Monolithic 591438 Dpi Ultrasonic Fingerprint Sensor
- doi: 10.1109/MEMSYS.2016.7421569
-
title: Monolithic 591×438 DPI ultrasonic fingerprint
sensor
- publisher: IEEE
- isbn: 978-1-5090-1972-4
- issn:
- rank: 3043
- access_type: LOCKED
- content_type: Conferences
-
abstract: This paper presents a 591×438 DPI ultrasonic
fingerprint sensor. The sensor is based on a piezoelectric micromachined
ultrasonic transducer (PMUT) array that is bonded at wafer-level to
complementary metal oxide semiconductor (CMOS) signal processing
electronics to produce a pulse-echo ultrasonic imager on a chip. To meet
the 500 DPI standard for consumer fingerprint sensors, the PMUT pitch
was reduced by approximately a factor of two relative to an earlier
design. We conducted a systematic design study of the individual PMUT
and array to achieve this scaling while maintaining a high fill-factor.
The resulting 110×56 PMUT array, composed of 30×43μm2 rectangular PMUTs
achieved a 51.7% fill-factor, three times greater than that of the
previous design. Together with the custom CMOS ASIC, the sensor achieves
2 μV/Pa sensitivity, 13 kPa pressure output, 75μm lateral resolution,
and 150μm axial resolution in a 4.6 mm × 3.2 mm image.
- article_number: 7421569
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7421569
-
html_url:
https://ieeexplore.ieee.org/document/7421569/
-
abstract_url:
https://ieeexplore.ieee.org/document/7421569/
-
publication_title: 2016 IEEE 29th International
Conference on Micro Electro Mechanical Systems (MEMS)
- conference_location: Shanghai, China
- conference_dates: 24-28 Jan. 2016
- publication_number: 7411154
- is_number: 7421533
- publication_year: 2016
- publication_date: 24-28 Jan. 2016
- start_page: 107
- end_page: 110
- citing_paper_count: 18
- citing_patent_count: 0
- download_count: 1318
- insert_date: 20160229
-
index_terms:
-
ieee_terms:
- Decision support systems
- Micromechanical devices
- Hafnium
-
dynamic_index_terms:
- Ultrasonic Sensors
- Ultrasonic Detection
- Fingerprint Sensors
- Axial Resolution
- Pressure Output
- Individual Arrays
- High Fill Factor
- Maximum And Minimum
- Stationary Point
- Extreme Values
- Extremal
- Young’s Modulus
- Elastic Modulus
- Tensile Modulus
- Image Resolution
- Resonance Frequency
- Vibrational Modes
- Quality Factor
- Q-factor
- Amplitude Variation
- Sound Pressure
- Acoustic Pressure
- Eutectic
- Insertion Loss
- Fill Factor
- Array Design
- Pressure Sensitivity
- Peak Displacement
- Static Displacement
- Rectangular Array
- Monomorphism
- Unimorph
- Piezoelectric Coefficient
- Acoustic Output
- Thick Si
- Electromechanical Coupling
- Output Resolution
-
isbn_formats:
-
format: USB ISBN,
value: 978-1-5090-1972-4,
isbnType: New-2005
-
format: Electronic ISBN,
value: 978-1-5090-1973-1,
isbnType: New-2005
-
authors:
-
Author Name: Xiaoyue Jiang
Affiliation: Univeristy of California, Berkeley,
CA, USA
Author URL:
https://ieeexplore.ieee.org/author/37085699649
ID: 37085699649
Order: 1
Author Affiliations:
- Univeristy of California, Berkeley, CA, USA
-
Author Name: Hao-Yen Tang
Affiliation: Univeristy of California, Berkeley,
CA, USA
Author URL:
https://ieeexplore.ieee.org/author/37085442217
ID: 37085442217
Order: 2
Author Affiliations:
- Univeristy of California, Berkeley, CA, USA
-
Author Name: Yipeng Lu
Affiliation: Univeristy of California, Davis, CA,
USA
Author URL:
https://ieeexplore.ieee.org/author/37085445079
ID: 37085445079
Order: 3
Author Affiliations:
- Univeristy of California, Davis, CA, USA
-
Author Name: Xi Li
Affiliation: Univeristy of California, Berkeley,
CA, USA
Author URL:
https://ieeexplore.ieee.org/author/37085667930
ID: 37085667930
Order: 4
Author Affiliations:
- Univeristy of California, Berkeley, CA, USA
-
Author Name: Julius M. Tsai
Affiliation: Invensense Inc., San Jose, USA
Author URL:
https://ieeexplore.ieee.org/author/37085530599
ID: 37085530599
Order: 5
Author Affiliations:
- Invensense Inc., San Jose, USA
-
Author Name: Eldwin J. Ng
Affiliation: Invensense Inc., San Jose, USA
Author URL:
https://ieeexplore.ieee.org/author/37711201400
ID: 37711201400
Order: 6
Author Affiliations:
- Invensense Inc., San Jose, USA
-
Author Name: Michael J. Daneman
Affiliation: Invensense Inc., San Jose, USA
Author URL:
https://ieeexplore.ieee.org/author/37350139600
ID: 37350139600
Order: 7
Author Affiliations:
- Invensense Inc., San Jose, USA
-
Author Name: Martin Lim
Affiliation: Invensense Inc., San Jose, USA
Author URL:
https://ieeexplore.ieee.org/author/37085532654
ID: 37085532654
Order: 8
Author Affiliations:
- Invensense Inc., San Jose, USA
-
Author Name: Fari Assaderaghi
Affiliation: Invensense Inc., San Jose, USA
Author URL:
https://ieeexplore.ieee.org/author/37349426000
ID: 37349426000
Order: 9
Author Affiliations:
- Invensense Inc., San Jose, USA
-
Author Name: Bernhard E. Boser
Affiliation: Univeristy of California, Berkeley,
CA, USA
Author URL:
https://ieeexplore.ieee.org/author/37282431400
ID: 37282431400
Order: 10
Author Affiliations:
- Univeristy of California, Berkeley, CA, USA
-
Author Name: David A. Horsley
Affiliation: University of California Davis, Davis,
CA, US
Author URL:
https://ieeexplore.ieee.org/author/37372231100
ID: 37372231100
Order: 11
Author Affiliations:
- University of California Davis, Davis, CA, US
Image Sensor
- sensor_type: CMOS
- resolution: Variable depending on application
- dynamic_range: High
- pixel_size: Typically in the range of 1-5 µm
- dark_current: Low (varies by design)
Optical Data
- focal_length: Varies with lens used
- aperture: Varies (e.g., f/1.8 to f/4)
-
field_of_view: Varies by lens and sensor configuration
- distortion: Typically low (<5%)
Performance Metrics
-
frame_rate: Up to 120 fps or higher in advanced models
- signal_to_noise_ratio: High (65 dB typical)
-
sensitivity: ISO ratings ranging up to 12800 or higher
- shutter_speed: Variable (e.g., 1/60s to 1/4000s)
-
power_consumption: Typically 100-300 mW for
high-performance sensors
- noise: Low (around 2 e- in high-end sensors)
Applications & Benefits
-
cell_imaging: Used in medical imaging devices for
diagnostics and analysis
-
benefits: High sensitivity, good low-light performance,
compact size, and integration with digital systems
Supporting Organizations
-
supported_by: Various semiconductor manufacturers and
research institutions
Manuscript Details
- publication_date: 24-28 Jan. 2016
Relevancy Score
- score: 10
-
missing_fields:
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