences
• abstract: Hybrid bonding of fine pitch Cu pad and inorganic dielectrics has been carried out for improving chip performance, such as CMOS image sensor, so reliability tests gradually get high attention [1-3]. Thermal stress-induced failure is a big issue for interconnects of chips, and TCT is a popular way for related test [4]. Due to the shrinkage of interconnects for high density I/O, EM damages will play an important role in the future [5]. Each test has unique failure modes, and most of reliability tests depend on the stress or current distribution. Simulation of those distributions are an efficient method to explain the damages of reliability tests [6].
• article_number: 9268567
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9268567
• html_url: https://ieeexplore.ieee.org/document/9268567/
• abstract_url: https://ieeexplore.ieee.org/document/9268567/
• publication_title: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
• conference_location: Taipei, Taiwan
• conference_dates: 21-23 Oct. 2020
• publication_number: 9268496
• is_number: 9268533
• publication_year: 2020
• publication_date: 21-23 Oct. 2020
• start_page: 91
• end_page: 94
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 498
• insert_date: 20201130
• index_terms:
  • ieee_terms:
    • Bonding
    • Resistance
    • Reliability
    • Electromigration
    • Dielectrics
    • Electronic components
    • Universal Serial Bus
  • dynamic_index_terms:
    • Electromigration
    • Reliability Test
    • Current Distribution
    • Stress Distribution
    • Failure Modes
    • High Attention
    • Popular Way
    • Bond Strength
    • Bond Energy
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Resistance Change
    • Impedance Changes
    • Finite Element Analysis
    • Finite-element Analysis
    • Contact Resistance
    • Interfacial Resistance
    • Contact Impedance
    • Focused Ion Beam
    • Flip-chip
    • Microbumps
    • High-temperature Storage
    • Temperature Coefficient Of Resistance
    • Post Annealing
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-7281-9852-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-7281-9851-4, isbnType: New-2005
• authors:
  • Author Name: Kai-Cheng Shie
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    Author URL: https://ieeexplore.ieee.org/author/37086853884
    ID: 37086853884
    Order: 1
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
  • Author Name: Po-Ning Hsu
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    Author URL: https://ieeexplore.ieee.org/author/37086948007
    ID: 37086948007
    Order: 2
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
  • Author Name: Yu-Jin Li
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    Author URL: https://ieeexplore.ieee.org/author/37086450053
    ID: 37086450053
    Order: 3
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
  • Author Name: King-Ning Tu
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    Author URL: https://ieeexplore.ieee.org/author/37272636700
    ID: 37272636700
    Order: 4
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    • International College of Semiconductor Technology, National Chiao Tung University, Hsinchu, Taiwan 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
  • Author Name: Chih Chen
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC
    Author URL: https://ieeexplore.ieee.org/author/37311050900
    ID: 37311050900
    Order: 5
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan, ROC

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: not specified
• benefits: not specified

Supporting Organizations

• supported_by: Center for the Semiconductor Technology Research, Ministry of Education (MOE) in Taiwan, Ministry of Science and Technology, Taiwan

Manuscript Details

• publication_date: 21-23 Oct. 2020

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits

Processed JSON Filename

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