Lowcost Error Tolerance Scheme For 3D Cmos Imagers

• doi: 10.1109/TVLSI.2012.2190148
• title: Low-Cost Error Tolerance Scheme for 3-D CMOS Imagers
• publisher: IEEE
• isbn:
• issn: 1557-9999
• rank: 2929
• access_type: LOCKED
• content_type: Journals
• abstract: This paper presents an error tolerance scheme for 3-D CMOS imagers that are constructed by stacking a pixel array of imager sensors, an analog-to-digital converter (ADC) array, and an image signal processor (ISP) array using microbumps $(\mu{\rm bumps})$ and through silicon vias (TSVs). To deliver high-quality images in the presence of single or multiple $\mu{\rm bump}$, ADC, or TSV failures, we propose to interleave the connections from pixels to ADCs and recover the corrupted data in the ISPs. Key design parameters, such as the interleaving stride and the grouping ratio are determined by analyzing the employed error correction algorithm. Architectural simulation results demonstrate that the error tolerance scheme enhances the effective yield of an exemplar 3-D imager from 44% to 97%.
• article_number: 6186837
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6186837
• html_url: https://ieeexplore.ieee.org/document/6186837/
• abstract_url: https://ieeexplore.ieee.org/document/6186837/
• publication_title: IEEE Transactions on Very Large Scale Integration (VLSI) Systems
• conference_location:
• conference_dates:
• publication_number: 92
• is_number: 6466554
• publication_year: 2013
• publication_date: March 2013
• start_page: 465
• end_page: 474
• citing_paper_count: 6
• citing_patent_count: 0
• download_count: 994
• insert_date: 20120418
• index_terms:
  • ieee_terms:
    • Arrays
    • Through-silicon vias
    • PSNR
    • Decoding
    • Image color analysis
    • Signal processing algorithms
    • Wires
  • author_terms:
    • 3-D IC
    • design-for-reliability
    • design-for-yield
  • dynamic_index_terms:
    • Error Tolerance
    • Design Parameters
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Image Sensor
    • Camera Sensor
    • Pixel Array
    • Flip-chip
    • Microbumps
    • Image Quality
    • Fault Location
    • Local Defects
    • Peak Signal-to-noise Ratio
    • PSNR
    • Neighboring Pixels
    • Neighborhood Pixels
    • Multiple Defects
    • Multiple Faults
    • Propagation Delay
    • Noisy Images
    • Signal Path
    • Single Fault
    • Single Defect
    • Pixel Information
    • Information Of Each Pixel
    • Present Quality
    • Delay Increases
    • Pixel Data
    • Data For Each Pixel
    • Decoding Scheme
    • Decoding Strategy
    • Denoising Algorithm
    • Longest Delay
    • Pixel Column
    • Output Pixel
• authors:
  • Author Name: Hsiu-Ming Chang Chang
    Affiliation: University of California, Santa Barbara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37539356000
    ID: 37539356000
    Order: 1
    Author Affiliations:
    • University of California, Santa Barbara, CA, USA
  • Author Name: Jiun-Lang Huang
    Affiliation: National Taiwan University, Taipei, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37281261300
    ID: 37281261300
    Order: 2
    Author Affiliations:
    • National Taiwan University, Taipei, Taiwan
  • Author Name: Ding-Ming Kwai
    Affiliation: Institute of Industrial Research, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37294410600
    ID: 37294410600
    Order: 3
    Author Affiliations:
    • Institute of Industrial Research, Hsinchu, Taiwan
  • Author Name: Kwang-Ting Cheng
    Affiliation: University of California, Santa Barbara, CA, USA
    Author URL: https://ieeexplore.ieee.org/author/37275533100
    ID: 37275533100
    Order: 4
    Author Affiliations:
    • University of California, Santa Barbara, CA, USA
  • Author Name: Cheng-Wen Wu
    Affiliation: Institute of Industrial Research, Hsinchu, Taiwan
    Author URL: https://ieeexplore.ieee.org/author/37276423200
    ID: 37276423200
    Order: 5
    Author Affiliations:
    • Institute of Industrial Research, Hsinchu, Taiwan

Image Sensor

• sensor_type: CMOS
• resolution: 12 megapixels (4096 columns x 3072 rows)
• dynamic_range: Not specified
• pixel_size: 1.4 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• noise: Includes temporal noise and fixed-pattern noise.

Applications & Benefits

• cell_imaging: Used in various devices including smartphones, medical devices, and automotive systems.
• benefits: Enables digital imaging with high-quality image processing.

Supporting Organizations

• supported_by: Gigascale Systems Research Center, Semiconductor Research Corporation Program.

Manuscript Details

• publication_date: March 2013

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • focal_length
  • aperture
  • field_of_view
  • distortion

Processed JSON Filename

request_1d015b05-dbbb-4176-9cb4-bc08376fdcfc-lowcost_error_tolerance_scheme_for_3d_cmos_imagers.json