Novel Surface Structure And Its Fabrication Process For Mems Fingerprint Sensor

• doi: 10.1109/TED.2005.846342
• title: Novel surface structure and its fabrication process for MEMS fingerprint sensor
• publisher: IEEE
• isbn:
• issn: 1557-9646
• rank: 3156
• access_type: LOCKED
• content_type: Journals
• abstract: This paper describes a microelectromechanical systems (MEMS) fingerprint sensor that has novel protrusions on the sensor surface in order to detect clear fingerprint images for various finger surface conditions. A preliminary experiment clarified the importance of contact between soft finger ridges and the sensor surface in producing fingerprint images. Based on this, novel T-shaped protrusions on the sensor surface are proposed as an interface to mediate the contact. In order to fabricate the overhung form of the T-shaped structure, photosensitive polyimide and a copper sacrificial layer were used. Using the CMOS-compatible MEMS fabrication process, the arrayed T-shaped protrusions of polyimide are stacked on a CMOS large-scale integrated circuit. The sensor produced clear fingerprint images for various kinds of fingers. Measurement of the relationship between applied force and sensor output showed that the T-shaped protrusions achieved high sensitivity regardless of finger elasticity. Reliability tests confirmed that the sensor with the T-shaped protrusions has sufficient mechanical and electrical strength for wide applications.
• article_number: 1424395
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1424395
• html_url: https://ieeexplore.ieee.org/document/1424395/
• abstract_url: https://ieeexplore.ieee.org/document/1424395/
• publication_title: IEEE Transactions on Electron Devices
• conference_location:
• conference_dates:
• publication_number: 16
• is_number: 30755
• publication_year: 2005
• publication_date: May 2005
• start_page: 1026
• end_page: 1032
• citing_paper_count: 52
• citing_patent_count: 0
• download_count: 1169
• insert_date: 20050425
• index_terms:
  • ieee_terms:
    • Fingerprint identification
    • Microelectromechanical devices
    • Reliability
  • author_terms:
    • CMOS large-scale integrated circuit (LSI)
    • elasticity
    • fingerprint sensor
    • microelectromechanical systems (MEMS)
    • sensitivity
  • dynamic_index_terms:
    • Fabrication Process
    • Fingerprint Sensors
    • Reliability Test
    • Clear Image
    • Electric Strength
    • Sensor Surface
    • Sufficient Strength
    • Sacrificial Layer
    • Sufficient Mechanical Strength
    • Young’s Modulus
    • Elastic Modulus
    • Tensile Modulus
    • Grayscale
    • Greyscale
    • Gray Level
    • Film Thickness
    • Area Size
    • Pressure Sensor
    • Pressure Transducer
    • Barometer
    • Changes In Output
    • Changes In Yield
    • Sensitivity Rate
    • Evaluation Of Sensitivity
    • Capacitive Sensor
    • Black Particles
    • Sensor Processing
    • Lower Electrode
    • Electrostatic Discharge
    • Polyimide Layer
    • Parallel Electrodes
• authors:
  • Author Name: N. Sato
    Affiliation: NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37291037500
    ID: 37291037500
    Order: 1
    Author Affiliations:
    • NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
  • Author Name: S. Shigematsu
    Affiliation: NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37265813400
    ID: 37265813400
    Order: 2
    Author Affiliations:
    • NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
  • Author Name: H. Morimura
    Affiliation: NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37265815200
    ID: 37265815200
    Order: 3
    Author Affiliations:
    • NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
  • Author Name: M. Yano
    Affiliation: NTT Advanced Technology Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37416660900
    ID: 37416660900
    Order: 4
    Author Affiliations:
    • NTT Advanced Technology Corporation, Kanagawa, Japan
  • Author Name: K. Kudou
    Affiliation: NTT Advanced Technology Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37293802700
    ID: 37293802700
    Order: 5
    Author Affiliations:
    • NTT Advanced Technology Corporation, Kanagawa, Japan
  • Author Name: T. Kamei
    Affiliation: NTT Advanced Technology Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37425296000
    ID: 37425296000
    Order: 6
    Author Affiliations:
    • NTT Advanced Technology Corporation, Kanagawa, Japan
  • Author Name: K. Machida
    Affiliation: NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan
    Author URL: https://ieeexplore.ieee.org/author/37265816000
    ID: 37265816000
    Order: 7
    Author Affiliations:
    • NTT Mircosystem Integration Laboratories, NTT Corporation, Kanagawa, Japan

Image Sensor

• sensor_type: CMOS
• resolution: unknown
• dynamic_range: unknown
• pixel_size: 50 µm
• dark_current: unknown

Optical Data

• focal_length: unknown
• aperture: unknown
• field_of_view: unknown
• distortion: unknown

Performance Metrics

• frame_rate: unknown
• signal_to_noise_ratio: unknown
• sensitivity: unknown
• shutter_speed: unknown
• power_consumption: unknown
• noise: unknown

Applications & Benefits

• cell_imaging: Used in mobile and medical applications for fingerprint sensing.
• benefits: Captures clear fingerprint images for various finger surface conditions.

Supporting Organizations

• supported_by: NTT Corporation

Manuscript Details

• publication_date: May 2005

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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