Investigations On An Ultrathin Bendable Monolithic Si Cmos Image Sensor

• doi: 10.1109/JSEN.2013.2254474
• title: Investigations on an Ultra-Thin Bendable Monolithic Si CMOS Image Sensor
• publisher: IEEE
• isbn:
• issn: 2379-9153
• rank: 2832
• access_type: LOCKED
• content_type: Journals
• abstract: In this paper, theoretical as well as experimental results of the investigations on a bendable ultrathin Si monolithic CMOS image sensor are presented. The electro-optical behavior of a thinned flexible CMOS active pixel sensor for the application of uniaxial mechanical stress is theoretically and experimentally analyzed. The necessity of a correlated double sampling readout scheme to achieve a stress-independent operation is underlined. Optical as well as electrical characteristics of standard photodiodes on ultrathin silicon chips embedded into a polyimide foil under several bending configurations are discussed and experimental data are presented. Moreover, design rules for the stress-independent operation of a flexible ultrathin image sensor are given and the thinning and the encapsulation processes are shortly presented.
• article_number: 6484872
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6484872
• html_url: https://ieeexplore.ieee.org/document/6484872/
• abstract_url: https://ieeexplore.ieee.org/document/6484872/
• publication_title: IEEE Sensors Journal
• conference_location:
• conference_dates:
• publication_number: 7361
• is_number: 6583958
• publication_year: 2013
• publication_date: Oct. 2013
• start_page: 3892
• end_page: 3900
• citing_paper_count: 5
• citing_patent_count: 0
• download_count: 580
• insert_date: 20130322
• index_terms:
  • ieee_terms:
    • Stress
    • Silicon
    • Photodiodes
    • MOSFET
    • Optical sensors
    • Image sensors
  • author_terms:
    • Flexible CMOS image sensor
    • mechanical stress
    • photodiodes
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Ultrathin Si
    • Monolithic CMOS
    • Mechanical Stress
    • Active Sensors
    • Application Of Stress
    • Flexible Sensors
    • Silicon Chip
    • Negative Feedback
    • Theoretical Analysis
    • Electronic Devices
    • Output Signal
    • Compressive Stress
    • Optoelectronic Devices
    • Depletion Region
    • Space Charge Region
    • Depletion Layer
    • Depletion Zone
    • Use Of Feedback
    • Feedback Manipulation
    • Dark Current
    • Silicon Surface
    • Drain Current
    • Thin Processes
    • Bending Radius
    • Bending Radii
    • Readout Circuit
    • Effective Mobility
    • Drift Current
    • Current Mirror
    • Junction Capacitance
    • Bipolar Transistor
    • Bipolar Junction Transistor
    • Collector Current
    • Operational Amplifier
    • Op-amp
    • Design Techniques
• authors:
  • Author Name: Georgios C. Dogiamis
    Affiliation: University of Duisburg-Essen, Duisburg, Germany
    Author URL: https://ieeexplore.ieee.org/author/37086015404
    ID: 37086015404
    Order: 1
    Author Affiliations:
    • University of Duisburg-Essen, Duisburg, Germany
  • Author Name: Bedrich J. Hosticka
    Affiliation: University of Duisburg-Essen, Duisburg, Germany
    Author URL: https://ieeexplore.ieee.org/author/37275079700
    ID: 37275079700
    Order: 2
    Author Affiliations:
    • University of Duisburg-Essen, Duisburg, Germany
  • Author Name: Anton Grabmaier
    Affiliation: University of Duisburg-Essen, Duisburg, Germany
    Author URL: https://ieeexplore.ieee.org/author/37588742500
    ID: 37588742500
    Order: 3
    Author Affiliations:
    • University of Duisburg-Essen, Duisburg, Germany

Image Sensor

• sensor_type: CMOS
• resolution: 15x15
• dynamic_range: Not specified
• pixel_size: Not specified
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

Applications & Benefits

• cell_imaging: Enabled through the use of CMOS image sensors in applications such as smartphones and medical devices.
• benefits: Compact, flexible design and the ability to operate under mechanical stress.

Supporting Organizations

• supported_by: German Research Foundation (DFG) under Grant GR 3328/5-1.

Manuscript Details

• publication_date: Oct. 2013

Relevancy Score

• score: 8
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • temporal noise
  • fixed-pattern noise
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

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