Improvement For Bond Pads Discolor Sic Of Cmos Image Sensor Products
- doi: 10.1109/ISDRS.2001.984442
-
title: Improvement for bond pads discolor (sic) of CMOS
image sensor products
- publisher: IEEE
- isbn: 0-7803-7432-0
- issn:
- partnum: 01EX497
- rank: 2751
- access_type: LOCKED
- content_type: Conferences
-
abstract: The CMOS image sensor is covered with a color
filter. Bond pads discoloration was found after the color filter
process. SEM analysis showed metal loss of the bond pads, and residues
in the discolored area. EDS results showed the residues contained mostly
C and O elements, indicating photoresist residues. These defects caused
package reliability problems based on a bondability test. Color filter
processes are composed of multicolor photoresist layers. During several
development processes most of the metal was lost, inducing metal film
roughness and then causing photoresist residues on the bond pads. In
order to improve bond pads discoloration, two methods for the color
filter processes were evaluated: (1) decreased rework (development
process) frequency, and (2) added bond pads protection, which showed
some success.
- article_number: 984442
-
pdf_url:
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=984442
-
html_url:
https://ieeexplore.ieee.org/document/984442/
-
abstract_url:
https://ieeexplore.ieee.org/document/984442/
-
publication_title: 2001 International Semiconductor
Device Research Symposium. Symposium Proceedings (Cat. No.01EX497)
- conference_location: Washington, DC, USA
- conference_dates: 5-7 Dec. 2001
- publication_number: 7731
- is_number: 21224
- publication_year: 2001
- publication_date: 5-7 Dec. 2001
- start_page: 77
- end_page: 78
- citing_paper_count: 0
- citing_patent_count: 0
- download_count: 260
- insert_date: 20020807
-
index_terms:
-
ieee_terms:
- Bonding
- Atherosclerosis
- CMOS image sensors
- Filters
- Color
- Computational Intelligence Society
- Scanning electron microscopy
- Protection
- Resists
- Frequency
-
dynamic_index_terms:
- Bond Pads
- Scanning Electron Microscopy
- Energy-dispersive X-ray Spectroscopy
- Energy Dispersive Spectroscopy
- Color Filter
-
isbn_formats:
-
format: Print ISBN,
value: 0-7803-7432-0,
isbnType: Historical
-
authors:
-
Author Name: Chih-Hsing Chen
Affiliation: Taiwan Semiconductor Manufacturing
Company Limited, Hsinchu, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37087454773
ID: 37087454773
Order: 1
Author Affiliations:
-
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu,
Taiwan
-
Author Name: Hong-Wen Huang
Affiliation: Taiwan Semiconductor Manufacturing
Company Limited, Hsinchu, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37088179241
ID: 37088179241
Order: 2
Author Affiliations:
-
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu,
Taiwan
-
Author Name: Chih-Chen Kuo
Affiliation: Taiwan Semiconductor Manufacturing
Company Limited, Hsinchu, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37088181567
ID: 37088181567
Order: 3
Author Affiliations:
-
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu,
Taiwan
-
Author Name: Hung-Jen Tsai
Affiliation: Taiwan Semiconductor Manufacturing
Company Limited, Hsinchu, Taiwan
Author URL:
https://ieeexplore.ieee.org/author/37087454248
ID: 37087454248
Order: 4
Author Affiliations:
-
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu,
Taiwan
Image Sensor
- sensor_type: CMOS
- resolution: Not specified
- dynamic_range: Not specified
- pixel_size: Not specified
- dark_current: Not specified
Optical Data
- focal_length: Not specified
- aperture: Not specified
- field_of_view: Not specified
- distortion: Not specified
Performance Metrics
Applications & Benefits
- cell_imaging: Not specified
-
benefits: Used in smartphones, medical devices, and
automotive systems.
Supporting Organizations
-
supported_by: Taiwan Semiconductor Manufacturing
Company Ltd. (TSMC)
Manuscript Details
- publication_date: 5-7 Dec. 2001
Relevancy Score
- score: 10
-
missing_fields:
- resolution
- dynamic_range
- pixel_size
- dark_current
- focal_length
- aperture
- field_of_view
- distortion
- frame_rate
- signal_to_noise_ratio
- sensitivity
- shutter_speed
- power_consumption
- noise
- cell_imaging
- benefits
- publication_date
Processed JSON Filename
request_879bab55-d6f6-47e7-ae26-24f0f05ffa42-improvement_for_bond_pads_discolor_sic_of_cmos_image_sensor_products.json