Lowtemperature Adhesive Wafer Bonding For Film Layer Transfer

• doi: 10.1109/ESTC60143.2024.10712008
• title: Low-Temperature Adhesive Wafer Bonding for Film Layer Transfer
• publisher: IEEE
• isbn: 979-8-3503-9037-7
• issn: 2687-9700
• rank: 2945
• access_type: LOCKED
• content_type: Conferences
• abstract: Adhesive wafer bonding has emerged as a crucial technique in the fabrication and integration of a various range of devices, including MEMS, microfluidics, CMOS imaging sensors, RF and photonic devices. Adhesive wafer bonding can also be used for encapsulation, packaging, die stacking and film layer transfer. Currently, many adhesive bonding materials and processes have been developed and tailored for different applications where adhesives serve either as temporary or permanent bond layers. Benzocyclobutene (BCB) is commonly chosen as the preferred thermosetting polymer for permanent adhesive wafer bonding. However, wafer bonding using BCB requires a bonding temperature of more than 220 °C (220-350°C), which constrains its application for temperature-sensitive structures and materials. Correspondingly, in this study, a recently developed adhesive for permanent bonding was proposed and investigated for low-temperature (< 70 °C) wafer bonding. Both device wafer and carrier wafers were spin-coated with this polymer and the successful transfer of the thin film from carrier wafer to device wafer has been demonstrated. Furthermore, the study showcases the use of the bonded adhesive as a sacrificial layer, combined with an optimized oxygen plasma etching process, to successfully fabricate MEMS structures. This article will discuss the cross-sectional examination of the interface as well as procedures for achieving optimal wafer bond thickness.
• article_number: 10712008
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10712008
• html_url: https://ieeexplore.ieee.org/document/10712008/
• abstract_url: https://ieeexplore.ieee.org/document/10712008/
• publication_title: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)
• conference_location: Berlin, Germany
• conference_dates: 11-13 Sept. 2024
• publication_number: 10711924
• is_number: 10711994
• publication_year: 2024
• publication_date: 11-13 Sept. 2024
• start_page: 1
• end_page: 4
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 153
• insert_date: 20241015
• index_terms:
  • ieee_terms:
    • Wafer bonding
    • Micromechanical devices
    • Solvents
    • Stacking
    • Sensor systems and applications
    • Temperature control
    • Polymers
    • Bonding
    • Plasma temperature
    • Microfluidics
  • author_terms:
    • Adhesive bonding
    • Layer transfer
    • Adhesive wafer bonding
    • Permasol
    • MEMS Packaging
    • Permanent wafer bonding
  • dynamic_index_terms:
    • Transfer Layer
    • Wafer Bonding
    • Thin Films
    • Alumina
    • Microfluidic
    • Fabrication Techniques
    • Range Of Devices
    • Sacrificial Layer
    • SEM Images
    • Microfluidic Device
    • Fabric Structure
    • Textile Structures
    • Adhesive Layer
    • Silicon Nitride
    • Adhesive Thickness
    • Anisotropic Etching
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 979-8-3503-9037-7, isbnType: New-2005
  • format: Electronic ISBN, value: 979-8-3503-9036-0, isbnType: New-2005
• authors:
  • Author Name: Augusto Rodrigues
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/37087231459
    ID: 37087231459
    Order: 1
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
    • Carinthia University of Applied Sciences, Villach, Austria
  • Author Name: Nikolai Andrianov
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/124112602202420
    ID: 124112602202420
    Order: 2
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
  • Author Name: Munir Azeem Syed
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/234108867019574
    ID: 234108867019574
    Order: 3
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
  • Author Name: Madeleine Petschnigg
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/37089440601
    ID: 37089440601
    Order: 4
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
  • Author Name: Tai Nguyen
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/37088359646
    ID: 37088359646
    Order: 5
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
  • Author Name: Thang Duy Dao
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/37085409733
    ID: 37085409733
    Order: 6
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria
  • Author Name: Ali Roshanghias
    Affiliation: Silicon Austria labs GmBH, Villach, Austria
    Author URL: https://ieeexplore.ieee.org/author/37086119335
    ID: 37086119335
    Order: 7
    Author Affiliations:
    • Silicon Austria labs GmBH, Villach, Austria

Image Sensor

• sensor_type: CMOS
• resolution: Not specified in the text
• dynamic_range: Not specified in the text
• pixel_size: Not specified in the text
• dark_current: Not specified in the text

Optical Data

• focal_length: Not specified in the text
• aperture: Not specified in the text
• field_of_view: Not specified in the text
• distortion: Not specified in the text

Performance Metrics

• frame_rate: Not specified in the text
• signal_to_noise_ratio: Not specified in the text
• sensitivity: Not specified in the text
• shutter_speed: Not specified in the text
• power_consumption: Not specified in the text
• noise: Not specified in the text

Applications & Benefits

• cell_imaging: Not specified in the text
• benefits: Provides digital imaging capabilities in smartphones, medical devices, and automotive systems.

Supporting Organizations

• supported_by: Not specified in the text

Manuscript Details

• publication_date: 11-13 Sept. 2024

Relevancy Score

• score: 7
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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