Reflowable Ism Wlp

• doi: 10.1109/ECTC.2008.4549985
• title: Reflowable ISM WLP
• publisher: IEEE
• isbn: 978-1-4244-2231-9
• issn: 2377-5726
• partnum: 08CH38006
• rank: 3431
• access_type: LOCKED
• content_type: Conferences
• abstract: A new ISM (image sensor module) WLP (wafer level package) for reflow process is designed, fabricated and tested. The proposed ISM WLP is composed of polymer bonding layer, glass cap wafer for particle free process and CIS (CMOS Image Sensor) chip wafer which has micro via hole interconnection. During the last decades, WLP is highlighted as the next generation ISM Package method for many advantages like high yield (particle free process), small form factor (3D interconnection), low assembly cost and so on. Nevertheless these benefits, there are some difficulties like micro via hole fabrication, low temperature insulation process (inside hole), bottom side oxide etching process, warpage control according to wafer level bonding using different material, and whole process temperature limitation for micro lens damage. Among various fabrication methods for ISM package, COB (Chip on board), COF (Chip on film), and L, T contact WLP from ShellCase are generally used. In case of COB and COF package, it has difficulty in particle control during assembly process. In case of ShellCase type WLP has very complicated fabrication process. Additionally, most of above package has disadvantage in size point of view. Through suggested ISM WLP using thru interconnection via is realized. And we can good photo image using fabricated WLP. It can not only solve problems of conventional packaging structures but also tremendously reduce the manufacturing & assembly cost (include time) of ISM package and realize real chip scale package.
• article_number: 4549985
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4549985
• html_url: https://ieeexplore.ieee.org/document/4549985/
• abstract_url: https://ieeexplore.ieee.org/document/4549985/
• publication_title: 2008 58th Electronic Components and Technology Conference
• conference_location: Lake Buena Vista, FL
• conference_dates: 27-30 May 2008
• publication_number: 4542565
• is_number: 4549927
• publication_year: 2008
• publication_date: 27-30 May 2008
• start_page: 297
• end_page: 302
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 165
• insert_date: 20080624
• index_terms:
  • ieee_terms:
    • Wafer scale integration
    • Assembly
    • Fabrication
    • Chip scale packaging
    • Wafer bonding
    • Costs
    • Process control
    • Image sensors
    • Process design
    • Testing
  • dynamic_index_terms:
    • Wafer-level Packaging
    • Low Cost
    • Fabrication Process
    • Image Sensor
    • Camera Sensor
    • Etching Process
    • Small Form Factor
    • Microlenses
    • Micro Lens
    • Oxidative Etching
    • Shear Stress
    • Shear Strength
    • Passivation Layer
    • Surface Passivation
    • Central Portion
    • Scallop
    • Low-temperature Process
    • Copper Plate
    • Dry Etching
    • Etching Rate
    • Pyrex Glass
    • Glass Wafer
    • Camera Module
    • Electrical Interconnection
• isbn_formats:
  • format: CD, value: 978-1-4244-2231-9, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4244-2230-2, isbnType: New-2005
• authors:
  • Author Name: Won Kyu Jeung
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087828168
    ID: 37087828168
    Order: 1
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Chang Hyun Lim
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087528481
    ID: 37087528481
    Order: 2
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Jingli Yuan
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087826981
    ID: 37087826981
    Order: 3
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Seung Wook Park
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37088149367
    ID: 37088149367
    Order: 4
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Seog Moon Choi
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087296466
    ID: 37087296466
    Order: 5
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
  • Author Name: Sung Yi
    Affiliation: Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea
    Author URL: https://ieeexplore.ieee.org/author/37087255019
    ID: 37087255019
    Order: 6
    Author Affiliations:
    • Samsung Electro Mechanics Company Limited, Suwon, Gyeonggi, South Korea

Image Sensor

• sensor_type: CMOS
• resolution: VGA (640x480)
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Not specified
• benefits: Compact overall device size, low temperature process suitable for mass production.

Supporting Organizations

• supported_by: Samsung Electro-Mechanics Co., LTD.

Manuscript Details

• publication_date: 27-30 May 2008

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • signal_to_noise_ratio
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_c02e9b32-b93e-4210-b64c-590c45469823-reflowable_ism_wlp.json