Hybrid Bonding For 3D Stacked Image Sensors Impact Of Pitch Shrinkage On Interconnect Robustness

• doi: 10.1109/IEDM.2018.8614570
• title: Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
• publisher: IEEE
• isbn: 978-1-7281-1988-5
• issn: 0163-1918
• rank: 2674
• access_type: LOCKED
• content_type: Conferences
• abstract: Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling down could jeopardize electrical and reliability performance. A study of the influence of hybrid bonding pitch shrinkage on a 3D stacked backside illuminated CMOS image sensor was performed from a process, device performance and robustness perspectives, from 8.8 μm down to 1.44 μm bonding pitches. As a result no defect related to smaller bonding pads was evidenced neither by thermal cycling nor by electromigration, thus validating fine-pitch hybrid bonding robustness and introduction for next generation image sensors.
• article_number: 8614570
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8614570
• html_url: https://ieeexplore.ieee.org/document/8614570/
• abstract_url: https://ieeexplore.ieee.org/document/8614570/
• publication_title: 2018 IEEE International Electron Devices Meeting (IEDM)
• conference_location: San Francisco, CA, USA
• conference_dates: 1-5 Dec. 2018
• publication_number: 8601505
• is_number: 8614478
• publication_year: 2018
• publication_date: 1-5 Dec. 2018
• start_page: 7.3.1
• end_page: 7.3.4
• citing_paper_count: 61
• citing_patent_count: 0
• download_count: 3104
• insert_date: 20190117
• index_terms:
  • ieee_terms:
    • Bonding
    • Resistance
    • Finite element analysis
    • Three-dimensional displays
    • Robustness
    • Optical imaging
    • Optical sensors
  • dynamic_index_terms:
    • Image Sensor
    • Camera Sensor
    • Hybrid Bonding
    • Electromigration
    • Impedance
    • Resistivity
    • Atomic Force Microscopy
    • Finite Element Method
    • Finite Element Methods
    • Finite-element Method
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Analog-to-digital Converter
    • Analog-to-digital
    • Digital-to-analog Converter
    • Delamination
    • High Dynamic Range
    • High-dynamic-range
    • Optical Performance
    • Electron Backscatter Diffraction
    • EBSD
    • Test Vehicle
    • Finite Element Method Simulations
    • Finite-element Method Simulation
    • Metal Lines
    • Metallic Lines
    • Single-photon Avalanche Diode
    • Single Photon Avalanche Diode
    • Back-end-of-line
    • Back End Of Line
• isbn_formats:
  • format: Print on Demand(PoD) ISBN, value: 978-1-7281-1988-5, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-7281-1987-8, isbnType: New-2005
• authors:
  • Author Name: J. Jourdon
    Affiliation: University of Bordeaux, IMS Laboratory, Talence, France
    Author URL: https://ieeexplore.ieee.org/author/37086015251
    ID: 37086015251
    Order: 1
    Author Affiliations:
    • University of Bordeaux, IMS Laboratory, Talence, France
  • Author Name: S. Lhostis
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37396261500
    ID: 37396261500
    Order: 2
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: S. Moreau
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37604277500
    ID: 37604277500
    Order: 3
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: J. Chossat
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37088488670
    ID: 37088488670
    Order: 4
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: M. Arnoux
    Affiliation: STMicroelectronics, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37086375248
    ID: 37086375248
    Order: 5
    Author Affiliations:
    • STMicroelectronics, Grenoble, France
  • Author Name: C. Sart
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37085529474
    ID: 37085529474
    Order: 6
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: Y. Henrion
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37085670613
    ID: 37085670613
    Order: 7
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: P. Lamontagne
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37847131300
    ID: 37847131300
    Order: 8
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: L. Arnaud
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37265352700
    ID: 37265352700
    Order: 9
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: N. Bresson
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37283050000
    ID: 37283050000
    Order: 10
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: V. Balan
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37583784300
    ID: 37583784300
    Order: 11
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: C. Euvrard
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/38072841300
    ID: 38072841300
    Order: 12
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: Y. Exbrayat
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37086032492
    ID: 37086032492
    Order: 13
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: D. Scevola
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37974720100
    ID: 37974720100
    Order: 14
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: E. Deloffre
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37688097800
    ID: 37688097800
    Order: 15
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: S. Mermoz
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37064182700
    ID: 37064182700
    Order: 16
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: A. Martin
    Affiliation: STMicroelectronics, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37088726049
    ID: 37088726049
    Order: 17
    Author Affiliations:
    • STMicroelectronics, Grenoble, France
  • Author Name: H. Bilgen
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37296752200
    ID: 37296752200
    Order: 18
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: F. Andre
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37088737092
    ID: 37088737092
    Order: 19
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: C. Charles
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37088725808
    ID: 37088725808
    Order: 20
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: D. Bouchu
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37427454800
    ID: 37427454800
    Order: 21
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: A. Farcy
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37266012400
    ID: 37266012400
    Order: 22
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: S. Guillaumet
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37296701400
    ID: 37296701400
    Order: 23
    Author Affiliations:
    • STMicroelectronics, Crolles, France
  • Author Name: A. Jouve
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37401785900
    ID: 37401785900
    Order: 24
    Author Affiliations:
    • CEA-LETI, Grenoble, France
  • Author Name: H. Fremont
    Affiliation: University of Bordeaux, IMS Laboratory, Talence, France
    Author URL: https://ieeexplore.ieee.org/author/37271367700
    ID: 37271367700
    Order: 25
    Author Affiliations:
    • University of Bordeaux, IMS Laboratory, Talence, France
  • Author Name: S. Cheramy
    Affiliation: CEA-LETI, Grenoble, France
    Author URL: https://ieeexplore.ieee.org/author/37401683300
    ID: 37401683300
    Order: 26
    Author Affiliations:
    • CEA-LETI, Grenoble, France

Image Sensor

• sensor_type: CMOS
• resolution: 14 Mpixels
• dynamic_range: Not specified
• pixel_size: 1.5 μm
• dark_current: Not specified

Optical Data

• focal_length: Not specified
• aperture: Not specified
• field_of_view: Not specified
• distortion: Not specified

Performance Metrics

• frame_rate: 600 Mpixels/s

Applications & Benefits

• cell_imaging: 3D stacked sensor for various imaging applications.
• benefits: Use of fine pitch for 3D stacked CIS demonstrated robust performance.

Supporting Organizations

• supported_by: French national ANR-10-AIRT-05 and ENIAC Joint Initiative projects.

Manuscript Details

• publication_date: 1-5 Dec. 2018

Relevancy Score

• score: 10
• missing_fields:
  • dynamic_range
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise
  • signal_to_noise_ratio

Processed JSON Filename

request_050fa8d4-6a49-4567-84f9-f450a3221389-hybrid_bonding_for_3d_stacked_image_sensors_impact_of_pitch_shrinkage_on_interconnect_robustness.json