Form Factor Improvement Of Smartpixels For Vision Sensors Through 3D Verticallyintegrated Technologies

• doi: 10.1109/LASCAS.2014.6820327
• title: Form factor improvement of smart-pixels for vision sensors through 3-D vertically-integrated technologies
• publisher: IEEE
• isbn: 978-1-4799-2506-3
• issn:
• rank: 2518
• access_type: LOCKED
• content_type: Conferences
• abstract: While conventional CMOS active pixel sensors embed only the circuitry required for photo-detection, pixel addressing and voltage buffering, smart pixels incorporate also circuitry for data processing, data storage and control of data interchange. This additional circuitry enables data processing be realized concurrently with the acquisition of images which is instrumental to reduce the number of data needed to carry to information contained into images. This way, more efficient vision systems can be built at the cost of larger pixel pitch. Vertically-integrated 3D technologies enable to keep the advnatges of smart pixels while improving the form factor of smart pixels.
• article_number: 6820327
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6820327
• html_url: https://ieeexplore.ieee.org/document/6820327/
• abstract_url: https://ieeexplore.ieee.org/document/6820327/
• publication_title: 2014 IEEE 5th Latin American Symposium on Circuits and Systems
• conference_location: Santiago, Chile
• conference_dates: 25-28 Feb. 2014
• publication_number: 6815880
• is_number: 6820243
• publication_year: 2014
• publication_date: 25-28 Feb. 2014
• start_page: 1
• end_page: 4
• citing_paper_count: 1
• citing_patent_count: 0
• download_count: 140
• insert_date: 20140526
• index_terms:
  • ieee_terms:
    • Computer architecture
    • CMOS image sensors
    • Feature extraction
    • Machine vision
    • Intelligent sensors
  • dynamic_index_terms:
    • Form Factor
    • 3D Technology
    • Pixel Pitch
    • Sensor Pixel
    • Camera System
    • Vision Tasks
    • 3D Architecture
    • High Dynamic Range
    • Multi-scale Representation
    • Large Pitch
• isbn_formats:
  • format: CD, value: 978-1-4799-2506-3, isbnType: New-2005
  • format: Electronic ISBN, value: 978-1-4799-2507-0, isbnType: New-2005
• authors:
  • Author Name: Angel Rodríguez-Vázquez
    Affiliation: University of Seville
    Author URL: https://ieeexplore.ieee.org/author/38274433100
    ID: 38274433100
    Order: 1
    Author Affiliations:
    • University of Seville
  • Author Name: Ricardo Carmona-Galán
    Affiliation: Instituto de Microelectrónica de Sevilla, IMSE-CNM
    Author URL: https://ieeexplore.ieee.org/author/38270644000
    ID: 38270644000
    Order: 2
    Author Affiliations:
    • Instituto de Microelectrónica de Sevilla, IMSE-CNM
  • Author Name: Jorge Fernández Berni
    Affiliation: University of Seville
    Author URL: https://ieeexplore.ieee.org/author/37086739369
    ID: 37086739369
    Order: 3
    Author Affiliations:
    • University of Seville
  • Author Name: Sonia Vargas
    Affiliation: Instituto de Microelectrónica de Sevilla, IMSE-CNM
    Author URL: https://ieeexplore.ieee.org/author/38046860300
    ID: 38046860300
    Order: 4
    Author Affiliations:
    • Instituto de Microelectrónica de Sevilla, IMSE-CNM
  • Author Name: Juan A. Leñero
    Affiliation: Instituto de Microelectrónica de Sevilla, IMSE-CNM
    Author URL: https://ieeexplore.ieee.org/author/37086739294
    ID: 37086739294
    Order: 5
    Author Affiliations:
    • Instituto de Microelectrónica de Sevilla, IMSE-CNM
  • Author Name: M. Suárez
    Affiliation: Centro de Investigación en Tecnologias de la Información (CITIUS), Universidad de Santiago de Compostela, Sevilla, SPAIN
    Author URL: https://ieeexplore.ieee.org/author/38322008600
    ID: 38322008600
    Order: 6
    Author Affiliations:
    • Centro de Investigación en Tecnologias de la Información (CITIUS), Universidad de Santiago de Compostela, Sevilla, SPAIN
  • Author Name: Victor Brea
    Affiliation: Centro de Investigación en Tecnologias de la Información (CITIUS), Universidad de Santiago de Compostela, Sevilla, SPAIN
    Author URL: https://ieeexplore.ieee.org/author/37266506900
    ID: 37266506900
    Order: 7
    Author Affiliations:
    • Centro de Investigación en Tecnologias de la Información (CITIUS), Universidad de Santiago de Compostela, Sevilla, SPAIN
  • Author Name: Belén Pérez-Verdú
    Affiliation: Instituto de Microelectrónica de Sevilla, IMSE-CNM
    Author URL: https://ieeexplore.ieee.org/author/38361308100
    ID: 38361308100
    Order: 8
    Author Affiliations:
    • Instituto de Microelectrónica de Sevilla, IMSE-CNM

Image Sensor

• sensor_type: CMOS
• resolution: Not explicitly stated
• dynamic_range: Over 151dB
• pixel_size: Not explicitly stated, but mentions large pixel pitch in the range of tens of micrometres
• dark_current: Not explicitly stated

Optical Data

• focal_length: Not explicitly stated
• aperture: Not explicitly stated
• field_of_view: Not explicitly stated
• distortion: Not explicitly stated

Performance Metrics

• frame_rate: 1,000 fps
• signal_to_noise_ratio: Not explicitly stated
• sensitivity: Not explicitly stated
• shutter_speed: Not explicitly stated
• power_consumption: 60nW per pixel
• noise: Not explicitly stated

Applications & Benefits

• cell_imaging: Not explicitly stated, but applications include vision-enabled wireless sensor networks and industrial machine vision systems.
• benefits: Enhanced speed, reduced power consumption, and capability for on-chip processing.

Supporting Organizations

• supported_by: ONR, Spanish Ministry of Science and Innovation

Manuscript Details

• publication_date: 25-28 Feb. 2014

Relevancy Score

• score: 9
• missing_fields:
  • pixel_size
  • optical_data
  • performance_metrics
  • field_of_view
  • distortion
  • focal_length
  • aperture
  • signal_to_noise_ratio
  • sensitivity
  • shutter_speed

Processed JSON Filename

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