Flip Chip Interconnection Method Applied To Small Camera Module

• doi: 10.1109/ECTC.2001.927938
• title: Flip chip interconnection method applied to small camera module
• publisher: IEEE
• isbn: 0-7803-7038-4
• issn: 0569-5503
• partnum: 01CH37220
• rank: 2511
• access_type: LOCKED
• content_type: Conferences
• abstract: Small cameras used as image storage devices have been rapidly applied to mobile information devices since the improvement of picture quality and the development of an easy picture processing method. The authors have developed a small camera module (3.6 cc, 30(W)/spl times/15(D)/spl times/8(H) mm/sup 3/; including lens unit) using two bare chip bonding methods. One is the CMOS image sensor packaging technique for fabrication on a flexible substrate by the ACP (anisotropic conductive paste) bonding method. The other is the flip chip bonding method which utilizes the advanced ACP method for a DSP (digital signal processor) chip. The new ACP enables a short resin curing time of less than six seconds. The ACP can also withstand the reflow soldering process, so that the bare chip IC and chip components can be mounted on the same substrate. By using these bare chip bonding techniques, the small camera module was realized. Regarding the ACP, its humidity absorption property was improved to obtain a high reliability. The filler content of the ACP was also controlled to obtain a high reliability. The flip chip bonding margin was confirmed to be applicable to mass production.
• article_number: 927938
• pdf_url: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=927938
• html_url: https://ieeexplore.ieee.org/document/927938/
• abstract_url: https://ieeexplore.ieee.org/document/927938/
• publication_title: 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
• conference_location: Orlando, FL, USA
• conference_dates: 29 May-1 June 2001
• publication_number: 7382
• is_number: 20058
• publication_year: 2001
• publication_date: 29 May-1 June 2001
• start_page: 1024
• end_page: 1028
• citing_paper_count: 3
• citing_patent_count: 2
• download_count: 209
• insert_date: 20020807
• index_terms:
  • ieee_terms:
    • Flip chip
    • Cameras
    • Bonding
    • Image storage
    • Image processing
    • Lenses
    • CMOS image sensors
    • Packaging
    • Fabrication
    • Anisotropic magnetoresistance
  • dynamic_index_terms:
    • Flip-chip
    • Microbumps
    • Camera Module
    • Curing Time
    • Setting Time
    • Polyethylene Terephthalate
    • Dacron
    • Flexible Substrates
    • Image Sensor
    • Camera Sensor
    • Small Modifications
    • Digital Signal Processing
    • Filler Content
    • Electrode
    • High Production
    • Thermal Expansion
    • Coefficient Of Thermal Expansion
    • Contact Mechanics
    • Adhesion Defects
    • Ultrasonic Testing
    • Ultrasonic Inspection
    • Heterogeneous Integration
    • Multichip Module
    • Optical Glass
    • Fast Curing
    • Fast Hardening
• isbn_formats:
  • format: Print ISBN, value: 0-7803-7038-4, isbnType: Historical
• authors:
  • Author Name: J. Karasawa
    Affiliation: Toshiba Corporate Manufacturing Engineering Center, Yokohama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088203625
    ID: 37088203625
    Order: 1
    Author Affiliations:
    • Toshiba Corporate Manufacturing Engineering Center, Yokohama, Japan
  • Author Name: M. Segawa
    Affiliation: Toshiba Corporate Manufacturing Engineering Center, Yokohama, Japan
    Author URL: https://ieeexplore.ieee.org/author/37351950800
    ID: 37351950800
    Order: 2
    Author Affiliations:
    • Toshiba Corporate Manufacturing Engineering Center, Yokohama, Japan
  • Author Name: Y. Kishimoto
    Affiliation: Toshiba Chemical Company Limited, Japan
    Author URL: https://ieeexplore.ieee.org/author/37363721500
    ID: 37363721500
    Order: 3
    Author Affiliations:
    • Toshiba Chemical Company Limited, Japan
  • Author Name: M. Aoki
    Affiliation: Toshiba Fukaya Works, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088205221
    ID: 37088205221
    Order: 4
    Author Affiliations:
    • Toshiba Fukaya Works, Japan
  • Author Name: T. Sasaki
    Affiliation: Toshiba Digital Media Engineering Company Limited, Japan
    Author URL: https://ieeexplore.ieee.org/author/37088202979
    ID: 37088202979
    Order: 5
    Author Affiliations:
    • Toshiba Digital Media Engineering Company Limited, Japan

Image Sensor

• sensor_type: CIF-CMOS
• resolution: 100kpixels
• dynamic_range: not specified
• pixel_size: not specified
• dark_current: not specified

Optical Data

• focal_length: not specified
• aperture: not specified
• field_of_view: not specified
• distortion: not specified

Performance Metrics

• power_consumption: 150mW

Applications & Benefits

• cell_imaging: used as image storage devices in mobile information devices
• benefits: high reliability, low power consumption, ability to achieve much smaller camera modules

Supporting Organizations

• supported_by: TOSHIBA Corporate Manufacturing Engineering Center, Toshiba Chemical Co. Ltd., TOSHIBA Fukaya Works, Toshiba Digital Media Engineering Co. Ltd.

Manuscript Details

• publication_date: 29 May-1 June 2001

Relevancy Score

• score: 10
• missing_fields:
  • fill factor
  • quantum efficiency
  • readout speed
  • noise sources
  • analog-to-digital conversion techniques
  • microlenses
  • on-chip colour filters
  • global or rolling shutters
  • backside illumination

Processed JSON Filename

request_b7dbc809-6030-40fb-b1b8-fddb286a1eeb-flip_chip_interconnection_method_applied_to_small_camera_module.json