Image Capture Using Integrated 3D Softchip Technology

• doi: 10.1109/HSNMC.2002.1032389
• title: Image capture using integrated 3D SoftChip technology
• publisher: IEEE
• isbn: 0-7803-7600-5
• issn:
• partnum: 02EX612
• rank: 2699
• access_type: LOCKED
• content_type: Conferences
• abstract: Mobile multimedia communication has rapidly become a significant area of research and development. The processing requirements for the capture, conversion, compression, decompression, enhancement, display, etc. of high quality multimedia content places heavy demands even on current ULSI (ultra large scale integration) systems, particularly for mobile applications where area and power are primary considerations. The system presented is designed as a vertically integrated (3D) system comprising two distinct layers bonded together using indium bump technology. The top layer is a CMOS imaging array containing analog-to-digital converters, and a buffer memory. The bottom layer takes the form of a configurable array processor (CAP), a highly parallel array of soft programmable processors capable of carrying out complex processing tasks directly on data stored in the top plane. Until recently, the dominant format of data in imaging devices has been analog. The analog photocurrent or sampled voltage is transferred to the ADC via a column or a column/row bus. In the proposed system, an array of analog-to-digital converters is distributed, so that a one-bit cell is associated with one sensor. The analog-to-digital converters are algorithmic current-mode converters. Eight such cells are cascaded to form an 8-bit converter. Additionally, each photosensor is equipped with a current memory cell, and multiple conversions are performed with scaled values of the photocurrent for colour processing.
• article_number: 1032389
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=1032389
• html_url: https://ieeexplore.ieee.org/document/1032389/
• abstract_url: https://ieeexplore.ieee.org/document/1032389/
• publication_title: 5th IEEE International Conference on High Speed Networks and Multimedia Communication (Cat. No.02EX612)
• conference_location: Jeju, Korea (South)
• conference_dates: 3-5 July 2002
• publication_number: 8024
• is_number: 22157
• publication_year: 2002
• publication_date: 3-5 July 2002
• start_page: 19
• end_page: 23
• citing_paper_count: 0
• citing_patent_count: 0
• download_count: 55
• insert_date: 20021107
• index_terms:
  • ieee_terms:
    • Analog-digital conversion
    • Sensor arrays
    • Ultra large scale integration
    • Photoconductivity
    • Multimedia communication
    • Mobile communication
    • Research and development
    • Image converters
    • Image coding
    • Displays
  • dynamic_index_terms:
    • Research And Development
    • Mobile App
    • Mobile Application
    • Smartphone Application
    • Smartphone App
    • Bottom Layer
    • Photocurrent
    • Imaging Device
    • Vertical Integration
    • Supplier Integration
    • Primary Consideration
    • Vector Process
    • Vector Facility
    • Array Processor
    • Top Plane
    • Parallelization
    • Parallel Computing
    • Inverter
    • Color Space
    • Color Components
    • Mobile Communication
    • Mobile Telecommunications
    • Mobile Telephone
    • Mobile Telephony
    • Sensor Array
    • Simple Implementation
    • Inactive Cells
    • Clock Rate
    • Clock Speed
    • Processor Speed
    • Input Current
    • Digital Output
    • Current Mirror
    • Real-time Performance
    • Real-time Processing
    • Real-time Operation
    • Data Bus
• isbn_formats:
  • format: Print ISBN, value: 0-7803-7600-5, isbnType: Historical
• authors:
  • Author Name: S. Lachowicz
    Affiliation: Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    Author URL: https://ieeexplore.ieee.org/author/37297147000
    ID: 37297147000
    Order: 1
    Author Affiliations:
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
  • Author Name: A. Rassau
    Affiliation: Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    Author URL: https://ieeexplore.ieee.org/author/37297368400
    ID: 37297368400
    Order: 2
    Author Affiliations:
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
  • Author Name: G. Alagoda
    Affiliation: Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    Author URL: https://ieeexplore.ieee.org/author/37326974500
    ID: 37326974500
    Order: 3
    Author Affiliations:
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
  • Author Name: K. Eshraghian
    Affiliation: Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    Author URL: https://ieeexplore.ieee.org/author/37326970400
    ID: 37326970400
    Order: 4
    Author Affiliations:
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
    • Centre for Very High Speed Microelectronic Systems, Edith Cowan University, Joondalup, WA, Australia
  • Author Name: M.M.-O. Lee
    Affiliation: School of EE Information and Communication Eng., Dongshin University, Naju, Chonnam, Korea
    Author URL: https://ieeexplore.ieee.org/author/37336249400
    ID: 37336249400
    Order: 5
    Author Affiliations:
    • School of EE Information and Communication Eng., Dongshin University, Naju, Chonnam, Korea
  • Author Name: Seung-Min Lee
    Affiliation: School of EE Information and Communication Eng., Dongshin University, Naju, Chonnam, Korea
    Author URL: https://ieeexplore.ieee.org/author/37086990564
    ID: 37086990564
    Order: 6
    Author Affiliations:
    • School of EE Information and Communication Eng., Dongshin University, Naju, Chonnam, Korea

Image Sensor

• sensor_type: CMOS
• resolution: 352x288
• dynamic_range: Not specified
• pixel_size: 50 µm x 50 µm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• power_consumption: 5.3 mW

Applications & Benefits

• cell_imaging: Ideal for mobile multimedia applications, offering low power consumption and real-time processing capabilities.
• benefits: Highly flexible due to its programmable nature and efficient due to vertical interconnects.

Supporting Organizations

• supported_by: Australian Research Council, Centre for Very High Speed Microelectronic Systems, Edith Cowan University

Manuscript Details

• publication_date: 3-5 July 2002

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • noise

Processed JSON Filename

request_e267842b-b8a5-4ee8-b392-6b6f61a75129-image_capture_using_integrated_3d_softchip_technology.json