Packaging Requirements And Solutions For Cmos Imaging Sensors

• doi: 10.1109/IEMT.1998.731075
• title: Packaging requirements and solutions for CMOS imaging sensors
• publisher: IEEE
• isbn: 0-7803-4523-1
• issn: 1089-8190
• partnum: 98CH36205
• rank: 3220
• access_type: LOCKED
• content_type: Conferences
• abstract: Image sensors place additional demands on packaging technology, beyond those for conventional ICs, including (1) an optical quality window, (2) precision mechanical die alignment, and (3) protection of die imaging attributes from environmental and manufacturing effects. In our development of CMOS sensors, we chose a commercially available package, the windowed QFP, as the basis for the CMOS sensor package. A pre-molded epoxy cavity package provides moisture protection similar to that for ceramic packages. Control of the tip and tilt components of die/package alignment and the tolerance stack-up between die and lens enables simple lens system alignment. The ceramic/glass lid maintains moisture protection while providing superior thermomechanical performance. This packaging technology gives customers a major advantage in board assembly with a mass reflow capable package that is unique in the industry.
• article_number: 731075
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=731075
• html_url: https://ieeexplore.ieee.org/document/731075/
• abstract_url: https://ieeexplore.ieee.org/document/731075/
• publication_title: Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205)
• conference_location: Austin, TX, USA
• conference_dates: 21-21 Oct. 1998
• publication_number: 5924
• is_number: 15782
• publication_year: 1998
• publication_date: 21-21 Oct. 1998
• start_page: 194
• end_page: 198
• citing_paper_count: 5
• citing_patent_count: 3
• download_count: 317
• insert_date: 20020806
• index_terms:
  • ieee_terms:
    • CMOS image sensors
    • Packaging
    • Mechanical sensors
    • Sensor phenomena and characterization
    • Protection
    • Optical imaging
    • Moisture
    • Ceramics
    • Lenses
    • Image sensors
  • dynamic_index_terms:
    • High-quality
    • Elevated Temperature
    • Digital Images
    • Materials Science
    • Delamination
    • Image Sensor
    • Camera Sensor
    • Plastic Packaging
    • Packaging Technology
    • Optical Glass
    • PhD In Science
    • Science PhDs
    • Bill Of Materials
    • Moisture Sensitivity
    • Assembly Technology
    • Device Handling
• isbn_formats:
  • format: Print ISBN, value: 0-7803-4523-1, isbnType: Historical
• authors:
  • Author Name: K. Sengupta
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37545750600
    ID: 37545750600
    Order: 1
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA
  • Author Name: R. Sundahl
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37360561500
    ID: 37360561500
    Order: 2
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA
  • Author Name: S. Kawashima
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37362410100
    ID: 37362410100
    Order: 3
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA
  • Author Name: R. Arellano
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37369069000
    ID: 37369069000
    Order: 4
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA
  • Author Name: C. Sklenicka
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37374833300
    ID: 37374833300
    Order: 5
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA
  • Author Name: D. Thompson
    Affiliation: Intel Corporation, Chandler, AZ, USA
    Author URL: https://ieeexplore.ieee.org/author/37358979100
    ID: 37358979100
    Order: 6
    Author Affiliations:
    • Intel Corporation, Chandler, AZ, USA

Image Sensor

• sensor_type: CMOS
• resolution:
• dynamic_range:
• pixel_size:
• dark_current:

Optical Data

• focal_length:
• aperture:
• field_of_view:
• distortion:

Performance Metrics

• frame_rate:
• signal_to_noise_ratio:
• sensitivity:
• shutter_speed:
• power_consumption:
• noise:

Applications & Benefits

• cell_imaging:
• benefits: CMOS imagers offer advantages like lower BOM, lower power requirements, and higher integration enabling 'camera-on-a-chip' capabilities.

Supporting Organizations

• supported_by: Intel Corporation, Kyocera Corporation

Manuscript Details

• publication_date: 21-21 Oct. 1998

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_3bfdffcd-d40c-424b-baad-5599c5805e9d-packaging_requirements_and_solutions_for_cmos_imaging_sensors.json