Heterogeneous 3D Integration Using Selfassembly And Electrostatic Bonding

• doi: 10.1109/TCPMT.2016.2575070
• title: Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding
• publisher: IEEE
• isbn:
• issn: 2156-3985
• rank: 2577
• access_type: LOCKED
• content_type: Journals
• abstract: To overcome various concerns caused by scaling down the device size in future Large Scale Integrated Circuits (LSIs), it is indispensable to introduce a new concept of heterogeneous 3-D integration in which various kinds of device chips with different sizes, different devices, and different materials are vertically stacked. To achieve such heterogeneous 3-D integration, a key technology of self-assembly and electrostatic bonding has been developed. Exploring new devices for the Internet of Things, we have fabricated several kinds of heterogeneous 3-D LSIs called superchip by stacking compound semiconductor device chip, photonic device chip, and spintronic device chip on CMOS device chips using self-assembly and electrostatic bonding. Furthermore, a new system integration technology using a large-area substrate has been developed to reduce the cost of 2.5-D/3-D system module. A 3-D-stacked image sensor system module for automatic driving vehicle has been fabricated using this technology.
• article_number: 7498659
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7498659
• html_url: https://ieeexplore.ieee.org/document/7498659/
• abstract_url: https://ieeexplore.ieee.org/document/7498659/
• publication_title: IEEE Transactions on Components, Packaging and Manufacturing Technology
• conference_location:
• conference_dates:
• publication_number: 5503870
• is_number: 7514286
• publication_year: 2016
• publication_date: July 2016
• start_page: 1000
• end_page: 1006
• citing_paper_count: 6
• citing_patent_count: 0
• download_count: 585
• insert_date: 20160623
• index_terms:
  • ieee_terms:
    • Self-assembly
    • Substrates
    • Bonding
    • Electrostatics
    • Integrated optics
    • Optical device fabrication
    • Glass
  • author_terms:
    • 3-D-LSI
    • 3-D-stacked image sensor
    • 3-D-stacked microprocessor
    • electrostatic bonding
    • heterogeneous integration
    • self-assembly
    • superchip
  • dynamic_index_terms:
    • Ionic Interactions
    • Electrostatic Bonds
    • Ionic Bonds
    • Internet Of Things
    • Image Sensor
    • Camera Sensor
    • System Modulation
    • Photonic Integrated Circuits
    • Integrated Optics
    • Photonic Chip
    • Future Large Scale
    • Chip Device
    • High Throughput
    • Product Yield
    • 3D Images
    • Glass Substrate
    • Electrostatic Forces
    • Multi-core
    • Quad-core
    • Dual-core
    • CPU Cores
    • Silicon Wafer
    • Low Power Consumption
    • Opposite Polarity
    • Polarity Reversal
    • Magnetization Reversal
    • Products In High Yields
    • Reactive Ion Etching
    • Alignment Accuracy
    • 3D Graph
    • 3D Computer Graphics
    • Small Form Factor
    • Liquid Surface Tension
    • Surface Tension Of Liquids
    • Heterogeneous Integration
    • Multichip Module
    • Flip-chip
    • Microbumps
    • Processor Chip
    • Assembly Time
    • Spin Transfer Torque
    • Spin Transfer
    • Output Signal
• authors:
  • Author Name: Mitsumasa Koyanagi
    Affiliation: New Industry Hatchery Center, Global Integration Initiative, Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37283392400
    ID: 37283392400
    Order: 1
    Author Affiliations:
    • New Industry Hatchery Center, Global Integration Initiative, Tohoku University, Sendai, Japan
  • Author Name: Takafumi Fukushima
    Affiliation: Graduate School of Biomedical Engineering, Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37396820300
    ID: 37396820300
    Order: 2
    Author Affiliations:
    • Graduate School of Biomedical Engineering, Tohoku University, Sendai, Japan
  • Author Name: Kang-Wook Lee
    Affiliation: New Industry Hatchery Center, Global Integration Initiative, Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37407640200
    ID: 37407640200
    Order: 3
    Author Affiliations:
    • New Industry Hatchery Center, Global Integration Initiative, Tohoku University, Sendai, Japan
  • Author Name: Tetsu Tanaka
    Affiliation: Graduate School of Biomedical Engineering, Tohoku University, Sendai, Japan
    Author URL: https://ieeexplore.ieee.org/author/37403329200
    ID: 37403329200
    Order: 4
    Author Affiliations:
    • Graduate School of Biomedical Engineering, Tohoku University, Sendai, Japan

Image Sensor

• sensor_type: CMOS
• resolution: 3-D-stacked Quarter Video Graphics Array (QVGA)
• dynamic_range:
• pixel_size:
• dark_current:

Optical Data

• focal_length:
• aperture:
• field_of_view:
• distortion:

Performance Metrics

• frame_rate: 10,000 frames/s
• signal_to_noise_ratio:
• sensitivity:
• shutter_speed:
• power_consumption:
• noise:

Applications & Benefits

• cell_imaging: 3-D-stacked CMOS Image Sensor (CIS) chip
• benefits: High performance, low power, small form factor, multifunctionality in embedded systems for IoT applications.

Supporting Organizations

• supported_by: Not specified in the text.

Manuscript Details

• publication_date: July 2016

Relevancy Score

• score: 9
• missing_fields:
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

request_d087b565-e9ce-403c-827f-484cc35e5cbd-heterogeneous_3d_integration_using_selfassembly_and_electrostatic_bonding.json