Reliability Evaluation Of Interconnection In Com Package

• doi: 10.1109/ICEPT.2018.8480759
• title: Reliability Evaluation of Interconnection in COM Package
• publisher: IEEE
• isbn: 978-1-5386-6387-5
• issn:
• rank: 3436
• access_type: LOCKED
• content_type: Conferences
• abstract: A novel package structure for CMOS image sensor (CIS) is proposed as COM (Chip on Module) to lower the costs. Its reliability has been verified systematically by functional tests, pull tests and micro interfacial observation after high temperature and humidity storage (THS) reliability tests at 85°C/85%RH for 240h and 1000h. These measurements are focused on the eutectic Sn-57Bi solder joint, connecting gold wire and FPC, which is the most vulnerable part to failure because of the rapid diffusion of Au. A few addition of silver dispersed in Sn-57Bi solder is also found to have a positive effect on the reliability of the joint, since silver can obstruct the diffusion of both Au and Sn atoms and lead to a less amount of IMC at the interface, less kirkendall voids and a much higher tensile strength. Furthermore, a theoretical model for Au/Sn interdiffusion is also built to qualitatively explain the growth of IMC and the influence of silver during reliability tests.
• article_number: 8480759
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8480759
• html_url: https://ieeexplore.ieee.org/document/8480759/
• abstract_url: https://ieeexplore.ieee.org/document/8480759/
• publication_title: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)
• conference_location: Shanghai, China
• conference_dates: 8-11 Aug. 2018
• publication_number: 8464037
• is_number: 8480417
• publication_year: 2018
• publication_date: 8-11 Aug. 2018
• start_page: 1528
• end_page: 1532
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 141
• insert_date: 20181004
• index_terms:
  • ieee_terms:
    • Gold
    • Silver
    • Wires
    • Humidity
    • Temperature measurement
    • Reliability theory
  • author_terms:
    • CMOS image sensor
    • Au/Sn interdiffusion
    • IMC
    • Reliability
  • dynamic_index_terms:
    • Function Tests
    • High Strength
    • Tensile Strength
    • Reliability Test
    • High Humidity
    • Image Sensor
    • Camera Sensor
    • High Storage
    • High Tensile Strength
    • Packing Structure
    • STRUCTURE Software
    • Diffusion Of Atoms
    • Au Atoms
    • Gold Wire
    • Sn Atoms
    • High-temperature Storage
    • High-temperature Test
    • Solder Joints
    • Scanning Electron Microscopy
    • Sample Groups
    • Intermetallic
    • Metal Compounds
    • Intermetallic Compounds
    • Reaction-diffusion
    • Reaction Diffusion
    • Conventional Packaging
    • Conventional Software
    • Joint Strength
    • Amount Of Au
    • Eutectic Phase
    • Lamellar Phase
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-5386-6387-5, isbnType: New-2005
  • format: USB ISBN, value: 978-1-5386-6385-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-5386-6386-8, isbnType: New-2005
• authors:
  • Author Name: Jin Wang
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37086471047
    ID: 37086471047
    Order: 1
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
  • Author Name: Xinnan Hou
    Affiliation: GalaxyCore Inc, Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086471666
    ID: 37086471666
    Order: 2
    Author Affiliations:
    • GalaxyCore Inc, Shanghai, China
  • Author Name: Jianming Li
    Affiliation: GalaxyCore Inc, Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086471808
    ID: 37086471808
    Order: 3
    Author Affiliations:
    • GalaxyCore Inc, Shanghai, China
  • Author Name: Qian Wang
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37291370900
    ID: 37291370900
    Order: 4
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
  • Author Name: Ke Du
    Affiliation: GalaxyCore Inc, Shanghai, China
    Author URL: https://ieeexplore.ieee.org/author/37086470601
    ID: 37086470601
    Order: 5
    Author Affiliations:
    • GalaxyCore Inc, Shanghai, China
  • Author Name: Jian Cai
    Affiliation: Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China
    Author URL: https://ieeexplore.ieee.org/author/37291518200
    ID: 37291518200
    Order: 6
    Author Affiliations:
    • Department of Microelectronics and Nanoelectronics, Tsinghua University, Beijing, China

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors are widely used in consumer electronics, automotive electronics, and security fields.
• benefits: Lower costs compared to traditional methods, improved reliability, and adaptability in various applications.

Supporting Organizations

• supported_by: Tsinghua University, GalaxyCore Inc.

Manuscript Details

• publication_date: 8-11 Aug. 2018

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_4c5aeca2-2462-4ba0-8f1c-cd4c40f84aab-reliability_evaluation_of_interconnection_in_com_package.json