Lowtemperature And Low Pressure Coppertocopper Direct Bonding Enabled By Creep On Highly 111Oriented Cu Surfaces

• doi: 10.1109/ICEP-IAAC.2015.7111070
• title: Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
• publisher: IEEE
• isbn: 978-4-9040-9012-1
• issn:
• rank: 2958
• access_type: LOCKED
• content_type: Conferences
• abstract: Cu-to-Cu microbumps have many advantages, such as better electrical and thermal conductivities. The Cu-to-Cu microbumps may be a potential solution to the heat dissipation problem in 3D IC integration. In addition, for packaging of CMOS image sensors, the bonding temperature is preferred to below 200 °C. Therefore, low temperature and low pressure Cu-to-Cu direct is of great interests for packaging industry. However, it is a challenging issue because Cu atoms diffuse slowly below 200 °C. In this study, we achieved low temperature and low pressure Cu bonding using highly (111)-orientated Cu films. Because the diffusivity of Cu atoms on the (111) surface diffusivity is the fastest among all the crystallographic planes of Cu. The bonding temperature can be lowered to 150°C at a compressive stress of 114 psi held for 60 min at 10−3 torr. Since the melting points of popular Pb-free solders such as SnAg and SnAgCu are over 230°C. Therefore the present technique can be applied to packaging of CMOS image sensors and 3D IC integration.
• article_number: 7111070
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7111070
• html_url: https://ieeexplore.ieee.org/document/7111070/
• abstract_url: https://ieeexplore.ieee.org/document/7111070/
• publication_title: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
• conference_location: Kyoto, Japan
• conference_dates: 14-17 April 2015
• publication_number: 7102535
• is_number: 7110993
• publication_year: 2015
• publication_date: 14-17 April 2015
• start_page: 523
• end_page: 526
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 467
• insert_date: 20150521
• index_terms:
  • ieee_terms:
    • Films
    • Bonding
    • X-ray diffraction
    • Diffraction
    • Integrated circuits
    • Surface treatment
    • Three-dimensional displays
  • author_terms:
    • Cu-Cu
    • direct bonding
    • nanotwin
    • 3DIC
  • dynamic_index_terms:
    • Low Pressure
    • Thermal Conductivity
    • Heat Conduction
    • Melting Point
    • Freezing Point
    • Compressive Stress
    • Surface Diffusion
    • Crystallographic Planes
    • Flip-chip
    • Microbumps
    • Transmission Electron Microscopy Images
    • Energy-dispersive X-ray Spectroscopy
    • Energy Dispersive Spectroscopy
    • Grain Size
    • Grain Boundaries
    • Bright-field Images
    • Intermetallic
    • Metal Compounds
    • Intermetallic Compounds
    • Reliability Issues
    • Dependency Issues
    • Electron Backscatter Diffraction
    • EBSD
    • Bright-field Transmission Electron Microscopy
    • Bright-field TEM
    • Cross-sectional Transmission Electron Microscopy
    • Selected Area Diffraction Pattern
• isbn_formats:
  • format: CD, value: 978-4-9040-9012-1, isbnType: New-2005
  • format: Electronic ISBN, value: 978-4-9040-9013-8, isbnType: New-2005
• authors:
  • Author Name: Chih-Han Tseng
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37087624039
    ID: 37087624039
    Order: 1
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Chien-Min Liu
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/38025946000
    ID: 38025946000
    Order: 2
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Han-wen Lin
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37085427285
    ID: 37085427285
    Order: 3
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Yi-Cheng Chu
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37087625800
    ID: 37087625800
    Order: 4
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Chih Chen
    Affiliation: Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37311050900
    ID: 37311050900
    Order: 5
    Author Affiliations:
    • Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Dian-Rong Lyu
    Affiliation: Department of Electronics Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37087627596
    ID: 37087627596
    Order: 6
    Author Affiliations:
    • Department of Electronics Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: Kuan-Neng Chen
    Affiliation: Department of Electronics Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
    Author URL: https://ieeexplore.ieee.org/author/37291297100
    ID: 37291297100
    Order: 7
    Author Affiliations:
    • Department of Electronics Engineering, National Chiao Tung University, Hsinchu Taiwan, Republic of China
  • Author Name: K. N. Tu
    Affiliation: Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California, USA
    Author URL: https://ieeexplore.ieee.org/author/37272636700
    ID: 37272636700
    Order: 8
    Author Affiliations:
    • Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, California, USA

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS image sensors used in packaging applications.
• benefits: Potential solution for heat dissipation in 3D IC integration.

Supporting Organizations

• supported_by: National Science Council, Taiwan

Manuscript Details

• publication_date: 14-17 April 2015

Relevancy Score

• score: 7
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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