Process Integration And 3D Chip Stacking For Low Cost Backside Illuminated Cmos Image Sensor

• doi: 10.1109/VLSI-TSA.2015.7117587
• title: Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor
• publisher: IEEE
• isbn: 978-1-4799-7375-0
• issn: 1524-766X
• rank: 3313
• access_type: LOCKED
• content_type: Conferences
• abstract: A novel low cost backside illuminated CMOS image sensor structure is proposed in this research. By using thin wafer handling technology, the wafer is thinned down to less than 5 μm and no TSV and direct bonding process are needed in this low cost solution. The processed backside illuminated CMOS image sensor is then stacked with analog to digital conversion chip and image signal processor by 3DIC technology. A 3-Mega pixel image is captured and demonstrated in this research.
• article_number: 7117587
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7117587
• html_url: https://ieeexplore.ieee.org/document/7117587/
• abstract_url: https://ieeexplore.ieee.org/document/7117587/
• publication_title: 2015 International Symposium on VLSI Technology, Systems and Applications
• conference_location: Hsinchu, Taiwan
• conference_dates: 27-29 April 2015
• publication_number: 7111693
• is_number: 7117536
• publication_year: 2015
• publication_date: 27-29 April 2015
• start_page: 1
• end_page: 2
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 545
• insert_date: 20150604
• index_terms:
  • ieee_terms:
    • CMOS image sensors
    • Stacking
    • Bonding
    • Dry etching
    • Three-dimensional displays
  • dynamic_index_terms:
    • Low Cost
    • Image Sensor
    • Camera Sensor
    • Chip Stack
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Low-cost Solution
    • CCD Camera
    • Charge-coupled Device
    • Low-cost Process
    • Dry Etching
    • Passive Oxide
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-7375-0, isbnType: New-2005
• authors:
  • Author Name: Hsiang-Hung Chang
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37280774800
    ID: 37280774800
    Order: 1
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Zhi-Cheng Hsiao
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37601868500
    ID: 37601868500
    Order: 2
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Jen-Chun Wang
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37088445662
    ID: 37088445662
    Order: 3
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Chun-Hsien Chien
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/38183080700
    ID: 38183080700
    Order: 4
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Cheng-Ta Ko
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37292392400
    ID: 37292392400
    Order: 5
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Chau-Jie Zhan
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37827389600
    ID: 37827389600
    Order: 6
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Yu-Wei Huang
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37291620200
    ID: 37291620200
    Order: 7
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Yu-Chen Hsin
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/38016827600
    ID: 38016827600
    Order: 8
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Chung-Chih Wang
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37985418200
    ID: 37985418200
    Order: 9
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Pei-Jer Tzeng
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37264976100
    ID: 37264976100
    Order: 10
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Cha-Hsin Lin
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37291393300
    ID: 37291393300
    Order: 11
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Chia-Hsin Lee
    Affiliation: Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/38240320400
    ID: 38240320400
    Order: 12
    Author Affiliations:
    • Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
  • Author Name: Ting-Sheng Chen
    Affiliation: Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37402472700
    ID: 37402472700
    Order: 13
    Author Affiliations:
    • Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
  • Author Name: Wei-Chung Lo
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37283460600
    ID: 37283460600
    Order: 14
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Tzu-Kun Ku
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37362009800
    ID: 37362009800
    Order: 15
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
  • Author Name: Yung-Fa Chou
    Affiliation: Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37265084400
    ID: 37265084400
    Order: 16
    Author Affiliations:
    • Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
  • Author Name: Ding-Ming Kwai
    Affiliation: Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37294410600
    ID: 37294410600
    Order: 17
    Author Affiliations:
    • Information and Communications Research Laboratories, Industrial Technology Research Institute, Chutung, Hsinchu, Taiwan
  • Author Name: Ming-Jer Kao
    Affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
    Author URL: https://ieeexplore.ieee.org/author/37285787200
    ID: 37285787200
    Order: 18
    Author Affiliations:
    • Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute

Image Sensor

• sensor_type: CMOS
• resolution: 3 Mega pixels
• dynamic_range: Not specified
• pixel_size: <1.4 μm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• noise: <3E-10 A for TSVs

Applications & Benefits

• cell_imaging: 3 Mega pixel gray scale image demonstrated in this research.
• benefits: Low cost processes using thin wafer handling technology, no direct bonding or TSV needed.

Supporting Organizations

• supported_by: Industrial Technology Research Institute

Manuscript Details

• publication_date: 27-29 April 2015

Relevancy Score

• score: 9
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • microlenses
  • on-chip colour filters
  • global or rolling shutters

Processed JSON Filename

request_0571aca4-e8e6-4b61-a6dd-97dea2d87c27-process_integration_and_3d_chip_stacking_for_low_cost_backside_illuminated_cmos_image_sensor.json