Process Integration Of Backside Illuminated Image Sensor With Thin Wafer Handling Technology

• doi: 10.1109/ECTC.2013.6575834
• title: Process integration of backside illuminated image sensor with thin wafer handling technology
• publisher: IEEE
• isbn: 978-1-4799-0233-0
• issn: 2377-5726
• rank: 3317
• access_type: LOCKED
• content_type: Conferences
• abstract: In this research, a new structure and process integration for backside illuminated CMOS image sensor by using thin wafer handling technology is proposed. First of all, the wafer of CMOS image sensor is temporarily bonded to a silicon carrier wafer with thermal plastic material and ZoneBond technology. Then the CMOS wafer is thinned down to few microns to detect the light from the backside. After thinning process, the backside is permanently bonded to a glass carrier substrate with a transparent thermal set bonding material. By using a special trim from glass step, the temporarily bonded silicon carrier could be removed. Cu/Sn micro-bump is then fabricated at the front-side of the CMOS image sensor. No TSVs are needed in the proposed structure. A 300 mm silicon wafer with micro bumps bonded on 500 μm-thick glass wafer is demonstrated. Void free bonding is obtained by IR inspection both in temporary bonding and permanent bonding processes. The thickness of the silicon wafer is measured by IR system and the average thickness of the silicon wafer is 6.4 μm. After thinning, 1 μm TTV is obtained because the thermal plastic material flow during bonding process resulted in excellent planarization. From the cross sectional SEM image, Cu/Sn micro bump with thickness 4 μm/5 μm is formed at the front-side of the CMOS image sensor. The run-out issues from CTE mismatch is also discussed in this study.
• article_number: 6575834
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6575834
• html_url: https://ieeexplore.ieee.org/document/6575834/
• abstract_url: https://ieeexplore.ieee.org/document/6575834/
• publication_title: 2013 IEEE 63rd Electronic Components and Technology Conference
• conference_location: Las Vegas, NV, USA
• conference_dates: 28-31 May 2013
• publication_number: 6573226
• is_number: 6575533
• publication_year: 2013
• publication_date: 28-31 May 2013
• start_page: 1880
• end_page: 1886
• citing_paper_count: 5
• citing_patent_count: 1
• download_count: 721
• insert_date: 20130808
• index_terms:
  • ieee_terms:
    • Bonding
    • Glass
    • CMOS image sensors
    • Silicon
    • Resists
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Thin Wafer
    • Backside Illuminated
    • Structural Integrity
    • Silicon Wafer
    • Thermal Materials
    • Cross-sectional SEM Images
    • Thick Glass
    • Flip-chip
    • Microbumps
    • Thick Wafer
    • CCD Camera
    • Charge-coupled Device
    • Intermetallic
    • Metal Compounds
    • Intermetallic Compounds
    • Electroplating
    • Electrochemical Deposition
    • Drying Process
    • Etching Process
    • Front Side
    • Wet Process
    • Dry Etching
    • Width Of Zone
    • Dry Etching Process
    • Grinding Process
    • Peeling Off
    • Photolithography Process
    • Metal Interconnects
    • Diamond Blade
• isbn_formats:
  • format: Print ISBN, value: 978-1-4799-0233-0, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4799-0232-3, isbnType: New-2005
• authors:
  • Author Name: H. H. Chang
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37280774800
    ID: 37280774800
    Order: 1
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. H. Chien
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/38183080700
    ID: 38183080700
    Order: 2
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: H. C. Fu
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37286401500
    ID: 37286401500
    Order: 3
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: W. L. Tsai
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/38182138200
    ID: 38182138200
    Order: 4
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. W. Chiang
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37290982400
    ID: 37290982400
    Order: 5
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. T. Ko
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37292392400
    ID: 37292392400
    Order: 6
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: Y. H. Chen
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37073105900
    ID: 37073105900
    Order: 7
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: W. C. Lo
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37283460600
    ID: 37283460600
    Order: 8
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: K. C. Su
    Affiliation: Brewer Science, Inc., Taipei, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37088697169
    ID: 37088697169
    Order: 9
    Author Affiliations:
    • Brewer Science, Inc., Taipei, Taiwan
  • Author Name: C. S. Li
    Affiliation: Brewer Science, Inc., Taipei, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37088697225
    ID: 37088697225
    Order: 10
    Author Affiliations:
    • Brewer Science, Inc., Taipei, Taiwan

Image Sensor

• sensor_type: CMOS
• resolution: not explicitly stated
• dynamic_range: not explicitly stated
• pixel_size: below 1.4 μm node
• dark_current: not explicitly stated

Optical Data

• focal_length: not explicitly stated
• aperture: not explicitly stated
• field_of_view: not explicitly stated
• distortion: not explicitly stated

Performance Metrics

• frame_rate: not explicitly stated
• signal_to_noise_ratio: not explicitly stated
• sensitivity: not explicitly stated
• shutter_speed: not explicitly stated
• power_consumption: not explicitly stated
• noise: temporal noise and fixed-pattern noise

Applications & Benefits

• cell_imaging: used in medical devices, smartphones, automotive systems
• benefits: faster, cheaper, and more power efficient than CCD image sensors

Supporting Organizations

• supported_by: Ministry of Economic Affairs (MOEA), Electronics & Optoelectronics Lab of ITRI, Brewer Science, DISCO, SUSS

Manuscript Details

• publication_date: 28-31 May 2013

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption

Processed JSON Filename

request_074b6600-9a57-433b-b441-4df3b44d2b80-process_integration_of_backside_illuminated_image_sensor_with_thin_wafer_handling_technology.json