Inductivelycoupled Highspeed Interconnects Of 3Dintegrated Cmos Image Sensors

• doi: 10.1109/ICICM56102.2022.10011292
• title: Inductively-Coupled High-Speed Interconnects of 3D-Integrated CMOS Image Sensors
• publisher: IEEE
• isbn: 978-1-6654-6058-3
• issn:
• rank: 2779
• access_type: LOCKED
• content_type: Conferences
• abstract: This paper presents a high-speed interconnect of 3D-integrated backside-illuminated (BSI) CMOS image Sensor (CIS) chip by inductive coupling link. With the CIS fusion oxide bonding process, the two stacked chips are able to be planted face to face, reducing the interconnect distance to 5um, which benefits for diminishing the channel insertion loss through inductive coupling. With a proper impedance matching network, the simulated insertion loss of the inductive coupling channel can be as low as -1.1dB. Schemes of inductive coupling links, either with or without carrier waves are compared. A $4 \times 4$ coupling array enables a data rate of 80Gb/s (5Gb/s per channel), corresponding to an area efficiency of 270Gbs/mm2. This scheme offers a realizable low-cost high-speed solution for BSI-CIS 3D integration.
• article_number: 10011292
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10011292
• html_url: https://ieeexplore.ieee.org/document/10011292/
• abstract_url: https://ieeexplore.ieee.org/document/10011292/
• publication_title: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM)
• conference_location: Xi'an, China
• conference_dates: 28-31 Oct. 2022
• publication_number: 10011216
• is_number: 10011228
• publication_year: 2022
• publication_date: 28-31 Oct. 2022
• start_page: 534
• end_page: 538
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 245
• insert_date: 20230116
• index_terms:
  • ieee_terms:
    • Couplings
    • Micromechanical devices
    • Power demand
    • Integrated circuit interconnections
    • Insertion loss
    • CMOS image sensors
    • Transceivers
  • author_terms:
    • backside-illuminated (BSI) CMOS image Sensor (CIS)
    • 3D integration
    • inductive coupling link
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Data Rate
    • Data Evaluation
    • Carrier Frequency
    • Carrier Wave
    • Carrier Signal
    • Coupling Coefficient
    • Mutual Inductance
    • Coupled Inductor
    • Impedance Matching
    • Insertion Loss
    • Matching Network
    • Proper Matching
    • 3D Integration
    • Quality Factor
    • Q-factor
    • Reflection Coefficient
    • Reflection Loss
    • Circuit Design
    • Channel Gain
    • Adjacent Channels
    • Wireless Interface
    • Radio Interface
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-6654-6058-3, isbnType: New-2005
  • format: USB ISBN, value: 978-1-6654-6042-2, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-6654-6043-9, isbnType: New-2005
• authors:
  • Author Name: Tongchuan Ma
    Affiliation: Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
    Author URL: https://ieeexplore.ieee.org/author/37089692596
    ID: 37089692596
    Order: 1
    Author Affiliations:
    • Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
  • Author Name: Zhihang Xu
    Affiliation: Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
    Author URL: https://ieeexplore.ieee.org/author/37089691830
    ID: 37089691830
    Order: 2
    Author Affiliations:
    • Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
  • Author Name: Li Du
    Affiliation: Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
    Author URL: https://ieeexplore.ieee.org/author/38467916100
    ID: 38467916100
    Order: 3
    Author Affiliations:
    • Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
  • Author Name: Yuan Du
    Affiliation: Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China
    Author URL: https://ieeexplore.ieee.org/author/37072435200
    ID: 37072435200
    Order: 4
    Author Affiliations:
    • Intelligent Sensing and Communication Lab (ISCL) School of Electronic Science and Engineering, Nanjing University, Nanjing, China

Image Sensor

• sensor_type: CMOS
• resolution: 33-Mpixel
• dynamic_range: unknown
• pixel_size: unknown
• dark_current: unknown

Optical Data

• focal_length: unknown
• aperture: unknown
• field_of_view: unknown
• distortion: unknown

Performance Metrics

• frame_rate: 240 fps
• signal_to_noise_ratio: unknown
• sensitivity: unknown
• shutter_speed: unknown
• power_consumption: unknown
• noise: unknown

Applications & Benefits

• cell_imaging: Widely used in smartphones, autonomous cars, and surveillance.
• benefits: Higher data throughput and performance for image sensing functions.

Supporting Organizations

• supported_by: Nanjing University, Intelligent Sensing and Communication Lab (ISCL)

Manuscript Details

• publication_date: 28-31 Oct. 2022

Relevancy Score

• score: 10
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_06d8e1c8-ade3-4b50-b7e0-1c130e3fbd0e-inductivelycoupled_highspeed_interconnects_of_3dintegrated_cmos_image_sensors.json