From 3Dsoc To 3D Heterogeneous Systems Technology And Applications

• doi:
• title: From 3D-SOC to 3D heterogeneous systems: Technology and applications
• publisher: IEEE
• isbn: 978-4-86348-166-4
• issn: 0743-1562
• partnum: 11CH38819
• rank: 2527
• access_type: LOCKED
• content_type: Conferences
• abstract: A wide range of requests coming from customer appears to demonstrate the feasibility of 3D Integration (3DI). The first industrial application is the CMOS Image Sensor. Medium to high density applications are related to consumer & wireless markets were 3DI overcomes limitations of SOC in term of performances, cost and time to market. For More than Moore applications, 3DI brings real heterogeneous integration with multi-physics systems such as complex camera module, wireless links and sensors.
• article_number: 5984695
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5984695
• html_url: https://ieeexplore.ieee.org/document/5984695/
• abstract_url: https://ieeexplore.ieee.org/document/5984695/
• publication_title: 2011 Symposium on VLSI Technology - Digest of Technical Papers
• conference_location: Kyoto, Japan
• conference_dates: 14-16 June 2011
• publication_number: 5976318
• is_number: 5984315
• publication_year: 2011
• publication_date: 14-16 June 2011
• start_page: 180
• end_page: 181
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 474
• insert_date: 20110818
• index_terms:
  • ieee_terms:
    • Through-silicon vias
    • Three dimensional displays
    • CMOS integrated circuits
    • Silicon
    • System-on-a-chip
    • Sensors
    • CMOS image sensors
  • author_terms:
    • 3D Integration (3DI)
    • Heterogeneous systems
    • 3D System-On-Chip (3D-SOC)
    • Through Silicon Via (TSV)
    • Wafer Level Packaging (WLP)
  • dynamic_index_terms:
    • Heterogeneous Integration
    • Multichip Module
    • Camera Module
    • 3D Integration
    • Inertial Measurement Unit
    • Inertial Sensors
• isbn_formats:
  • format: CD, value: 978-4-86348-166-4, isbnType: New-2005
  • format: Print ISBN, value: 978-1-4244-9949-6, isbnType: New-2005
• authors:
  • Author Name: P. Ancey
    Affiliation: STMicroelectronics, Crolles, France
    Author URL: https://ieeexplore.ieee.org/author/37283790400
    ID: 37283790400
    Order: 1
    Author Affiliations:
    • STMicroelectronics, Crolles, France

Image Sensor

• sensor_type: CMOS
• resolution: not specified
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

Applications & Benefits

• cell_imaging: CMOS Image Sensors are used in mobile phones, computers, and potentially other consumer electronics for imaging applications.
• benefits: 3D Integration (3DI) allows for improved performance, reduced cost, and time-to-market advantages in CMOS image sensors.

Supporting Organizations

• supported_by: STMicroelectronics, ST-Ericsson, LETI

Manuscript Details

• publication_date: 14-16 June 2011

Relevancy Score

• score: 9
• missing_fields:
  • resolution
  • dynamic_range
  • pixel_size
  • dark_current
  • focal_length
  • aperture
  • field_of_view
  • distortion
  • frame_rate
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed
  • power_consumption
  • noise

Processed JSON Filename

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