Key Enabling Processes For Morethanmoore Technologies

• doi: 10.1109/SOI.2012.6404360
• title: Key enabling processes for more-than-moore technologies
• publisher: IEEE
• isbn: 978-1-4673-2689-6
• issn: 1078-621X
• partnum: 12CH39009
• rank: 2847
• access_type: LOCKED
• content_type: Conferences
• abstract: The continuation of Moore's law by conventional complementary metal oxide semiconductor (CMOS) scaling is becoming more and more challenging, requiring huge capital investments. 3D-IC with through-silicon via (TSV) interconnects provides another path towards “More Than Moore” with relatively smaller capital investment. Recent announcements from leading image sensor and memory manufacturers show that 3D-ICs are finally moving into high-volume manufacturing (HVM) putting “More Than Moore” in reality. Wafer bonding is the enabling process technology to make this happen. Two of the key wafer bonding techniques - low temperature fusion bonding as well as temporary bonding and de-bonding are the major subject of this contribution, introducing basic process flows and working principles for their CMOS integration.
• article_number: 6404360
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6404360
• html_url: https://ieeexplore.ieee.org/document/6404360/
• abstract_url: https://ieeexplore.ieee.org/document/6404360/
• publication_title: 2012 IEEE International SOI Conference (SOI)
• conference_location: Napa, CA, USA
• conference_dates: 1-4 Oct. 2012
• publication_number: 6387507
• is_number: 6404343
• publication_year: 2012
• publication_date: 1-4 Oct. 2012
• start_page: 1
• end_page: 2
• citing_paper_count: 2
• citing_patent_count: 0
• download_count: 747
• insert_date: 20130110
• index_terms:
  • ieee_terms:
    • Plasma temperature
    • Bonding
    • Wafer bonding
    • Surface treatment
    • Annealing
  • author_terms:
    • More-than-Moore
    • temporary bonding
    • debonding
    • low-temperature
    • direct bonding
    • fusion bonding
  • dynamic_index_terms:
    • Moore’s Law
    • Annealing Temperature
    • Bond Strength
    • Bond Energy
    • Standard Process
    • Activity In Plasma
    • Thermal Annealing
    • Higher Bond Strength
• isbn_formats:
  • format: Online ISBN, value: 978-1-4673-2689-6, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4673-2690-2, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4673-2691-9, isbnType: New-2005
• authors:
  • Author Name: P. Lindner
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37340522300
    ID: 37340522300
    Order: 1
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: T. Glinsner
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37327540900
    ID: 37327540900
    Order: 2
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: T. Uhrmann
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37394992300
    ID: 37394992300
    Order: 3
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: V. Dragoi
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37327968800
    ID: 37327968800
    Order: 4
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: T. Plach
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/38260969300
    ID: 38260969300
    Order: 5
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: T. Matthias
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37545979600
    ID: 37545979600
    Order: 6
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: E. Pabo
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37669499500
    ID: 37669499500
    Order: 7
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria
  • Author Name: M. Wimplinger
    Affiliation: EV Group, St. Florian am Inn, Austria
    Author URL: https://ieeexplore.ieee.org/author/37542679600
    ID: 37542679600
    Order: 8
    Author Affiliations:
    • EV Group, St. Florian am Inn, Austria

Image Sensor

• sensor_type: CMOS
• resolution: Not explicitly provided in the text
• dynamic_range: Not explicitly provided in the text
• pixel_size: Not explicitly provided in the text
• dark_current: Not explicitly provided in the text

Optical Data

• focal_length: Not explicitly provided in the text
• aperture: Not explicitly provided in the text
• field_of_view: Not explicitly provided in the text
• distortion: Not explicitly provided in the text

Performance Metrics

• frame_rate: Not explicitly provided in the text
• signal_to_noise_ratio: Not explicitly provided in the text
• sensitivity: Not explicitly provided in the text
• shutter_speed: Not explicitly provided in the text
• power_consumption: Not explicitly provided in the text
• noise: Not explicitly provided in the text

Applications & Benefits

• cell_imaging: Not explicitly provided in the text
• benefits: Not explicitly provided in the text

Supporting Organizations

• supported_by: Not explicitly provided in the text

Manuscript Details

• publication_date: 1-4 Oct. 2012

Relevancy Score

• score: 10
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • cell_imaging
  • benefits
  • supported_by

Processed JSON Filename

request_5a5d69cf-04b1-453a-b012-d896c5525832-key_enabling_processes_for_morethanmoore_technologies.json