Process Integration For Backside Illuminated Image Sensor Stacked With Analogtodigital Conversion Chip

• doi: 10.1109/ICEP.2014.6826657
• title: Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip
• publisher: IEEE
• isbn: 978-4-904090-10-7
• issn:
• rank: 3315
• access_type: LOCKED
• content_type: Conferences
• abstract: In this research, a new structure and process integration for backside illuminated CMOS image sensor by using thin wafer handling technology is proposed. First of all, the wafer of a 3 Mega pixel CMOS image sensor is temporary bonded to a silicon carrier wafer with thermal plastic material and ZoneBond technology. Then the CMOS wafer is thinned down to few microns to detect the light from the backside. The backside is then permanently bonded to a glass carrier substrate with a transparent thermal set bonding material. After the glass permanent bonding process, the temporary bonded silicon carrier could be removed. Cu/Sn micro-bump is fabricated at the front-side of the CMOS image sensor, thus no TSVs are needed in the proposed structure. A 3 Mega pixel CMOS wafer with micro-bumps bonded on 500µm-thick glass wafer is demonstrated. Void-free bonding is obtained both in temporary bonding and permanent bonding processes. The thickness of the CMOS image sensor wafer is less than 10 µm after thinning and the total thickness variation is around 1 µm. Thermal plastic material is used for temporary bonding because it flows during bonding process and resulted in excellent planarization. From the cross-section SEM image, Cu/Sn micro-bump is formed at the front-side of the CMOS image sensor and the ENIG UBM is formed on the front side of the Analog-to-Digital Conversion wafer. A 3 Mega pixel image is captured and demonstrated in this research. The proposed backside illuminated CMOS image sensor structure and process integration are processed in wafer level, therefore enabling a low cost technology which can be manufactured using existing infrastructure. By using thin wafer handling technology, direct fusion bond and TSV processes are not needed which provides a low cost wafer level solution.
• article_number: 6826657
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6826657
• html_url: https://ieeexplore.ieee.org/document/6826657/
• abstract_url: https://ieeexplore.ieee.org/document/6826657/
• publication_title: 2014 International Conference on Electronics Packaging (ICEP)
• conference_location: Toyama, Japan
• conference_dates: 23-25 April 2014
• publication_number: 6821728
• is_number: 6826643
• publication_year: 2014
• publication_date: 23-25 April 2014
• start_page: 39
• end_page: 43
• citing_paper_count: 3
• citing_patent_count: 0
• download_count: 558
• insert_date: 20140609
• index_terms:
  • ieee_terms:
    • Bonding
    • CMOS image sensors
    • Etching
    • Tin
    • Materials
    • Three-dimensional displays
  • author_terms:
    • Temporary Bonding/De-Bonding
    • Chip-Package Interaction
    • Wafer Level Packaging
    • Interconnections for 3D Integration
    • Chip on Chip
  • dynamic_index_terms:
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Image Sensor
    • Camera Sensor
    • Converter Chip
    • Image Pixels
    • Thermal Materials
    • Cross-sectional SEM Images
    • Flip-chip
    • Microbumps
    • Glass Wafer
    • Thermal Plasticity
    • CCD Camera
    • Charge-coupled Device
    • Mobile Devices
    • Portable Devices
    • Overburden
    • Printed Circuit Board
    • Gold Layer
    • Etching Process
    • Focusing Lens
    • Focal Lens
    • Focusing Lenses
    • Good Image Quality
    • Good-quality Images
    • Copper Plate
    • Oxidative Etching
    • Bond Wires
    • Solder Joints
    • Dry Etching Process
• isbn_formats:
  • format: CD, value: 978-4-904090-10-7, isbnType: New-2005
  • format: Electronic ISBN, value: 978-4-904090-11-4, isbnType: New-2005
• authors:
  • Author Name: H. H. Chang
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37280774800
    ID: 37280774800
    Order: 1
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. H. Chien
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/38183080700
    ID: 38183080700
    Order: 2
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: Y. C. Lee
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37281128300
    ID: 37281128300
    Order: 3
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: S. M. Lee
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37089151056
    ID: 37089151056
    Order: 4
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: J. C. Wang
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37088445662
    ID: 37088445662
    Order: 5
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: Y. W. Huang
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37291620200
    ID: 37291620200
    Order: 6
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. J. Zhan
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37827389600
    ID: 37827389600
    Order: 7
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: Z. C. Hsiao
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37089151007
    ID: 37089151007
    Order: 8
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: P. J. Tzeng
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37089151008
    ID: 37089151008
    Order: 9
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. H. Lee
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37280422300
    ID: 37280422300
    Order: 10
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: T. S. Chen
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37402472700
    ID: 37402472700
    Order: 11
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: C. T. Ko
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37292392400
    ID: 37292392400
    Order: 12
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: W. C. Lo
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37283460600
    ID: 37283460600
    Order: 13
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan
  • Author Name: M. J. Kao
    Affiliation: Industrial Technology Research Institute, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37285787200
    ID: 37285787200
    Order: 14
    Author Affiliations:
    • Industrial Technology Research Institute, Hsinchu, Taiwan

Image Sensor

• sensor_type: CMOS
• resolution: 3 Mega pixels
• dynamic_range: Not specified
• pixel_size: < 1.4 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Used in portable devices such as smartphones, ultra books, and tablet PCs.
• benefits: Faster, cheaper, and more power efficient compared to CCD image sensors.

Supporting Organizations

• supported_by: Ministry of Economic Affairs (MOEA), Electronics & Optoelectronics Lab., Information & Communications Lab. of ITRI, Brewer Science, DISCO, SUSS.

Manuscript Details

• publication_date: 23-25 April 2014

Relevancy Score

• score: 9
• missing_fields:
  • fill factor
  • quantum efficiency
  • specific dynamic range
  • readout speed
  • microlenses information
  • on-chip colour filters
  • global or rolling shutters
  • analog-to-digital conversion techniques

Processed JSON Filename

request_084b1566-6d76-407a-b300-a7997b6decb5-process_integration_for_backside_illuminated_image_sensor_stacked_with_analogtodigital_conversion_chip.json