New Sensing Systems For Securing Virtual Walls At Outdoor Based On True
Differential Digital Tmos
- doi: 10.1109/ISCAS48785.2022.9937636
-
title: New Sensing Systems for Securing Virtual Walls
at Outdoor Based on True Differential Digital TMOS
- publisher: IEEE
- isbn: 978-1-6654-8486-2
- issn: 0271-4302
- rank: 3107
- access_type: LOCKED
- content_type: Conferences
-
abstract: This paper presents a non-imaging
differential digital passive Infra-Red (PIR) remote sensing system using
CMOS-SOI-MEMS transistors as the thermal sensor. A large $660\mu
{\mathrm m}\, {\mathrm x}\, 660\mu{\mathrm m}$ pixel area is developed
by the 8x8 mosaic matrix of $60\mu {\mathrm m} \,{\mathrm x}\,
60\mu{\mathrm m}$ sub-pixels connected in-parallel. The mosaic sensors,
which are manufactured by nano-fabrication methods in CMOS FABs, exhibit
enhanced performance and robust manufacturing in wafer level processing
and vacuum packaging. Since the sub-pixels are thermally isolated, the
thermal time constant of the large pixel is determined by that of the
sub-pixel, which is $\sim {\mathrm 80}$ msec when packaged in vacuum of
$\sim 1{\mathrm Pa}$. For outdoor operation, two identical large pixels
are differentially measured. The pixels view the detected scene with an
optics that may be based either on mirror optics or Fresnel plastic
lenses. The optics defines a narrow field of view (± 3 degrees) as
required for curtain sensors. Furthermore, the optics forms “cockeyed”
vision which enables differential measurement that cancels the
environmental” noise” and allows outdoor operation. The overall measured
performance for detecting human targets at extended ranges and hot spots
detection are reported. This sensor outperforms thermopiles and
pyroelectric sensors at outdoor operation.
- article_number: 9937636
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9937636
-
html_url:
https://ieeexplore.ieee.org/document/9937636/
-
abstract_url:
https://ieeexplore.ieee.org/document/9937636/
-
publication_title: 2022 IEEE International Symposium on
Circuits and Systems (ISCAS)
- conference_location: Austin, TX, USA
- conference_dates: 27 May-1 June 2022
- publication_number: 9937201
- is_number: 9937203
- publication_year: 2022
- publication_date: 27 May-1 June 2022
- start_page: 1175
- end_page: 1179
- citing_paper_count: 2
- citing_patent_count: 0
- download_count: 109
- insert_date: 20221111
-
index_terms:
-
ieee_terms:
- Working environment noise
- Thermal sensors
- Packaging
- Optical variables measurement
- Optics
- Mirrors
- Transistors
-
author_terms:
- CMOS-SOI-MEMS
- uncooled infrared (IR) sensors
- MOS transistors
- passive infrared (PIR) sensors
- mosaic sensor
- infrared (IR) mirror optics.
-
dynamic_index_terms:
- Sensory Systems
- Virtual Wall
- Field Of View
- Field-of-view
- Vacuum Packaging
- Vacuum Sealed
- Vacuum-packed
- Vacuum-sealed
- Thermal Sensors
- Large Pixel
- Narrow Field Of View
- Narrow Field-of-view
- Thermopile
- Internet Of Things
- Internet-of-Things
- False Alarm
- Printed Circuit Board
- Microfabrication
- Micromachining
- Optical Filter
- Absorption Of Radiation
- Absorption Of Electromagnetic Radiation
- Power Management
- Surface-mounted
- Surface Mount Technology
- Surface Mount
- Parabolic Mirror
- Parabolic Dish
- Parabolic Reflector
- Walking Direction
-
isbn_formats:
-
format: Print on Demand(PoD) ISBN,
value: 978-1-6654-8486-2,
isbnType: New-2005
-
format: USB ISBN,
value: 978-1-6654-8484-8,
isbnType: New-2005
-
format: Electronic ISBN,
value: 978-1-6654-8485-5,
isbnType: New-2005
-
authors:
-
Author Name: Tanya Blank
Affiliation: Faculty of Electrical and Computer
Engineering, Technion—Israel Institute of Technology, Haifa,
Israel
Author URL:
https://ieeexplore.ieee.org/author/38235306900
ID: 38235306900
Order: 1
Author Affiliations:
-
Faculty of Electrical and Computer Engineering, Technion—Israel
Institute of Technology, Haifa, Israel
-
Author Name: Igor Brouk
Affiliation: Faculty of Electrical and Computer
Engineering, Technion—Israel Institute of Technology, Haifa,
Israel
Author URL:
https://ieeexplore.ieee.org/author/37294090800
ID: 37294090800
Order: 2
Author Affiliations:
-
Faculty of Electrical and Computer Engineering, Technion—Israel
Institute of Technology, Haifa, Israel
-
Author Name: Sharon Bar-Lev
Affiliation: Faculty of Electrical and Computer
Engineering, Technion—Israel Institute of Technology, Haifa,
Israel
Author URL:
https://ieeexplore.ieee.org/author/38270756700
ID: 38270756700
Order: 3
Author Affiliations:
-
Faculty of Electrical and Computer Engineering, Technion—Israel
Institute of Technology, Haifa, Israel
-
Author Name: Gavriel Amar
Affiliation: R&D department, TODOS Technologies
LTD, Airport City, Israel
Author URL:
https://ieeexplore.ieee.org/author/37088642694
ID: 37088642694
Order: 4
Author Affiliations:
-
R&D department, TODOS Technologies LTD, Airport City, Israel
-
Author Name: Maxim Meltsin
Affiliation: Faculty of Electrical and Computer
Engineering, Technion—Israel Institute of Technology, Haifa,
Israel
Author URL:
https://ieeexplore.ieee.org/author/37061950600
ID: 37061950600
Order: 5
Author Affiliations:
-
Faculty of Electrical and Computer Engineering, Technion—Israel
Institute of Technology, Haifa, Israel
-
Author Name: Alex Katz
Affiliation: R&D department, TODOS Technologies
LTD, Airport City, Israel
Author URL:
https://ieeexplore.ieee.org/author/37086288876
ID: 37086288876
Order: 6
Author Affiliations:
-
R&D department, TODOS Technologies LTD, Airport City, Israel
-
Author Name: Michele Vaiana
Affiliation: AMS R&D Department,
STMicroelectronics, Catania, Italy
Author URL:
https://ieeexplore.ieee.org/author/37285054400
ID: 37285054400
Order: 7
Author Affiliations:
- AMS R&D Department, STMicroelectronics, Catania, Italy
-
Author Name: Maria Eloisa Castagna
Affiliation: AMS R&D Department,
STMicroelectronics, Catania, Italy
Author URL:
https://ieeexplore.ieee.org/author/37409684300
ID: 37409684300
Order: 8
Author Affiliations:
- AMS R&D Department, STMicroelectronics, Catania, Italy
-
Author Name: Antonella La Malfa
Affiliation: AMS R&D Department,
STMicroelectronics, Catania, Italy
Author URL:
https://ieeexplore.ieee.org/author/37087235258
ID: 37087235258
Order: 9
Author Affiliations:
- AMS R&D Department, STMicroelectronics, Catania, Italy
-
Author Name: Giuseppe Bruno
Affiliation: AMS R&D Department,
STMicroelectronics, Catania, Italy
Author URL:
https://ieeexplore.ieee.org/author/37086235582
ID: 37086235582
Order: 10
Author Affiliations:
- AMS R&D Department, STMicroelectronics, Catania, Italy
-
Author Name: Yael Nemirovsky
Affiliation: Faculty of Electrical and Computer
Engineering, Technion—Israel Institute of Technology, Haifa,
Israel
Author URL:
https://ieeexplore.ieee.org/author/37283695600
ID: 37283695600
Order: 11
Author Affiliations:
-
Faculty of Electrical and Computer Engineering, Technion—Israel
Institute of Technology, Haifa, Israel
Image Sensor
- sensor_type: CMOS-SOI-MEMS
- resolution: Not specified
- dynamic_range: Not specified
-
pixel_size: 60µm x 60µm sub-pixels, larger pixel area
660µm x 660µm
- dark_current: Not specified
Optical Data
- focal_length: Not specified
- aperture: Not specified
- field_of_view: ±3 degrees
- distortion: Not specified
Performance Metrics
- signal_to_noise_ratio: Low noise
- power_consumption: Low power
Applications & Benefits
- cell_imaging: Not specified
-
benefits: Suitable for securing virtual walls outdoors,
detects presence as well as movement direction, operates over a wide
ambient temperature range, low power, and can be battery-operated.
Supporting Organizations
- supported_by: TODOS TECHNOLOGIES Ltd.
Manuscript Details
- publication_date: 27 May-1 June 2022
Relevancy Score
- score: 8
-
missing_fields:
- resolution
- dynamic_range
- dark_current
- focal_length
- aperture
- frame_rate
- sensitivity
- shutter_speed
- noise
- cell_imaging
Processed JSON Filename
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