Laser Thermal Annealing Enabling Ultralow Thermal Budget Processes For 3D Junctions Formation And Devices

• doi: 10.1109/IWJT.2012.6212810
• title: Laser Thermal Annealing: Enabling ultra-low thermal budget processes for 3D junctions formation and devices
• publisher: IEEE
• isbn: 978-1-4673-1256-1
• issn:
• partnum: 12EX6220
• rank: 2861
• access_type: LOCKED
• content_type: Conferences
• abstract: Annealing of 3D architectures is one of the major challenges for current and next generation devices for various applications ranging from sensors, microprocessors or high density memories. One of the most promising solutions is Laser Thermal Annealing (LTA), an ultrafast and low thermal budget process already adopted in production for passivation of BackSide Illuminated CMOS Imaging Sensors (CIS) and Power Diodes and Transistors (IGBT). The high temperature annealing required (>;1400°C) needs to be restrained to very thin layers while keeping low temperature of underlying fragile layers and devices. To achieve that, one needs to use a unique ultrafast annealing duration (sub μsec) and a proper Laser wavelength. This enables to reach metastable thermal processes, locking-in the electrical surface properties of the semiconductor while not damaging buried devices. We present a review of those new processes including recent development in emerging memory applications where 3D vertical stack of functional layers of devices is realized.
• article_number: 6212810
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6212810
• html_url: https://ieeexplore.ieee.org/document/6212810/
• abstract_url: https://ieeexplore.ieee.org/document/6212810/
• publication_title: 2012 12th International Workshop on Junction Technology
• conference_location: Shanghai, China
• conference_dates: 14-15 May 2012
• publication_number: 6205554
• is_number: 6212790
• publication_year: 2012
• publication_date: 14-15 May 2012
• start_page: 57
• end_page: 62
• citing_paper_count: 8
• citing_patent_count: 2
• download_count: 779
• insert_date: 20120607
• index_terms:
  • ieee_terms:
    • Lasers
    • Annealing
    • Abstracts
    • Three dimensional displays
    • Absorption
    • Junctions
    • Silicon
  • dynamic_index_terms:
    • Thermal Annealing
    • Budget Process
    • Thermal Budget
    • Thin Layer
    • Thermal Process
    • Promising Solution
    • Image Sensor
    • Camera Sensor
    • Power Devices
    • Power Transistors
    • Power Semiconductor Devices
    • Device Layer
    • High-temperature Annealing
    • Low Budget
    • Ultrafast Process
    • Vertical Stacking
    • Thermal Annealing Process
    • Energy Density
    • Temperature Gradient
    • Thermal Gradient
    • Device Performance
    • Pulse Duration
    • Electrical Contact
    • Field Exposure
    • Properties Of Junctions
    • Laser Energy Density
    • Doping Profile
    • 3D Integration
    • Top Hat
• isbn_formats:
  • format: Online ISBN, value: 978-1-4673-1256-1, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4673-1258-5, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-1257-8, isbnType: New-2005
• authors:
  • Author Name: Julien Venturini
    Affiliation: Excico, Gennevilliers, France
    Author URL: https://ieeexplore.ieee.org/author/37411230000
    ID: 37411230000
    Order: 1
    Author Affiliations:
    • Excico, Gennevilliers, France

Image Sensor

• sensor_type: CMOS
• resolution: Not specified
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS imaging sensors used in BackSide Illuminated configurations for high sensitivity and performance.
• benefits: High quantum efficiency, particularly in the blue wavelength region, allowing for high-quality sensor performance.

Supporting Organizations

• supported_by: Excico

Manuscript Details

• publication_date: 14-15 May 2012

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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