Novel Spray Coating Process With Polymer Material Applied In Cis Waferlevelpackaging

• doi: 10.1109/EPTC.2014.7028410
• title: Novel spray coating process with polymer material applied in CIS wafer-level-packaging
• publisher: IEEE
• isbn: 978-1-4799-6994-4
• issn:
• rank: 3154
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper studies a creative spray coating process applied to the forming of sidewall insulation of through silicon via (TSV) in CMOS image sensor (CIS) packaging. In this paper, through controlling the nitrogen gas pressure, rate of polymer solution flow and plate temperature, we present a low-temperature-first and high-temperature-last spray coating method. Using this novel spray coating process, one kind of phenolic aldehyde polymer is deposited on the sidewall of though silicon via with the diameter of 65μm and depth of 120μm. To promote the performance of TSV sidewall insulation and electrical interconnection characteristic, the thickness of polymer on the sidewall was aimed to not less than 2μm. The temperature of spray coating process was adjusted to control the viscosity of polymer to achieve the insulation layer thickness target value. Finally, we fabricate the adequate polymer insulation layers in the certain aspect ratio (2:1) TSV structure successfully.
• article_number: 7028410
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7028410
• html_url: https://ieeexplore.ieee.org/document/7028410/
• abstract_url: https://ieeexplore.ieee.org/document/7028410/
• publication_title: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
• conference_location: Singapore
• conference_dates: 3-5 Dec. 2014
• publication_number: 7005556
• is_number: 7028249
• publication_year: 2014
• publication_date: 3-5 Dec. 2014
• start_page: 688
• end_page: 692
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 211
• insert_date: 20150202
• index_terms:
  • ieee_terms:
    • Polymers
    • Insulation
    • Coatings
    • Through-silicon vias
    • Packaging
    • Silicon
    • Viscosity
  • dynamic_index_terms:
    • Polymeric Materials
    • Spray Coating
    • Wafer-level Packaging
    • Spray-coating Process
    • Layer Thickness
    • Aspect Ratio
    • Polymer Solution
    • Sidewall
    • Side Walls
    • Gas Pressure
    • Image Sensor
    • Camera Sensor
    • Dielectric Layer
    • Insulation Layer
    • Polymer Viscosity
    • Plate Temperature
    • Polymer Thickness
    • Polymer Insulation
    • Polymer Dielectrics
    • Thickness Of The Dielectric Layer
    • Phenolic Polymer
    • Phenolic Aldehydes
    • Electrical Interconnection
    • High Temperature
    • Polymer Layer
    • Propylene Glycol Monomethyl Ether
    • Methyl Ethyl Ketone
    • Ethyl Lactate
    • Thin Polymer Layer
    • Solution Point
    • Packaging Process
    • Low-temperature Process
    • Bottom Layer
• isbn_formats:
  • format: Electronic ISBN, value: 978-1-4799-6994-4, isbnType: New-2005
• authors:
  • Author Name: Yuechen Zhuang
    Affiliation: National Center for Advanced Packaging (NCAP China)
    Author URL: https://ieeexplore.ieee.org/author/37085442440
    ID: 37085442440
    Order: 1
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China)
    • Instiitute of Microelectronics, Chinese Academy of Sciences
  • Author Name: Daquan Yu
    Affiliation: Instiitute of Microelectronics, Chinese Academy of Sciences
    Author URL: https://ieeexplore.ieee.org/author/37402186400
    ID: 37402186400
    Order: 2
    Author Affiliations:
    • Instiitute of Microelectronics, Chinese Academy of Sciences
  • Author Name: Fengwei Dai
    Affiliation: National Center for Advanced Packaging (NCAP China)
    Author URL: https://ieeexplore.ieee.org/author/37959712900
    ID: 37959712900
    Order: 3
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China)
    • Instiitute of Microelectronics, Chinese Academy of Sciences
  • Author Name: Zhongcai Niu
    Affiliation: National Center for Advanced Packaging (NCAP China)
    Author URL: https://ieeexplore.ieee.org/author/37085439886
    ID: 37085439886
    Order: 4
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China)
  • Author Name: Wenqi Zhang
    Affiliation: National Center for Advanced Packaging (NCAP China)
    Author URL: https://ieeexplore.ieee.org/author/37085379198
    ID: 37085379198
    Order: 5
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China)
  • Author Name: Zhenzhong Yong
    Affiliation: National Center for Advanced Packaging (NCAP China)
    Author URL: https://ieeexplore.ieee.org/author/37085437622
    ID: 37085437622
    Order: 6
    Author Affiliations:
    • National Center for Advanced Packaging (NCAP China)
  • Author Name: Guoping Zhang
    Affiliation: Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences
    Author URL: https://ieeexplore.ieee.org/author/38562636800
    ID: 38562636800
    Order: 7
    Author Affiliations:
    • Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Cell imaging applications mentioned are common for CMOS sensors but specifics not provided.
• benefits: Benefits of using CMOS image sensors generally include compact size, integration capabilities, and low power consumption.

Supporting Organizations

• supported_by: National Center for Advanced Packaging (NCAP China), Institute of Microelectronics, Chinese Academy of Sciences, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences

Manuscript Details

• publication_date: 3-5 Dec. 2014

Relevancy Score

• score: 8
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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