Recent Innovations In Cmos Image Sensors

• doi: 10.1109/ASMC.2011.5898219
• title: Recent innovations in CMOS image sensors
• publisher: IEEE
• isbn: 978-1-61284-408-4
• issn: 1078-8743
• partnum: 11CH38833
• rank: 3423
• access_type: LOCKED
• content_type: Conferences
• abstract: The trend in semiconductor manufacturing over the last decade has been an accelerated rate for both materials integration and wafer fabrication process development. While the cutting edge of semiconductor technology is driven by digital logic and memory applications, several other technology sectors benefit from innovation by the leaders. Of these technology sectors, image sensor manufacturers have realized many benefits from the selective use of developments within advanced technology node manufacturing. The motivations for the imaging industry to pursue Moore's Law type of scaling are comparable to that of the broader semiconductor industry. Additionally, image sensor companies seek a reduction of camera module form factor, an increase in pixel resolution, and an increase in pixel array performance. Today, semi-professional grade digital single-lens reflex (DSLR) pixels have scaled down to the size of what were state-of-the-art “small pixel” consumer grade camera phone sensors just a few years ago. The pixel size of recent camera phones has shrunk to 1.12 μm. The resolution for recent camera phones has reached 16.4 Mp. Beyond silicon foundry processes, imaging companies must also concern themselves with the optical systems and packaging solutions required to integrate their silicon devices with the consumer electronics supply chain. Chipworks, as a supplier of competitive intelligence to the semiconductor and electronics industries, monitors the evolution of image sensor technologies as they come into production. Chipworks has obtained charge-coupled devices (CCD) and CMOS image sensor (CIS) chips from leading manufacturers and performed structural, compositional, and design analyses to benchmark the technology of the market leaders.
• article_number: 5898219
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5898219
• html_url: https://ieeexplore.ieee.org/document/5898219/
• abstract_url: https://ieeexplore.ieee.org/document/5898219/
• publication_title: 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
• conference_location: Saratoga Springs, NY, USA
• conference_dates: 16-18 May 2011
• publication_number: 5875050
• is_number: 5898157
• publication_year: 2011
• publication_date: 16-18 May 2011
• start_page: 1
• end_page: 5
• citing_paper_count: 18
• citing_patent_count: 0
• download_count: 2829
• insert_date: 20110620
• index_terms:
  • ieee_terms:
    • Pixel
    • Silicon
    • Image sensors
    • Optical sensors
    • Bismuth
    • Transistors
    • Lenses
  • author_terms:
    • CMOS Image Sensors
    • Advanced Processes
    • Advanced Materials
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • CCD Camera
    • Charge-coupled Device
    • Pixel Size
    • Form Factor
    • Semiconductor Industry
    • Semiconductor Manufacturing
    • Semiconductor Fabrication
    • Smartphone Camera
    • Phone Camera
    • Pixel Array
    • Moore’s Law
    • Small Pixel
    • Camera Module
    • Near Future
    • Tungsten
    • Wolfram
    • Processing Technology
    • Engineering Process
    • Fluorescent Light
    • Fluorescent Lamps
    • Fluorescent Tubes
    • Optical Path
    • Fill Factor
    • Silicon Nitride
    • CMOS Process
    • Microlenses
    • Micro Lens
    • PIN Photodiode
    • Photocathode
    • Color Filter
    • Small Form Factor
    • Nitride Films
    • Angular Response
    • Metal Interconnects
    • Deep Trench
• isbn_formats:
  • format: Print ISBN, value: 978-1-61284-408-4, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-61284-409-1, isbnType: New-2005
• authors:
  • Author Name: Ray Fontaine
    Affiliation: Technology Analysis Group, Chipworks, Inc., Ottawa, ONT, Canada
    Author URL: https://ieeexplore.ieee.org/author/38023116600
    ID: 38023116600
    Order: 1
    Author Affiliations:
    • Technology Analysis Group, Chipworks, Inc., Ottawa, ONT, Canada

Image Sensor

• sensor_type: CMOS
• resolution: 16.4 Mp
• dynamic_range: Not specified
• pixel_size: 1.12 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in consumer grade CMOS image sensors for mobile applications, including camera phones, laptops, tablets, etc.
• benefits: Enable digital imaging in a variety of applications, provide improvements in pixel resolution, form factor, and performance.

Supporting Organizations

• supported_by: Chipworks Inc.

Manuscript Details

• publication_date: 16-18 May 2011

Relevancy Score

• score: 10
• missing_fields:
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_4e9bde85-26ba-44b7-9428-09de779c392e-recent_innovations_in_cmos_image_sensors.json